The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.
The broken lines in the drawings illustrate environmental structure on the article and form no part of the claimed design.
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| Entry |
|---|
| JPS62190343 Japanese Laid-Open Utility Model Publication No. S62-190343, Dec. 3, 1987, NPL. |
| Gaiser Precision Bonding Tools “Thermosonic Capillaries”, pp. 28-40, located at http://www.coorstek.com/markets/semiconductors—equipment/bondingtools/cappillaries.php, catalog published 2006. NPL p. 36. |
| Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731. |
| Information about Related Patents and Patent Applications, see section 6 of the accompanying Information Disclosure Statement Letter, which concerns Related Patents and Patent Applications. |
| Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English translation). |
| Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English translation). |
| Search Report issued on Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English translation). |
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| Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038. |
| Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016. |
| Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016. |
| Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016. |
| Search Report issued on Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English Translation provided). |
| Decision of Grant issued on Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered. |
| Gaiser Precision Bonding Tools “Capillary Wire Bonding”, pp. 5-27, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006. |
| Gaiser Precision Bonding Tools “Thermosonic Capillaries”, pp. 28-40, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006. |
| Gaiser Precision Bonding Tools “Fine-Ptich Capillaries”, pp. 41-59, located at http://www.coorstek.com/markets/semiconductors—equipment/bonding-tools/capillaries.php, catalog published 2006. |
| Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867. |
| Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912. |
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| Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492. |
| Gaiser Tool Company “Single Point T.A.B.”, p. 109, catalog vol. 11, published 2000. |