The disclosure generally relates to a charge pump device, and more particularly relates to a method and a charge pump device that may improve the charge pump efficiency and capability.
A charge pump device is used to generate a pump voltage that has a higher voltage level than a power supply voltage. The charge pump device may include a plurality of capacitors that may include P-N junctions. The P-N junctions may cause parasitic capacitance that reduces efficiency and capability of the charge pump device. In addition, the conventional charge pump device is designed to generate either a positive pump voltage or a negative pump voltage. Accordingly, an electronic device that requires the positive pump voltage and the negative pump voltage must include several charge pump devices, resulting in high manufacturing cost.
As a demand for a high-performance charge pump device has grown recently, there has grown a need for a creative design of the charge pump capacitor and a charge pump device that may improve the charge pump efficiency and capability.
Nothing herein should be construed as an admission of knowledge in the prior art of any portion of the present disclosure.
A charge pump device and a method for providing a negative pump voltage or a positive pump voltage using the charge pump device are introduced herein.
In some embodiments, the charge pump device may include a plurality of pump capacitors, a first switch and second switch. The plurality of pump capacitors are configured to generate a negative pump voltage or a positive pump voltage. The first switch is coupled between the first power supply line and a first pump capacitor among the plurality of pump capacitors, and is configured to electrically connect the first pump capacitor to the first power supply line to generate the positive pump voltage. The second switch is coupled between the second power supply line and a second pump capacitor among the plurality of pump capacitors, and is configured to electrically connect the second pump capacitor to the second power supply line to generate the negative pump voltage.
In some embodiments, a method of providing a negative pump voltage or a positive pump voltage includes steps of electrically connecting the plurality of pump capacitors in series to generate the positive pump voltage or the negative pump voltage; switching on a first switch to electrically connect a first power supply line to a first pump capacitor among the plurality of pump capacitors to generate the positive pump voltage when the charge pump device is configured to generate the positive pump voltage; and switching on a second switch to electrically connect a second power supply line to a second pump capacitor among the plurality of capacitors to generate the negative pump voltage when the charge pump device is configured to generate the negative pump voltage.
To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
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Each of the pump capacitors C1 through C6 has a first terminal and a second terminal, in which the first terminals of the pump capacitors C1 through C6 are coupled to the power supply line PL1 via the switches SW11 through SW16 and the second terminals of the pump capacitors C1 through C6 are coupled to the power supply line PL2 via the switches SW21 through SW26. The power supply line PL1 may receive the power supply voltage VCC and the power supply line PL2 may receive the power supply voltage GND. The switches SW11 through SW16 are configured to control electrical connections between the first terminals of the pump capacitors C1 through C6 and the power supply line PL1. The switches SW21 through SW26 are configured to control electrical connections between the second terminals of the pump capacitors C1 through C6 and the power supply line PL2. In some embodiment, the switches SW11 through SW16, switches SW21 through SW26 and the switches SW31 through SW35 are controlled by switching signals (not shown).
In some embodiments, the charge pump device 100a further includes switches SW_P and SW_N. The switch SW_P is coupled between the second terminal of the pump capacitor C6 and the power supply line PL1, and is configured to control an electrical connection between the second terminal of the pump capacitor C6 and the power supply line PL1. The switch SW_N is coupled between the first terminal of the pump C1 and the power supply line PL2, and is configured to control an electrical connection between the first terminal of the pump C1 and the power supply line PL2. In some embodiments, the charge pump device 100a further includes output terminals OUT1 and OUT2, in which the output terminal OUT1 is coupled to the first terminal of the pump capacitor C1 and the output terminal OUT2 is coupled to the second terminal of the pump capacitor C6. The output terminal OUT1 is configured to output a positive pump voltage, and the output terminal OUT2 is configured to output a negative pump voltage. The voltage levels of the positive pump voltage and the negative pump voltage are greater than the voltage level of the power supply voltage VCC. In some embodiments, the charge pump device 100a may generate the positive pump voltage or the negative pump voltage based on the switching of the switches SW_N and SW_P. For example, the charge pump device 100a may generate and output the positive pump voltage to the output terminal OUT1 when the switch SW_P is switched on and the switch SW_N is switched off. The charge pump device 100a may generate and output the negative pump voltage to the output terminal OUT2 when the switch SW_P is switched off and the switch SW_N is switched on. In other words, the same charge pump device 100a may be used to generate the positive pump voltage in the output terminal OUT1 or the negative pump voltage in the output terminal OUT2. As a result, the functionality and the flexibility of the charge pump device 100 are improved.
In some embodiments, the charge pump device 100a may include a first stage and a second stage, in which the pump capacitors C1 through C6 are charged in the first stage and the pump capacitors C1 through C6 are configured to generate the negative pump voltage or the positive pump voltage in the second stage.
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In some embodiments, the p-type well 201 includes p-type doped regions 2011 and 2013 that are coupled to terminals T2 and T3, and the gate layer 202 may be coupled to a terminal T1. The terminals T1 and T3 may be referred to as the low-side terminal and the high-side terminal of the pump capacitor Cx, respectively. In some embodiments, the pump capacitor Cx is a metal-oxide-semiconductor (MOS) transistor that has a structure of a MOS transistor. The MOS structure may include a gate that is coupled to the terminal T1, a drain that is coupled to the terminal T2 and a source that is coupled to the terminal T3.
In some embodiments, the p-type substrate 205 may capacitively couple to the n-type deep well 203, in which a parasitic capacitor PC1 is existed as a result of the P-N junction between the p-type substrate 205 and the n-type deep well 203. The n-type deep well 203 may capacitively couple to the p-type well 201, in which a parasitic capacitor PC2 is existed as a result of the P-N junction between the n-type deep well 203 and the p-type well 201. The parasitic capacitance of the parasitic capacitors PC1 and PC2 may degrade the pump efficiency of the pump capacitor Cx.
In some embodiments, the p-type substrate 205 of the pump capacitor Cx is biased by a reference voltage (e.g., GND) and the n-type deep well 203 is floated. As the n-type deep well 203 is floated, the parasitic capacitor PC1 is coupled to the parasitic capacitor PC2 in series, thereby reducing the equivalent parasitic capacitance of the parasitic capacitors PC1 and PC2. The reduction of the equivalent parasitic capacitance of the parasitic capacitors PC1 and PC2 improves the pump efficiency of the pump capacitor Cx. In other words, by floating the n-type deep well 203, the pump efficiency of the pump capacitor Cx is improved.
In addition, the p-type substrate 205, the n-type deep well 203 and the p-type well 201 may form a PNP transistor (e.g., a bipolar transistor) having a base which is the n-type deep well 203, a collector and an emitter which are the p-type well 201 and the p-type substrate 205. When the n-type deep well 203 is floated, the breakdown voltage (e.g., voltage BVCEO) between the collector and the emitter is relatively high in both of the forward and reverse directions. As such, high voltages may be applied to the p-type well 201 of the pump capacitor Cx in both forward or reverse directions without breaking down the pump capacitor Cx. In other words, a high positive voltage or a high negative voltage may be applied to the p-type well 201 of the pump capacitor Cx. Since both of the high positive voltage and the high negative voltage may be applied to the p-type well 201 of the pump capacitor Cx, the pump capacitor Cx may be used in a charge pump device to generate the positive pump voltage or the negative pump voltage.
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The n-type substrate 305a, the p-type deep well 303a and the n-type well 301a may form a NPN transistor (e.g., a bipolar transistor) having a base which is the p-type deep well 303a, a collector and an emitter which are n-type substrate 305a and n-type well 301a. In some embodiments, the p-type deep well 303a is floated. When the p-type deep well 303a is floated, the breakdown voltage (e.g., voltage BVCEO) between the collector and the emitter is relatively high in both of the forward and reverse directions.
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The p-type substrate 305c, the n-type deep well 303c and the p-type well 301c may form a PNP transistor having a base which is the n-type deep well 303c, a collector and an emitter which are p-type substrate 305c and p-type well 301c. In some embodiments, the n-type deep well 303c is floated. When the n-type deep well 303c is floated, the breakdown voltage (e.g., voltage BVCEO) between the collector and the emitter is relatively high in both of the forward and reverse directions.
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In summary, a charge pump device including a plurality of pump capacitors and a method for generating a positive pump voltage or a negative pump voltage are introduced. Each of the pump capacitors may include a substrate of a first semiconductor type, a deep well of a second semiconductor type and a well of the first conductor type. The deep well of the pump capacitors is floated, thereby reducing the equivalent parasitic capacitance among the substrate, the deep well and the well of the pump capacitors and enhancing the pump capability of the pump capacitors. In addition, a high positive voltage or a high negative voltage may be applied to the well of the pump capacitors, thus allowing the same charge pump device to generate the positive pump voltage or the negative pump voltage. As a result, the flexibility of the charge pump device is improved, and the manufacturing cost of electronic devices, specifically the electronic devices that requires positive pump voltage and negative pump voltage, is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.