The present invention relates to a ceramic heater with a shaft.
In transfer, exposure, a film deposition process such as CVD, washing, etching, and micromachining such as dicing, for a semiconductor wafer, a ceramic heater with a shaft for holding the wafer has been used so far. As shown in PTL 1, such a ceramic heater with a shaft is disclosed, which includes: a ceramic plate in which a resistance heating element is embedded; a hollow ceramic shaft provided on the surface on the opposite side of a wafer placement surface of the ceramic plate; and a heating element power supply rod housed in the inner space of the ceramic shaft. The heating element power supply rod is bonded to the resistance heating element from the surface on the opposite side of the wafer placement surface of the ceramic plate.
PTL 1: JP 2007-51317 A
In the ceramic plate of such a ceramic heater with a shaft, a section bonded to the ceramic shaft and the part other than the section have different radiation amounts. Specifically, the section bonded to the ceramic shaft has a larger thermal capacity than the part other than the section, thus tends to have a low temperature. Thus, when the resistance heating element is designed to achieve a uniform temperature of the whole ceramic plate at a predetermined set temperature (for example, 500° C.), and is used at a temperature (for example, 700° C.) higher than the set temperature, the section bonded to the ceramic shaft has a too much amount of heat generation, and becomes a high temperature, thus the temperature uniformity may not be maintained. On the other hand, when the resistance heating element is used at a temperature (for example, 300° C.) lower than the set temperature, the section bonded to the ceramic shaft has an insufficient amount of heat generation, and becomes a low temperature, thus the temperature uniformity may not be maintained. In addition, when the temperature of the ceramic plate rises or drops, the temperature uniformity may not be maintained.
The present invention has been devised to solve such a problem, and it is a main object to reduce the variation in temperature between the section bonded to the ceramic shaft and the part other than the section in the ceramic heater with a shaft.
The ceramic heater with a shaft of the present invention includes: a ceramic plate in which a resistance heating element is embedded; a hollow ceramic shaft having an upper end bonded to a surface on an opposite side of a wafer placement surface of the ceramic plate; and a shaft heater embedded in a side wall near the upper end of the ceramic shaft.
In the ceramic heater with a shaft, the shaft heater embedded in the side wall near the upper end of the ceramic shaft can be controlled independently of the resistance heating element embedded in the ceramic plate. Therefore, it is possible to reduce the variation in temperature between the section bonded to the ceramic shaft and the part other than the section.
In the ceramic heater with a shaft of the present invention, the ceramic shaft may have a cylindrical shaft body, and an insulating film that covers a side surface near the upper end of the shaft body. The shaft heater may be provided on the side surface near the upper end of the shaft body, and embedded in the ceramic shaft by being covered with the insulating film.
In the ceramic heater with a shaft of the present invention, it is preferable that the insulating film be an aerosol deposition (AD) film or a thermal spray film.
A preferred embodiment of the present invention will be described below with reference to the drawings.
As illustrated in
In the ceramic heater with a shaft of the present embodiment described above, the shaft heater embedded in the side wall near the upper end of the ceramic shaft can be controlled independently of the resistance heating element embedded in the ceramic plate. Therefore, it is possible to reduce the variation in temperature between the section bonded to the ceramic shaft and the part other than the section.
Note that at least one of an electrostatic electrode and an RF electrode may be embedded in the ceramic plate.
The present invention is not limited to the above-described embodiment, and can be carried out by various modes as long as they belong to the technical scope of the invention.
The present application claims priority from Japanese Patent Application No. 2019-122788, filed on Jul. 1, 2019, the entire contents of which are incorporated herein by reference.
Number | Date | Country | Kind |
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2019-122788 | Jul 2019 | JP | national |
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105556656 | May 2016 | CN |
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2008-527746 | Jul 2008 | JP |
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Entry |
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Korean Office Action (Application No. 10-2021-7038558) dated Jul. 4, 2023 (with English translation) (8 pages). |
International Search Report and Written Opinion (Application No. PCT/JP2020/022836) dated Aug. 18, 2020 (with English translation). |
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Chinese Office Action (with English translation) dated Feb. 2, 2024 (Application No. 202080047869.5). |
Number | Date | Country | |
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20220053611 A1 | Feb 2022 | US |
Number | Date | Country | |
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Parent | PCT/JP2020/022836 | Jun 2020 | WO |
Child | 17452805 | US |