The present disclosure relates in general to an antenna, and, in particular, to a ceramic-substrate, ultra-wideband (UWB) antenna.
The FCC has defined UWB as an antenna transmission for which emitted signal bandwidth exceeds the lesser of 500 MHz or 20% of the arithmetic center frequency and has authorized the unlicensed use of UWB in the frequency range from 3.1 to 10.6 GHz. In EU applications, a sub-band from 6 GHz to 8.5 GHz, is authorized. Unlike current and historical narrow band communications systems such as Cellular, Wi-Fi and GNSS, UWB communications systems can address emerging market needs and offer a host of possibilities for new products and systems.
Existing localization technologies such as Assisted GPS for Indoors, Wi-Fi and Cellular fingerprinting are at best able to offer meter precision, while UWB enables centimeter level localization precision for indoor and outdoor localization as well as very high transmission speed. This technology potential comes from the ultra-wide frequency bandwidth which means that the radiated pulses can be of duration less than 1 millisecond.
Potential applications for UWB technologies include smart home and entertainment systems that can take advantage of high data rates for streaming high quality audio and video content in real time, localization applications in healthcare and safety for seniors and infants, or even precise non-invasive and non-ionizing imaging for cancer detection. Other applications may include precise asset localization and identification for security, such as wireless keyless cars and premise entry systems. These and other applications dictate new approaches to communications systems design, opening possibilities for novel, advanced antenna design and implementation.
What is needed is a new generation of UWB antennas with designs that take advantage of, for example, surface-mount technology (SMT) for ready integration into current-generation and next-generation electronic devices. Additional benefits may be realized if such antennas have small form factors that facilitate installation and address diminishing package requirements.
Disclosed are devices, systems and methods for UWB antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Disclosed antennas can use a dielectric ceramic-substrate. Numerous configurations and geometries are disclosed for radiators, feed lines, and connection pad elements which can be selected for each antenna. Selection from a plurality of geometries ensures that the resulting antenna design is configurable to address specific performance, application and packaging requirements as well as to optimize performance of the antenna across portions of the UWB spectrum.
The disclosed UWB antennas comprise a small form factor dielectric ceramic element with a radiator, feed areas, connection pads and metallic elements and are mountable on a substrate with a ground plate, a feed line, a coaxial RF connector and metallic elements for connection to external devices, electronics, and/or systems via SMT solder joints.
An aspect of the disclosure is directed to ultra-wideband antennas. Suitable ultra-wideband antennas comprise: a dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface; a radiator positioned on at least a portion of the first surface of the dielectric substrate; a feed positioned on the second surface of the dielectric substrate; and a feed positioned on a third surface of the dielectric substrate perpendicular to the second surface of the dielectric substrate. In at least some configurations, the dielectric substrate can be a ceramic dielectric substrate. Additionally, the ultra-wideband antennas are configurable to operate within a range of frequencies from 3.1 GHz to 10 GHz. The first surface of the dielectric substrate can have a two-dimensional shape selected from, for example, square, rectangular, parallelogram, oval, and round. The first surface of the dielectric substrate can be at least one of planar and substantially planar. Additionally, the feed can be centered on the third surface of the dielectric substrate and occupies an entire substrate thickness and less than one-third of the substrate width or substrate length. The feed can also have a shape selected from, for example, circular, semi-circular, triangular, trapezoidal, square and rectangular. The radiator can have a shape selected from, for example, square, rectangular, semi-circular, circular, trapezoidal, and triangular. In some configurations the radiator has an irregular shape, such as a shape formed from a combination of two or more of square, rectangular, semi-circular, trapezoidal, and triangular. The feed area can be centered on the bottom surface of the dielectric substrate along a length and adjacent to an edge shared with one of the third surface, the fourth surface, the fifth surface, and the sixth surface. In some configurations, the antenna is positioned on a substrate in electrical communication with a feed line. The feed line can be in electrical communication with a connector. A first connection pad and a second connection pad positioned on the second surface of the dielectric substrate can be provided wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad. Additionally, a third connection pad positioned on the second surface of the dielectric substrate can also be provided.
Another aspect of the disclosure is directed to ultra-wideband antenna systems. The ultra-wideband antenna systems can comprise: an ultra-wideband antenna comprising a dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, a radiator positioned on at least a portion of the first surface of the dielectric substrate, a feed positioned on the second surface of the dielectric substrate, and a feed positioned on a third surface of the dielectric substrate perpendicular to the second surface of the dielectric substrate; and a ground plane having a feed line in electrical communication with the ultra-wideband antenna. Additionally, one or more ground plane fingers can be provided. In some configurations a coaxial RF connector is also provided. The feed line can also be configurable to terminate on the ground plane within a perimeter of the feed of the antenna. Two metallic elements positioned either side of the feed line on the ground plane separated by gaps can be provided which form a coplanar waveguide. The antennas are configurable to transmit a large amount of digital data over a wide spectrum of frequency bands spanning more than 500 MHz at a low power for short distances. Additionally, the antennas can cover UWB band 1 through UWB band 10 simultaneously. The ultra-wideband antenna is further configurable to include a first connection pad and a second connection pad positioned on the second surface of the dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad. A third connection pad positioned on the second surface of the dielectric substrate can also be provided.
Still another aspect of the disclosure is directed to methods of using ultra-wideband antennas comprising the steps of: providing an ultra-wideband antenna comprising a dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, a radiator positioned on at least a portion of the first surface of the dielectric substrate, a feed positioned on the second surface of the dielectric substrate, and a feed positioned on a third surface of the dielectric substrate perpendicular to the second surface of the dielectric substrate; operating the ultra-wideband antenna at radio-frequency communications from 3.1 GHz to 10 GHz. The methods can also include one or more of operating the ultra-wideband antenna at a peak gain of 4 dBi, operating the ultra-wideband antenna at an efficiency of more than 60% across UWB band 1 through UWB band 10, and operating the ultra-wideband antenna at an efficiency of more than 60% across UWB band 1 through UWB band 10 occurs simultaneously. Additionally, the ultra-wide antennas of the method can further comprise a first connection pad and a second connection pad positioned on the second surface of the dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad.
Yet another aspect of the disclosure is directed to ultra-wideband antenna kits. Suitable kits comprise: one or more ultra-wideband antennas comprising a dielectric substrate having a substrate length, a substrate width and a substrate thickness, a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, a radiator positioned on at least a portion of the first surface of the dielectric substrate, a feed positioned on the second surface of the dielectric substrate, and a feed positioned on a third surface of the dielectric substrate perpendicular to the second surface of the dielectric substrate; and one or more of each of a ground plane, a PCB, a connector, and a cable. The ultra-wide antennas of the kits can further comprise a first connection pad and a second connection pad positioned on the second surface of the dielectric substrate wherein the first connection pad is positioned adjacent a first side of the feed and the second connection pad is positioned adjacent a second side of the feed opposite the first connection pad. Additionally, the ultra-wide antennas of the kits can further comprise a third connection pad positioned on the second surface of the dielectric substrate.
All publications, patents, and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated by reference. See, for example:
The novel features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings of which:
Disclosed are a series of antennas and antenna systems which are suitable for UWB radio-frequency communications from 3.1 GHz to 10 GHz. The antennas and antenna systems achieve a small form factor and are configurable to utilize surface-mount technology (SMT) to facilitate integration and connection to external devices and electronics. Additionally, the antennas and antenna systems are configurable to utilize a dielectric ceramic-substrate.
Turning to
The antenna 100 comprises a dielectric-ceramic substrate 112, and a number of areas within which lie metallic elements including: a generic radiator 120, a generic side feed area 122, a generic bottom feed area (not visible in
The top surface 114 of the antenna can be rectangular-shaped or square-shaped and planar or substantially planar. The generic radiator 120 can be positioned on or within the top surface 114 of the antenna 100. Visible in
Centered on the first side surface 116 of the antenna 100 and occupying the entire thickness t and approximately one-quarter to one-third of the width S1 is generic side feed area 122. In various embodiments of the disclosure, a metallic element lying within the perimeter of generic side feed area 122 completes the connection between a feed line 106 on the ground plane 102 and the generic radiator 120 on the top surface 114 of the antenna 100. The feed line 106 lies on ground plane 102 and extends from a part beneath the first side surface 116 of the antenna 100 in a perpendicular direction from the first side surface 116. The feed line 106 provides a connection from the antenna 100 to external electronics or devices. Lying on either side of feed line 106 on ground plane 102 and separated by first ground plane gap 105, and second ground plane gap 105′ are metal elements which together form a coplanar waveguide 104.
Optionally, extending from the coplanar waveguide 104, and positioned on the ground plane 102 on either side of antenna 100 separated by a first ground plane finger gap 109 is an area forming a first generic ground plane finger 108 which is adjacent a third ground plane side 134. One or more ground plane fingers can be used without departing from the scope of the disclosure. An area forming a second generic ground plane finger 110 is positioned adjacent a first ground plane side 130 and separated by second ground plane finger gap 111 from the antenna 100. As viewed in
The antenna 100 viewed from a bottom surface 115 can have many different embodiments of the number and position of connection pads, two of the generic configurations are illustrated in
As will be appreciated by those skilled in the art, the various components illustrated in
Turning now to
In the corner of the bottom surface 215, sharing an edge with the first side surface 216 and the fourth side surface 218 of antenna 100 in
Also on the bottom surface of antenna 100 is the third connection pad 250. The third connection pad 250 lies along the opposite edge of bottom surface 215 shared by the bottom feed area 262, first connection pad 260 and second connection pad 264. The third connection pad 250 extends along the entire length of antenna 100 in at least one direction along the third side surface 216′, e.g. from a first edge to an opposite edge. Thus, the third connection pad 250 has a long side length equal to width S1 shown in
Numerous radiator geometries are possible and may be employed depending upon the desired performance characteristics of the antenna 100 disclosed herein. Turning to
As will be appreciated by those skilled in the art, although the surface of
The first radiator configuration depicted in
The second radiator configuration illustrated in
The third radiator configuration illustrated in
Similar to the third radiator configuration in
The fifth radiator configuration in
The sixth radiator configuration depicted in
The seventh radiator configuration in
Similar in form to the seventh radiator configuration in
Comparable to the eighth radiator configuration of
As with radiator geometries, numerous side feed geometries are possible.
As with radiator and side feed geometries, numerous bottom feed and connection pad geometries are also possible.
Turning to
In the corner formed by first bottom edge 404 and second bottom edge 506, resides a configuration of a first connection pad 514. The first connection pad 514 is rectangular with one side coincident with first bottom edge 404 and an adjacent side coincident with second bottom edge 506. The length of the side of the rectangle of the first connection pad 514 that is coincident with first bottom edge 404 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the first connection pad 514 that is coincident with second bottom edge 506 and that of its opposite side is substantially less than length S2.
In the corner formed by first bottom edge 404 and fourth bottom edge 510, resides a configuration of a second connection pad 516. The second connection pad 516 is rectangular with one side coincident with first bottom edge 404 and an adjacent side coincident with fourth bottom edge 510. The width of the side of the rectangle of the second connection pad 516 that is coincident with first bottom edge 404 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the second connection pad 516 that is coincident with fourth bottom edge 510 and that of its opposite side is substantially less than length S2. A configuration of a third connection pad 518 located on the first bottom surface configuration 502 is rectangular in shape, coincident with third bottom edge 508 and runs the entire length of third bottom edge 508. The length of the sides of the rectangle of the third connection pad 518 that are coincident with second bottom edge 506 and fourth bottom edge 510 is substantially less than length S2. The width along the third bottom edge 508 can be the same as the substrate, as illustrated.
The second bottom surface configuration 504 shown in
In the corner formed by the second bottom edge 506 and third bottom edge 508, resides a configuration of a sixth connection pad 526. The sixth connection pad 526 is rectangular with one side coincident with second bottom edge 506 and an adjacent side coincident with third bottom edge 508. The length of the side of the rectangle of the sixth connection pad 526 that is coincident with second bottom edge 506 and that of its opposite side is substantially less than length S2. The length of the side of the rectangle of the sixth connection pad 526 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1.
Centered along third bottom edge 508, is a configuration of a seventh connection pad 528 is rectangular with one side coincident with third bottom edge 508. The width of the side of the rectangle of the seventh connection pad 528 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1. The length of the sides of the rectangle of the seventh connection pad 528 parallel to second bottom edge 506 is substantially less than length S2.
In a corner formed by third bottom edge 508 and fourth bottom edge 510, resides a configuration of an eighth connection pad 530. The eighth connection pad 530 is rectangular with one side coincident with third bottom edge 508 and an adjacent side coincident with fourth bottom edge 510. The width of the side of the rectangle of the eighth connection pad 530 that is coincident with third bottom edge 508 and that of its opposite side is substantially less than width S1. The length of the side of the rectangle of the eighth connection pad 530 that is coincident with fourth bottom edge 510 and that of its opposite side is substantially less than length S2. As will be appreciated by those skilled in the art, the various embodiments illustrated in
One specific embodiment of a suitable UWB ceramic antenna according to the disclosure is shown in
Turning to
The antennas of this disclosure are passive devices that do not consume power. The antennas operate for short distances when transmitting large amount of digital data over a wide spectrum of frequency bands typically spanning more than 500 MHz. One such antenna covers all common UWB commercial bands, namely bands 1 through 10 simultaneously. The antenna typically has a peak gain of 4 dBi, an efficiency of more than 60% across the bands and is designed to be mounted directly onto a substrate such as a PCB. The antennas are typically mounted at least 3 mm from metal components or surfaces, and ideally 5 mm for optimal radiation efficiency. Placing two antennas of the disclosure at a far-field distance of from about 0.1 m to about 0.4 m, more preferably 0.3 m, and keeping one of the antennas stationary, while the other antenna is rotating in 45° intervals shows group delay variation smaller than 100 ps (as a benchmark) from 3 GHz to 5 GHz and from 6.4 GHz to 9 GHz spanning UWB channels 1-4 and 6-15. For channel 5 (6-7 GHz) the group delay variation is between 220 ps (at edge) and 50 ps, which is still acceptable. The length of ground plane can be taken into consideration when choosing a PCB size. Increase in the ground plane length in both lower band (3-5 GHz) and higher band (6-9 GHz) influences efficiency of the antenna.
Antennas according to the disclosure can be provided in kits which include one or more antennas, one or more PCBs, one or more connectors, and one or more cables.
While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.
This application claims the benefit of U.S. Provisional Patent Application No. 62/540,155, filed Aug. 2, 2017, entitled CERAMIC SMT CHIP ANTENNAS FOR UWB OPERATION AND METHODS, which application is incorporated herein by reference in its entirety.
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Number | Date | Country | |
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20190044231 A1 | Feb 2019 | US |
Number | Date | Country | |
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62540155 | Aug 2017 | US |