This application claims priority based on International Patent Application No. PCT/FR03/00530, entitled “CATHODE STRUCTURE FOR EMISSIVE SCREEN” by Jean Dijon, Adeline Fournier and Brigitte Montmayeul, which claims priority of French Application No. 02/02075, filed on Feb. 19, 2002, and which was not published in English.
The invention relates to a cathode structure that can be used in a flat field emission screen.
A display device by cathode luminescence excited by field emission comprises a cathode or electron emitting structure and an anode facing it covered by a luminescent layer. The anode and the cathode are separated by a space in which a vacuum has been created.
The cathode is either a micro-tip based source, or a source based on an emissive layer with low threshold field. The emissive layer may be a carbon nanotube layer or other structures based on carbon or based on other materials or multi-layers (AlN, BN).
The cathode structure may be of the diode type or of the triode type. Document FR-A-2 593 953 (corresponding to U.S. Pat. No. 4,857,161) discloses a process for manufacturing a cathode luminescent display device excited by field emission. The cathode structure is of the triode type. The electron emitting material is deposited on an exposed conducting layer at the bottom of the holes formed in an insulation layer that supports an electron extraction grid.
It is here proposed a cathode structure with an emissive layer, of the triode type, for which the electrons emitted by the emissive layer are subjected to a weak lateral electric field, which minimises the risks of short circuits between the grid and the cathode and which limits divergence of the electron beam emitted by the emissive layer.
Therefore, the purpose of the invention is a triode type cathode structure comprising, in superposition, an electrode forming a cathode and supporting means made of an electron emitting material in the form of a layer, an electrical insulation layer and a grid electrode, an opening formed in the grid electrode and in the electrical insulation layer exposing the means made of an electron emitting material, the means made of an electron emitting material being located in the central part of the opening of the grid electrode, characterised in that the opening is in the form of a slit, the means made of an electron emitting material exposed by the slit being composed of at least two elements aligned along the longitudinal axis of the slit.
According to one advantageous embodiment, the opening formed in the grid electrode and in the electrical insulation layer is practically rectangular, and said elements made of an electron emitting material are also approximately rectangular.
According to another advantageous embodiment, a resistive layer is inserted between the electrode forming the cathode and the elements made of an electron emitting material.
Preferably, the elements made of an electron emitting material are separated from the grid electrode by a distance greater than the size of the objects from which the electron emitting material is made.
The electron emitting material may be composed of carbon nanotubes.
Advantageously, the elements made of an electron emitting material are separated from the grid electrode by a distance such that the parallel component of the electric field is at least ten times weaker than the perpendicular component of this field.
Another purpose of the invention is a flat field emission screen comprising several cathode structures like that defined above.
The invention will be better understood and other advantages and special features will become clearer after reading the following description, given as a non-limitative example with the appended drawings among which:
This slit geometry is better than the circular geometry. Due to symmetry, there is no lateral component of the electric field along the Z axis, therefore the emissive surface satisfying the condition EL<<Ex is more important in this geometry than in the cylindrical geometry. In a cylindrical geometry, the ratio between the emissive area and the hole area is equal to (d/L)2. In a rectangular geometry, this ratio is equal to d/L. Since d/L is less than 1, the ratio d/L is therefore always greater than (d/L)2 which results in a much brighter screen.
Another advantageous embodiment is the embodiment in which a resistive layer is added between the emissive layer and the cathode. In this case, the resistive layer protects the grid and the cathode from a short circuit. Moreover, this resistive layer is very favourable to operation of the screen as described in document EP-A-0 316 214 (corresponding to U.S. Pat. No. 4,940,916).
The fact that the emissive area is located over a narrow width at the centre of the slit or the groove, enables directive emission of electrons and provides a solution to resolution problems. This is due to the very low value of the parallel component of the electric field (EL/Ex<0.1) in the area in which the emissive elements are located.
The diagram in
Thus, problems inherent to structures according to the prior art are overcome. Grid-cathode short circuit problems are eliminated by central positioning and the small size of emissive elements compared with the dimension of the groove or the slit and possibly by the presence of a resistive layer. The electric field induced by the grid is uniform and only comprises very weak lateral components compared with the vertical component of the field.
A minimum value for the distance S separating the metallic grid layer from emissive elements can be found empirically (see
For 1 to 2 μm long nanotubes, the distance S may be of the order of 3 to 4 μm. These values are given for guidance and are not limitative. It can be checked that the lateral component of the electric field is very weak compared with the normal component for these dimensions.
The cathode conductor is obtained by depositing a conducting material, for example molybdenum, niobium, copper or ITO, onto a support 50 (see
Several deposits are then made as shown in
The metallic layer 55 and the insulation layer 51 are then etched simultaneously in a 15 μm wide slit or trench 52 until the resistive layer 56 is exposed. This is shown in
A catalytic deposition of iron, cobalt or nickel is then made on the structure. The catalytic deposit may advantageously be replaced by deposition of a growth multi-layer that may for example be a stack comprising TiN or TaN and a catalyst material such as Fe, Co, Ni or Pt. As shown in
The sacrificial layer is then eliminated using a “lift-off” technique that causes elimination of parts of the growth layer located on this sacrificial layer. Parts of the growth layer remain in the central part of the resistive layer 56. This enables growth of emissive layers 54.
The cathodic conductor is obtained by deposition of a conducting material, for example molybdenum, niobium, copper or ITO, on a support 150 (see
Several deposits are then made as shown in
After deposition of a sacrificial layer 157, the metallic layer 155 and the insulation layer 151 are then simultaneously etched with an opening 158 for each emissive element to be made, with dimensions equal to the dimensions of the emissive elements to be made and until the resistive layer 156 is exposed. Each opening 158 may be 6 μm wide and 15 μm long. This is shown in
Lateral etching of the insulation layer 151 is then done from the trench 158 to obtain the required slit 152. This is shown in
A lift-off operation is then performed on the sacrificial layer, which eliminates the part of the layer of catalyst material supported by the sacrificial layer. Parts of the growth layer remain on the central part of the resistive layer 156. This enables growth of emissive layers 154.
Number | Date | Country | Kind |
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02 02075 | Feb 2002 | FR | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/FR03/00530 | 2/18/2003 | WO | 00 | 3/15/2004 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO03/071571 | 8/28/2003 | WO | A |
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