This invention relates to electrical filters and, in particular, to a dielectric ceramic monoblock filter which incorporates a metallization pattern on the top surface thereof adapted and structured to provide an increase in a filter's power load handling capability.
Ceramic dielectric block filters offer several advantages over air-dielectric cavity filters. The blocks are relatively easy to manufacture, rugged, and relatively compact. In the basic ceramic block filter design, resonators are formed by cylindrical passages called through-holes which extend between opposed top and bottom surfaces of the block. The block is substantially plated with a conductive material (i.e., metallized) on all but one of its six (outer) sides and on the interior walls of the resonator through-holes.
The top surface is not fully metallized but instead bears a metallization pattern designed to couple input and output signals through the series of resonators. In some designs, the pattern may extend to the sides of the block, where input/output electrodes or pads are formed.
The reactive coupling between adjacent resonators is dictated, at least to some extent, by the physical dimensions of each resonator, by the orientation of each resonator with respect to the other resonators, and by aspects of the top surface metallization pattern.
Although such RF signal filters have received widespread commercial acceptance since the 1970s, efforts at improvement on this basic design have continued to the present.
For example, there continues to exist a need to increase power-handling capabilities of ceramic filters for higher power applications. Currently, increasing the ceramic body size and/or the top pattern gaps to their maximum is the primary method used to increase the power handling capability of monoblock filters. Increasing the gaps in some cases, however, reduces the electrical performance of the filter and creates manufacturing sensitivity issues. Moreover, and where size and space is a limitation, increasing the size of the ceramic body is not an option.
Therefore, the need continues for an improved RF monoblock filter which can offer improved and increased power handling capabilities without either an increase in the size of the filter or an increase in the size of the gaps in the top metallization pattern.
It is a feature of the invention to provide a ceramic monoblock filter comprising a block of dielectric material defined by top, bottom, and side surfaces wherein the side and bottom surfaces are substantially covered with a conductive material.
A plurality of spaced-apart resonators are defined by a plurality of spaced-apart resonator through-holes extending between the top and bottom surfaces of the block and surrounded on the top surface by conductive material defining conductive resonator plates. A pattern of conductive material on the top surface defines at least an input/output transmission line defined by a first elongate strip of conductive material extending on the top surface between, and spaced from, first and second ones of the plurality of resonators.
The pattern additionally defines a bar on the top surface defined by a second strip of conductive material. The bar extends above and is spaced from the resonator plates defining the first and second resonators. The bar is located generally opposite and spaced from a top edge of the input/output transmission line.
The pattern still further defines a ground plate defined by one or more additional strips of conductive material on the top surface. The ground plate is coupled to the conductive material covering the side surfaces and is located generally opposite and spaced from the bar.
In one embodiment, the ground plate and the bar include respective interdigitated extension strips of conductive material defining a load splitting capacitor between the bar and the ground plate. In one embodiment, the respective interdigitated spaced-apart extension strips are generally spiral-shaped.
The input/output transmission line and the bar may additionally define respective interdigitated spaced-apart extension strips of conductive material defining a load splitting capacitor between the bar and the input/output transmission line.
Additional load splitting capacitors may be defined by extending terminal end portions of the bar over respective portions of the first and second resonators.
There are other advantages and features of this invention, which will be more readily apparent from the following detailed description of preferred embodiments of the invention, the drawings, and the appended claims.
These and other features of the invention can best be understood by the following description and the accompanying FIGURES as follows:
While this invention is susceptible to embodiment in many different forms, this specification and the accompanying FIGURES disclose only one preferred form as an example of the invention. The invention is not intended to be limited to the embodiment so described, however. The scope of the invention is identified in the appended claims.
Filter 100 includes a block 110 (
The plating or material on block 110 is electrically conductive, preferably copper, silver or an alloy thereof. Such plating or material preferably covers all surfaces of the block 110 to define ground with the exception of top surface 112, the plating of which is described in some detail below.
In the embodiment of
Top surface 112 of block 110 defines opposed peripheral longitudinal edges 130 and 133, opposed peripheral side edges 115 (
Top surface 112 additionally defines at least four ground plates 131, 132, 134, and 135 as shown in
Ground plate or strip 131 is located on the top filter surface 112 and extends along a central portion of the peripheral lower edge of top surface 112 generally longitudinally between the input and output ports 114 and 118. Opposed terminal ends of plate 131 are spaced from the ports 114 and 118. Ground plate 132 is also located on the filter top surface 112 and extends generally longitudinally along the lower edge of top surface 112 generally between the edge 115 of side surface 120 and the output port 118. Plate 132 is spaced from the port 118. Ground plate 137 is located on the top filter surface 112 and extends along the lower edge of surface 112 generally between the edge 119 of opposed side surface 129 and the input port 114. Plate 137 is spaced from the port 114. Ground plate or strip 135 is located on the top surface 112 and extends the full length of the filter along the top longitudinal edge 133 of the filter 100.
Coupling between the transmission line resonators, provided by the plated through-holes 101-108, is accomplished at least in part through the dielectric material of block 110 and is varied by varying the width of the dielectric material and the distance between adjacent transmission line resonators. The width of the dielectric material between adjacent through-holes 101-108 can be adjusted in any suitable regular or irregular manner as is known in the art, such as, for example, by the use of slots, cylindrical holes, square or rectangular holes, or irregular-shaped holes.
The present invention is directed to the metallization pattern on the top surface 112 of filter 100 and, more specifically, the portion of the metallization pattern in the region of the input pad or port 114 which, as described in more detail below, is adapted to improve input capacitive coupling to ground which, in turn, increases the power load characteristics and abilities of the filter.
Referring to
As shown in
The top portion of input pad 114 extending between respective resonator plates 127 and 128 still further defines a central elongate groove 143 defining a fork having at least two tines 145 and 147 extending in a direction generally perpendicular to the upper top longitudinal filter edges 130 and 133. Groove 143 defines a region devoid of conductive material.
The metallization pattern on the input side of the filter 100 is still further defined by an elongate strip or bar 148 (
Bar 148 more specifically defines a central portion and respective opposed terminal end portions 150 and 152. The central portion is located and positioned generally opposite the ends of bar tines 145 and 147, and the respective end portions 150 and 152 extend and overlap at least about ¼ of the length of the respective resonator plates 127 and 128 in a generally spaced-apart and parallel relationship thereto. Bar 148 is spaced from the top of the plates 127 and 128.
Resonator plate 127 additionally defines a strip or finger or extension 154 of metallized conductive material protruding generally perpendicularly outwardly and upwardly from the top longitudinal edge thereof in a generally transverse relationship to the bar 148 and spaced from the terminal end portion 150 of bar 148. The resonator plate 128 in turn defines an upper shoulder 156 which is spaced from the opposed terminal end portion 152 of bar 148.
Bar 148 still further defines a generally centrally located elongate first extension or strip or finger 157 of metallized conductive material extending generally perpendicularly outwardly and downwardly from a lower edge of the bar 148. Extension 157 is interdigitated into (i.e., protrudes into) the elongate groove 143 defined in the top portion of input pad 114. Extension 157 is spaced from the conductive material defining input pad 114.
Bar 148 still further defines a pair of second and third elongate metallization extensions/strips/fingers 158 and 160 protruding and extending generally perpendicularly upwardly and outwardly from a top longitudinal edge of each of the respective bar terminal end portions 150 and 152. Bar extensions 158 and 160 are oriented and located relative to each other in a spaced-apart, parallel relationship. A pair of further metallization extensions/strips/fingers 162 and 164 protrude generally normally inwardly from the opposed respective inner edges of bar extensions 158 and 160. Extensions 162 and 164 define bent, curved, or spiral-shaped fingers.
Bar 148 still further defines a plurality of grooves 166, 168, and 170 protruding into the top edge thereof and extending along the length thereof in a generally spaced-apart and parallel relationship. Grooves 166, 168, and 170 define regions devoid of conductive material.
The metallization pattern in accordance with the present invention still further comprises a grounded plate extension 172 (
The grounded plate extension 172 is located generally opposite and spaced from the bar 148. In the embodiment of
In accordance with the present invention, grounded plate extension 172 and, more specifically, strips 174 and 178 thereof, are spaced and split from the bar 148.
Grounded plate extension 172 is still further defined by a pair of strips, extensions, or fingers of metallized material extending downwardly and inwardly from opposed terminal end portions of the strip 174 and defining respective curved or spiral-shaped terminal fingers 180 and 182 which, in the embodiment shown, are similar in shape and configuration to, but mirror images of, the fingers 162 and 164 defined on bar 148.
Spiral-shaped fingers 162 and 164 and fingers 180 and 182 are respectively meshed/interwoven/interconnected/interdigitated together in a spaced-apart relationship and are separated and surrounded by regions devoid of conductive material so as to define an indirect capacitive coupling between the bar 148 and ground plate 135 as described in more detail below.
In the embodiment of
Top surface 112 defines an additional strip 202 of conductive material extending normally inwardly from the top ground plate 135. Strip 202 is located between and spaced from bar extension 160 on one side and the left side edge of resonator plate 128 on the other side. Strip 202 and bar extension 160 are disposed relative to each in a parallel relationship.
By way of background, it is known that the power handling of filters is directly related to the component with the greatest increase in stored energy. In ceramic monoblock filters, the circuit pattern incorporated onto the ceramic block forms capacitors to ground and capacitors between resonators. The capacitors with the most stored energy are the components with the greatest likelihood of arcing from high power. The input pad metallization pattern of the present invention increases the power handling of ceramic monoblock filters by modifying the components with the greatest chance of arcing. This is done by splitting the stored energy among two or more series connected capacitors.
Illustration A below shows a 1 Farad capacitor with 1 volt applied. In this example, the stored energy “E” is equal to the ½ CV2 where C corresponds to capacitance and V corresponds to voltage. This calculates to (½)*(1F)*(1V)=½ Joule. If the circuit of Illustration A is changed to the equivalent electrical circuit shown in Illustration B, the arcing potential is reduced.
In Illustration B below, the total stored energy in the circuit is still ½ Joule. However, the stored energy in each of the capacitors (C1 and C2) is equal to ½ C1 *V12=½ C2*V22 where C1 and C2 corresponds to capacitance and V1 and V2 corresponds to voltage. This calculates to (½)*(2F)*(½)2=¼ Joule. Each capacitor now has ½ the stored energy of the Illustration A capacitor. Note that the stored energy is related to the squared voltage (V2). In electromagnetic theory, the electric field strength is directly related to the voltage. Arcing occurs when the electric field strength increases such that the breakdown voltage of air (29000V/cm) is exceeded, creating a conductive path between the two metallic plates of the capacitor. The breakdown of air has units of volts-per-centimeter which, of course, means that the spacing of the capacitive plates is an important variable in arcing. As the capacitive plates are moved closer together, the probability of arcing increases.
The Illustration B capacitive values are greater than the Illustration A capacitor value. The larger the capacitive value, the closer the metallic plates have to be located. This decreases the power handling. However, where space permits on the monoblock filter, the plate's surface area can be increased to maintain the desired capacitive value and still keep the wider plate spacing. The wide plate spacing in combination with the lower capacitive stored energy can increase the power handling of a filter.
In accordance with the present invention and referring to
Filter 300 shown in
The plating or material on block 310 is electrically conductive, preferably copper, silver or an alloy thereof. Such plating or material preferably covers all surfaces of the block 310 to define ground with the exception of top surface 312, the plating of which is described in some detail below.
The block 310 includes eight (8) through-holes including through-holes 307 and 308, each extending from the top surface 312 to the bottom surface (not shown). The interior walls defining each of the through-holes including through-holes 307 and 308 are likewise plated with an electrically conductive material and serve the same purpose as the through-holes 101-108 of filter 100.
Top surface 312 of block 310 defines respective RF signal input-output (I/O) transmission lines/pads/plates including specifically an input electrode/port/line 314. Also included on the top surface 312 are a plurality of conductive resonator plates that surround the respective through-holes. Plates 327 and 328 surround the through-holes 307 and 308 and in combination define respective resonators. Each of the plates, including the plates 327 and 328, are separated by regions devoid of conductive material. Top surface 312 additionally defines at least three ground plates 331, 335, and 337 similar in placement and purpose to the ground plates 131, 135, and 137 on the top surface 112 of filter 100.
Input transmission port or pad or line 314 is defined by an elongate strip of metallized/conductive material 334 which bridges the top and side surfaces 312 and 317 respectively and extends on the top surface 312 generally between and spaced from the metallized resonator plates 327 and 328. The input pad 314 additionally defines a strip of metallized material defining a finger 338 extending generally normally outwardly from one of the sides of the input pad 314. Finger 338 is interdigitated into (i.e., protrudes into) a groove 344 defined in the resonator plate 327. Groove 344 defines a region devoid of metallized material and finger 338 is spaced from the metallized material defining the plate 327.
The top portion of input pad 314 still further defines a central elongate groove 343 devoid of conductive material and defining a fork having at least two tines 345 and 347.
The top surface 312 of filter 300 also includes a ground plate extension 372 of metallized material which extends unitarily outwardly from the ground plate 335, is located generally opposite and spaced from the input transmission pad 314, and is defined by respective strips of metallized material 374 and 376. Strip 376 is a unitary, integral extension of the strip 335. Strip 374 extends downwardly from the strip 376 between the resonator plates 327 and 328 and into the groove 343 in the input pad 314.
The metallization pattern in accordance with the present invention, however, affords the advantage of facilitating the distribution of the power load over the full length of the bar 148, thus increasing the amount of power load which the filter can handle.
Specifically, and still with reference to
In accordance with a preferred embodiment of the metallization pattern of the present invention, the distance, generally designated X in
Numerous variations and modifications of the embodiment described above may be effected without departing from the spirit and scope of the novel features of the invention. No limitations with respect to the specific module illustrated herein are intended or should be inferred.
This application claims the benefit of the filing date of U.S. Provisional Application Ser. No. 60/934,863 filed on Jun. 15, 2007, which is explicitly incorporated herein by reference as are all references cited therein.
Number | Name | Date | Kind |
---|---|---|---|
4431977 | Sokola et al. | Feb 1984 | A |
4896124 | Schwent | Jan 1990 | A |
6462629 | Blair et al. | Oct 2002 | B1 |
6498543 | Kim et al. | Dec 2002 | B2 |
6559735 | Hoang et al. | May 2003 | B1 |
6570467 | Walker et al. | May 2003 | B2 |
6650202 | Rogozine et al. | Nov 2003 | B2 |
6724279 | Kitajima et al. | Apr 2004 | B1 |
6809612 | Bloom et al. | Oct 2004 | B2 |
6828883 | Kitajima et al. | Dec 2004 | B1 |
20020070820 | Walker et al. | Jun 2002 | A1 |
20060261913 | Ye | Nov 2006 | A1 |
20060267712 | Morga | Nov 2006 | A1 |
Number | Date | Country |
---|---|---|
WO 0152344 | Jul 2001 | WO |
Number | Date | Country | |
---|---|---|---|
20080309434 A1 | Dec 2008 | US |
Number | Date | Country | |
---|---|---|---|
60934863 | Jun 2007 | US |