Claims
- 1. A method for manufacturing a cathode comprising a base metal and an electron-emitting layer of electron-emitting material formed on the base metal comprises the steps of:applying an electron-emitting material onto a base metal to form an electron-emitting layer; drying the electron-emitting layer; mechanically flattening an electron-emitting surface of the dried electron-emitting layer by compacting; and injecting a binder between the base metal and the electron-emitting layer, after flattening the electron-emitting surface.
- 2. The method according to claim 1, wherein the compacting comprises pressing the surface of the electron-emitting layer with a press die.
- 3. The method according to claim 1, wherein the electron-emitting surface is mechanically-flattened with a press die, and a surface roughness of the press die, determined as a maximum height Ry in JIS B 0601, is not more than 2 μm.
- 4. A method for manufacturing a cathode comprising a base metal and an electron-emitting layer of electron-emitting material formed on the base metal, comprising the steps of:applying an electron-emitting material onto a base metal to form an electron-emitting layer; drying the electron-emitting layer; and mechanically flattening an electron-emitting surface of the dried electron-emitting layer by compacting; wherein the electron-emitting surface is mechanically-flattened with a press die, and a surface roughness of the press die, determined as a maximum height Ry JIS B 0601, is not more than 2 μm.
- 5. The method according to claim 4, wherein the compacting comprises pressing the surface of the electron-emitting layer with a press die.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-279733 |
Sep 1997 |
JP |
|
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 09/157,726, filed Sep. 21, 1998 now U.S. Pat. No. 6,351,061.
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