Claims
- 1. A process for preparing a substrate adapted for use in magnetic data storage components, the process comprising:
- providing a non-oxide ceramic base substrate having a density of at least about 90 percent of theoretical density and a coefficient of thermal expansion of from about 2 to about 7 ppm/.degree.C.;
- coating at least one surface of the base substrate with a smoothing layer comprised of an amorphous, non-stoichiometric silicon carbide corresponding to the formula SiC.sub.x wherein x is the molar ratio of carbon to silicon and is greater than 1; and
- polishing the smoothing layer to a surface roughness of less than about 100 .ANG. Ra.
- 2. The process of claim 1 wherein x is from about 1.1 to less than about 1.45.
- 3. The process of claim 1 wherein the smoothing layer has a surface roughness of less than about 25 .ANG. Ra.
- 4. The process of claim 1 wherein the smoothing layer has a thickness of from about 1 to about 50 .mu.m.
- 5. The process of claim 1 wherein the non-oxide ceramic is selected from the group consisting of silicon carbide, silicon, silicon nitride, boron carbide, titanium diboride, aluminum nitride, and mixtures thereof.
- 6. The process of claim 1 wherein the non-oxide ceramic is a material densified to at least about 96% of theoretical density.
- 7. The process of claim 1 wherein the smoothing layer is coated onto the base substrate by DC magnetron sputtering.
- 8. The process of claim 1 further comprising coating the smoothing layer with a magnetic layer comprised of metals selected from the group consisting of cobalt, iron, chromium, platinum, nickel, tantalum, boron, and mixtures thereof.
- 9. The process of claim 8 wherein the magnetic layer is formed by DC magnetron sputtering.
- 10. The process of claim 1 further comprising forming metal transducer coils on the base substrate prior to coating the base substrate with the amorphous, non-stoichiometric silicon carbide.
Parent Case Info
This is a Ser. No. 08/536,716 filed on Sep. 29, 1995 now U.S. Pat. No. 5,616,426, which is a divisional application of U.S. Ser. No. 288,386 filed Aug. 10, 1994, now U.S. Pat. No. 5 480,695.
US Referenced Citations (30)
Foreign Referenced Citations (4)
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Entry |
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Divisions (2)
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Number |
Date |
Country |
Parent |
536716 |
Sep 1995 |
|
Parent |
288386 |
Aug 1994 |
|