CHARGING SYSTEM AND METHOD OF CONTROLLING CHARGING SYSTEM

Information

  • Patent Application
  • 20250205755
  • Publication Number
    20250205755
  • Date Filed
    December 26, 2023
    2 years ago
  • Date Published
    June 26, 2025
    a year ago
Abstract
A charging system according to this disclosure includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge.
Description
BACKGROUND OF THE INVENTION
Field of the Invention

The present disclosure relates to a charging system and a method for controlling a charging system.


Description of the Background Art

Tools for absorbing particles such as dust in substrate conveyors are known in the art. Japanese Patent Laid-Open Publication No. JP H11-224895 discloses a disk-shaped particle-removing tool configured to be electrostatically charged. In Japanese Patent Laid-Open Publication No. JP H11-224895, the disk-shaped particle-removing tool is held by a hand of a robot arm placed in a substrate conveyor similar to wafers. When the particle-removing tool comes in contact with the hand, and particles that cling to the hand are absorbed to the particle-removing tool brought in a charged state. As a result, the particles clinging to the hand can be removed from the hand.


Here, as stated in Japanese Patent Laid-Open Publication No. JP H11-224895, in a case in which particles cling to the hand are removed by using the particle-removing tool electrostatically brought in the charged state, the particle-removing tool is necessarily previously charged. Also, as stated in Japanese Patent Laid-Open Publication No. JP H11-224895, in a case in which the hand of the robot arm and the particle-removing tool are placed in the substrate conveyor, the substrate conveyor is necessarily temporarily opened to manually charge the particle-removing tool. However, if the substrate conveyor is even temporarily opened, particles such as dust will come into the substrate conveyor. For this reason, it is desired to charge such a particle-removing tool without opening a substrate conveyor.


SUMMARY OF THE INVENTION

The disclosure invention is intended to solve the above problem, and one object of the present disclosure is to provide a charging system and a method for controlling a charging system capable of charging a particle-removing tool without opening a substrate conveyor.


A charging system according to a first aspect of the present disclosure includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge.


As discussed above, the charging system according to the first aspect of this disclosure includes the charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge. Accordingly, because the charger is arranged in the interior of the substrate conveyor, the particle absorption tool can be charged by the charger in the interior space of the substrate conveyor. Consequently, it is possible to charge the particle absorption tool without opening the substrate conveyor.


A method for controlling a charging system according to a second aspect of the present disclosure includes electrostatically charging a particle absorption tool so as to build up a static electric charge for absorbing particles by using a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor; and absorbing the particles by using the particle absorption tool building up the static electric charge.


As discussed above, the method for controlling a charging system according to the second aspect of the present disclosure includes electrostatically charging a particle absorption tool so as to build up a static electric charge for absorbing particles by using a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor; and Accordingly, because the charger is arranged in the interior of the substrate conveyor, the particle absorption tool can be charged by the charger in the interior space of the substrate conveyor. Consequently, it is possible to provide a method for controlling a charging system capable of charging the particle absorption tool without opening the substrate conveyor.


According to a charging system and a method for controlling a charging system of the present disclosure, it is possible to charge a particle absorption tool without opening a substrate conveyor.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a view showing a semiconductor production apparatus according to a first embodiment.



FIG. 2 is a block diagram showing a charging system according to the first embodiment.



FIG. 3 is a view showing a charger provided to an aligner according to the first embodiment.



FIG. 4 is a view showing a particle absorption tool according to the first embodiment.



FIG. 5 is a cross-sectional view of the particle absorption tool taken along a line 1000-1000 in FIG. 4.



FIG. 6 is a view showing a charger according to the first embodiment.



FIG. 7 is a view showing the particle absorption tool arranged in a tool container according to the first embodiment.



FIG. 8 shows a cross-sectional view showing the tool container according to the first embodiment as viewed from a side.



FIG. 9 is a flowchart illustrating a method for controlling the charging system according to the first embodiment.



FIG. 10 is a view showing the semiconductor production apparatus with a hand going to hold the particle absorption tool.



FIG. 11 is a view showing the particle absorption tool and a voltage applier of the charger brought in contact with each other by moving a robot arm.



FIG. 12 is a view showing the semiconductor production apparatus in removal of particles on an aligner by using the particle absorption tool.



FIG. 13 is a view showing the semiconductor production apparatus in cleaning of the particle absorption tool by using a cleaner.



FIG. 14 is a view showing a charger provided to an aligner according to a second embodiment.



FIG. 15 is a view showing the aligner according to the second embodiment as viewed from a top side.



FIG. 16 is a view showing the particle absorption tool and a voltage applier of a charger brought in contact with each other by moving a movement mechanism of the aligner.





DESCRIPTION OF THE PREFERRED EMBODIMENT
First Embodiment

The following description will describe a first embodiment embodying the present disclosure with reference to the drawings. In this specification, the upward/downward direction is defined as a Z direction. An upper side is defined a Z1 side, and a lower side is defined as a Z2 side. A direction orthogonal to the Z direction is defined as an X direction. One side in the X direction is defined as an X1 side, and another side is defined as an X2 side. A direction orthogonal to the Z direction and the X direction is defined as a Y direction. One side in the Y direction is defined as an Y1 side, and another side is defined as an Y2 side.


(Semiconductor Production Apparatus)

The following description describes a semiconductor production apparatus 500. As shown in FIG. 1, the semiconductor production apparatus 500 is an apparatus for processing substrates 1 formed of a semiconductor such as wafers. The semiconductor production apparatus 500 includes a substrate conveyor 200 and a substrate processor 300. The semiconductor production apparatus 500 is placed a clean room, for example.


(Substrate Conveyor)

The following description describes the substrate conveyor 200. For example, the substrate conveyor 200 is an EFEM (Equipment Front End Module). The substrate conveyor 200 includes FOUPs 110, a housing 120, an FOUP opener 130, an aligner 140, a robot 150, and a controller 160 shown in FIG. 2.


(FOUP)

Each FOUP 110 contains a plurality of substrates 1 before and after processing. An interior of the FOUP 110 is maintained clean similar to the clean room. The FOUP 110 includes a housing 111 and an opening/closing part 112. The housing 111 has a box shape, and includes an opening 111a opened toward an interior of the substrate conveyor 200. The opening/closing part 112 is configured to cover the opening 111a of the housing 111. The number of FOUPs 110 is four, for example.


(Housing)

The housing 120 has interior space 121. The interior space 121 is filled with a highly clean atmospheric gas. A robot 150 is placed in the interior space 121 of the housing 120. The housing 120 has a rectangular shape, for example. The housing 120 includes a wall 122 on the Y1 side having an opening 122a through which interior space of the housing is connected to the interior space 113 of the FOUP 110. Each substrate 1 can be moved between the FOUP 110 and the substrate conveyor 200 through the opening 122a. The housing 120 includes a wall 123 on the Y2 side having an opening 123a through which interior space of the housing is connected to interior space 311 of the substrate processor 300. Each substrate 1 can be moved between the substrate processor 300 and the substrate conveyor 200 through the opening 123a.


The following description describes the FOUP opener 130. The FOUP opener 130 is placed on the Y1 side of the substrate conveyor 200. The FOUP opener 130 includes opening/closing parts 131 and an FOUP support 132. Each opening/closing part 131 is arranged on the opening 122a of the wall 122 on the Y1 side of the housing 120. An opening mechanism (not shown) opens the opening/closing part 131 of the FOUP opener 130 and the opening/closing part 112 of the FOUP 110 so that the interior space 113 of the FOUP 110 is connected to the interior space 121 of the housing 120.


The following description describes the aligner 140. The aligner 140 is configured to receive the substrate 1 on the aligner. The aligner 140 executes at least one of rotating the substrate 1 to align the substrate 1 so as to agree a notch or an orientation flat formed in the substrate 1 with a predetermined orientation, and detecting an edge of the substrate 1 and eccentricity of the substrate 1 by using a line sensor 143 while rotating the substrate 1 one turn. In the first embodiment, the aligner 140 is placed in the interior space 121 of the housing 120 of the substrate conveyor 200. The notch or the orientation flat is an example of a mark. Also, as shown in FIG. 3, the aligner 140 includes a frame 141, a rotator 142 and a line sensor 143. The frame 141 is a base onto which the rotator 142 and the line sensor 143 are mounted. The substrate 1 is placed on and rotated by the rotator 142. The line sensor 143 is configured to detect the notch or the orientation flat from the entire of the substrate 1 rotated to by the rotator 142.


The following description describes the robot 150. As shown in FIG. 1, the robot 150 is placed in the interior space 121 of the housing 120 of the substrate conveyor 200. The robot 150 is a horizontal multi-joint robot, for example. The robot 150 includes a hand 151 and a robot arm 152. The hand 151 is configured to hold the substrate 1. For example, the hand 151 has a Y shape forming a bifurcated distal end. The hand 151 is arranged on a distal end of the robot arm 152. The robot arm 152 includes a plurality of links.


The following description describes a configuration of the controller 160. The controller 160 is a robot controller. As shown in FIG. 2, the controller 160 includes a main controller 161, a servo controller 162, drive circuits 163, and a storage 164. The main controller 161 and the servo controller 162, for example, include a CPU (Central Processing Unit). The main controller 161 controls drivers 152a of the robot arm 152. The servo controller 162 controls electric power supplied to the drivers 152a of the robot arm 152 based on commands from the main controller 161. The drive circuits 163 supply driving power to the drivers 152a of the robot arm 152. Specifically, the robot arm 152 includes two or more drivers 152a, and each of the drive circuits 163 is provided for corresponding one of the drivers 152a of the robot arm 152. Alternatively, one common drive circuit 163 can be provided for the drivers 152a. Each driver 152a includes a servo motor, an encoder and a reduction gear. The storage 164 stores programs to be executed by the controller 160.


(Substrate Processor)

The following description describes the substrate processor 300. As shown in FIG. 1, the substrate processor 300 configured to apply processing to the substrate 1. For example, the substrate processor 300 can apply the processes such as thermal process, impurity introduction process, thin-film formation process, lithography process, cleaning process, and planarization process to the substrate 1. The substrate processor 300 is arranged adjacent to the substrate conveyor 200. The substrate processor 300 includes a housing 310 with interior space 311. A wall 312 on the Y1 side of the housing 310 of the substrate processor 300 is the same as the wall 123 on the Y2 side of the housing 120 of the substrate conveyor 200. A receiving part 313 on which the substrate 1 is placed is arranged in the interior space 311 of the substrate processor 300.


(Charging System)

The charging system 100 is a system for charging a particle absorption tool 10. As shown in FIG. 2, the charging system 100 includes the aligner 140, the robot 150, the particle absorption tool 10, a charger 20, a tool container 30, a particle detector 50, a cleaner 60, and the controller 160.


(Particle Absorption Tool)

The following description describes the particle absorption tool 10. The particle absorption tool 10 can be held on the hand 151. Also, the particle absorption tool 10 is configured to be electrostatically charged so as to build up a static electric charge for absorbing particles. Also, as shown in FIG. 4, the particle absorption tool 10 has, for example, a disk shape, and has the same diameter as the substrate 1. Also, as shown in FIG. 5, the particle absorption tool 10 includes a semiconductor substrate 11, and anodes 12, cathodes 13, bias electrodes 14, and an interface 15, for example. The anodes 12 and the cathodes 13 are formed by impurity introduction. The anodes 12, the bias electrodes 14, and the cathodes 13 are arranged in this order on one surface 11a of the semiconductor substrate 11. The interface 15 is arranged on another surface 11b of the semiconductor substrate 11. The interface 15 is connected to the anodes 12 and the cathodes 13. A voltage is applied to the interface 15 from a voltage applier 22 of the charger 20 shown in FIG. 6. Accordingly, the voltage is applied to the anodes 12 and the cathodes 13 so that the one surface 11a of the semiconductor substrate 11 is charged.


(Charger)

The following description describes the charger 20. The charger 20 is a device configured to electrostatically charge the particle absorption tool 10 so as to build up the static electric charge. As shown in FIG. 6, the charger 20 includes a housing 21, the voltage applier 22, a contact detector 23, and an electric-power storage 24 shown in FIG. 3. The housing 21 has a box shape.


The voltage applier 22 is configured to contact the interface 15 of the particle absorption tool 10 and to apply a voltage to the particle absorption tool 10. For example, the voltage applier 22 contains a plurality of probes 22a. The plurality of probes 22a protrude outward from the housing 21 through a hole 21a of the housing 21. When the plurality of probes 22a come into contact with the interface 15 of the particle absorption tool 10, the voltage can be applied to the anodes 12 and the cathodes 13.


In the first embodiment, the contact detector 23 is configured to detect information on the contact of the voltage applier 22 with the particle absorption tool 10. The charger 20 is configured to start to apply the voltage to the particle absorption tool 10 through the voltage applier 22 in response to the detection of the information on the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23. The contact detector 23 is a contact-sensitive touch sensor. The contact detector 23 is arranged adjacent to the voltage applier 22. A protruding height of the contact detector 23 from the housing 21 is the same as the voltage applier 22. For example, when the particle absorption tool 10 held by the hand 151 comes into contact with the voltage applier 22, the particle absorption tool 10 comes into contact with the contact detector 23. In this case, the information on the contact of the voltage applier 22 with the particle absorption tool 10 is information on the contact of the particle absorption tool 10 with the contact detector 23. Subsequently, the charger 20 starts to apply the voltage to the particle absorption tool 10 through the voltage applier 22 in response to the detection of the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23. For example, a switch is connected between the electric-power storage 24 and the voltage applier 22, and the switch is turned on in response to the detection of the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23. As a result, a voltage can be applied from the electric-power storage 24 to the particle absorption tool 10 through the voltage applier 22.


In the first embodiment, as shown in FIG. 3, the charger 20 is arranged in operating space of a robot arm 152 that is configured to convey a substrate 1 in an interior of the substrate conveyor 200, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge. Specifically, the charger 20 is provided to the aligner 140. For example, the charger 20 is arranged above the line sensor 143. The charger 20 faces the rotator 142. The voltage applier 22 of the charger 20 faces downward.


(Tool Container)

The following description describes the tool container 30. The tool container 30 is configured to accommodate the particle absorption tool 10. The tool container 30 has an opening 32 that is opened toward the substrate conveyor 200, as shown in FIG. 7. An interior of the tool container 30 is maintained clean in addition to the FOUP 110 similar to the clean room. The tool container 30 includes a housing 34, and an opening/closing part 35, as shown in FIG. 8. The housing 34 has a box shape, and includes the opening 32 opened to the interior of the substrate conveyor 200. The opening/closing part 35 is configured to cover the opening 32 of the housing 34. As shown in FIG. 10, the tool container 30 is arranged in the FOUP opener 130 where the FOUP 110 is placed in the substrate conveyor 200. The opening/closing part 131 of the FOUP opener 130 and the opening/closing part 35 of the tool container 30 are opened to connect the interior space 33 of the tool container 30 to the interior space 121 of the housing 120. Accordingly, the particle absorption tool 10 can be moved between the tool container 30 and the substrate conveyor 200 through the opening 122a of the housing 120. Also, the particle absorption tool 10 can be moved between the substrate conveyor 200 and the substrate processor 300 through the opening 123a of the housing 120. An exterior shape of the tool container 30 is common to an exterior shape of the FOUP 110 so that the tool container 30 can accommodate the particle absorption tool 10. Specifically, the housing 34 of the tool container 30 and the housing 111 of the FOUP 110 shown in FIG. 1 have the same size. For this reason, the tool container 30 can be placed in the FOUP opener 130 instead of the FOUP 110. In addition, a diameter of the particle absorption tool 10 is the same as a diameter of the substrate 1. Accordingly, the particle absorption tool 10 can be accommodated in the tool container 30 similar to a case in which the substrate 1 is accommodated in the FOUP 110. For example, the particle absorption tool 10 is supported by a support 30a of the tool container 30. An interior of the tool container 30 is maintained clean with the particle absorption tool 10 being accommodated in the tool container 30.


(Electric-Power Storage)

The electric-power storage 24 stores electric power to be supplied to the voltage applier 22. As shown in FIG. 3, the electric-power storage 24 is arranged inside the housing 21, for example. In the first embodiment, the electric-power storage 24 is configured to be charged by electric power supplied to the aligner 140. Specifically, electric power supplied is supplied to the aligner 140 from an external power supply 144. Also, the electric power supplied is supplied to the electric-power storage 24 from the external power supply 144.


(Particle Detector)

In the first embodiment, a particle detector 50 is provided to detect a degree of particle absorption by the particle absorption tool 10 during a series of operations of the robot arm 152. The series of operations of the robot arm 152 will be is described later. The particle detector 50 includes at least one of a charge-amount detector 51 configured to detect a charge amount of the particle absorption tool 10, and an image capturer 52 configured to capture an image of the particles that are absorbed by the particle absorption tool 10. The charge-amount detector 51 is a surface potentiometer, for example. The surface potentiometer can measure an amount of static electric charge by using electrostatic induction phenomenon in which an electric conductor is attracted by a charged object. The surface potentiometer can measure the amount of static electric charge without contact with the particle absorption tool 10. The particle detector 50 is provided to the aligner 140. For example, the particle detector 50 is arranged on the frame 141 of the aligner 140. For example, the image capturer 52 is a high-resolution camera capable of capturing an image of particles.


In the first embodiment, the cleaner 60 configured to clean the particle absorption tool 10. As shown in FIG. 1, the cleaner 60 is arranged, for example, in the interior space 311 of the substrate processor 300. The substrate processor 300 is a spin dryer, for example. The spin dryer rotates the particle absorption tool 10 to remove particles absorbed onto the particle absorption tool 10 by centrifugal force.


(Operation of Charging System)

The following description describes operation of removal of particles inside the semiconductor production apparatus 500 executed by the charging system 100. The operation of the charging system 100 is controlled by the controller 160. The electric-power storage 24 of the charger 20 is previously charged. The particle absorption tool 10 is previously manually placed in the tool container 30. The substrate 1 is not processed by the semiconductor production apparatus 500 during the operation of removal of particles. As shown in FIG. 10, the tool container 30 is arranged instead of the FOUP 110 in the FOUP opener 130. One tool container 30 or a plurality of tool containers 30 can be provided in the FOUP opener 130. The following description describes an exemplary arrangement in which one tool container 30 is provided in the FOUP opener 130.


As shown in FIG. 9, in step S1, the opening/closing part 131 of the FOUP opener 130 and the opening/closing part 35 of the tool container 30 are opened to connect the interior space 33 of the tool container 30 to the interior space 121 of the housing 120 of the substrate conveyor 200 by the controller 160 by moving the opening mechanism (not shown).


In step S2, as shown in FIG. 10, in the first embodiment, the controller 160 directs the hand 151 of the robot arm 152 to hold the particle absorption tool 10 previously accommodated in the tool container 30. Specifically, the controller 160 moves the hand 151 through the opening 122a of the housing 120 of the substrate conveyor 200 into the interior space 33 of the tool container 30.


In step S3, as shown in FIG. 11, the robot arm 152 is moved so as to move the particle absorption tool 10 held by the hand 151 to the aligner 140 by the controller 160. In the first embodiment, the robot arm 152 is moved so as to bring the particle absorption tool 10 held by the hand 151 into contact with the voltage applier 22, and to charge the particle absorption tool 10 by the controller 160. Specifically, the controller 160 directs the robot arm 152 to move the particle absorption tool 10 held by the hand 151 upward to bring the particle absorption tool 10 held into contact with the voltage applier 22 so as to charge the particle absorption tool. At this time, the particle absorption tool 10 comes into contact with the contact detector 23 in addition to the voltage applier 22. Correspondingly, the charger 20 start to apply a voltage to the particle absorption tool 10 through the voltage applier 22. Here, the application of voltage to the particle absorption tool through the voltage applier 22 is not controlled by the controller 160 but executed by the charger 20.


In step S4, in the first embodiment, after charging the particle absorption tool 10, the controller 160 moves the robot arm 152 and then absorbs particles in at least one of the interior of the substrate conveyor 200 and the interior of the substrate processor 300 by using the particle absorption tool 10 held by the hand 151. Specifically, the particle absorption tool 10 that has been accommodated in the tool container 30 is moved to the substrate conveyor 200 through the opening 122a of the housing 120 of the substrate conveyor 200, and the substrate processor 300 through the opening 123a. As shown in FIG. 12, the particle absorption tool 10 can absorb particles cling to a part of the aligner 140, which is arranged in the interior space 121 of the substrate conveyor 200, where the substrate 1 is placed, and the receiving part 313 on which the substrate 1 is placed in the interior space 311 of the substrate processor 300.


In step S5, in the first embodiment, the controller 160 detects a degree of particle absorption by the particle absorption tool 10 by using the particle detector 50. Specifically, the controller 160 temporarily moves the particle absorption tool 10 to a position above the particle detector 50 of the aligner 140. Subsequently, the controller 160 detects an amount of particles absorbed onto the particle absorption tool 10 by using the particle detector 50.


Then, in step S6, the controller 160 determines whether the particle absorption tool 10 can further absorb particles. In a case in which the particle detector 50 is the image capturer 52, the controller 160 detects the amount of absorbed particles based on an image of the particle absorption tool 10 captured by the image capturer 52 by using image processing or some other technique. If the amount of absorbed particles is not greater than a predetermined particle amount threshold, the controller 160 determines that the particle absorption tool 10 can further absorb particles, and the procedure returns to step S4. If the amount of absorbed particles is greater than the predetermined particle amount threshold, the controller 160 determines that the particle absorption tool 10 cannot further absorb particles, and the procedure goes to step S7. In a case in which the particle detector 50 is the charge-amount detector 51, the charge amount of the particle absorption tool 10 is detected by the charge-amount detector 51. If the charge amount of the particle absorption tool 10 detected by the charge-amount detector 51 is greater than a predetermined charge amount threshold, the controller 160 determines that the particle absorption tool 10 can further absorb particles, and the procedure returns to step S4. If the charge amount of the particle absorption tool 10 detected by the charge-amount detector 51 is not greater than the predetermined charge amount threshold, the controller 160 determines that the particle absorption tool 10 cannot further absorb particles, and the procedure goes to step S7. Accordingly, the degree of particle absorption is detected by the particle detector 50 during the series of operations in which particles are repeatedly absorbed in step S4.


In step S7, as shown in FIG. 13, in the first embodiment, after absorbing particles by using the particle absorption tool 10, the controller 160 moves the robot arm 152 so as to move the particle absorption tool 10 to the cleaner 60. The cleaner 60 cleans the particle absorption tool 10 moved.


Subsequently, in step S8, the controller 160 electrostatically charges the particle absorption tool 10 so as to build up the static electric charge by using the charger 20 similar to step S3. Subsequently, in step S9, the controller 160 absorbs particles in the same target area as step S4 in order to confirm whether the particles is completely absorbed in the target area for absorption of particles in at least one of the interior of the substrate conveyor 200 and the interior of the substrate processor 300. In step S9, the controller 160 also execute the absorption operation by moving the particle absorption tool 10 in the target area when absorbing particles similar to step S4. For example, the controller 160 executes the absorption operation by conveying the particle absorption tool 10 held by the hand 151 to the substrate receiving part 313 of the substrate processor 300 as the target area for absorption of particles, and by placing the particle absorption tool 10 on the substrate receiving part 313 similar to step S4.


Subsequently, in step S10, the controller 160 detects the degree of particle absorption by the particle absorption tool 10 by using the particle detector 50 similar to step S5. Subsequently, in step S11, it is determined whether particles in the target area are sufficiently absorbed. For example, in a case in which the particle detector 50 is the image capturer 52, the controller 160 detects the amount of absorbed particles based on an image of the particle absorption tool 10 captured by the image capturer 52 similar to step S6. If the amount of absorbed particles is greater than the predetermined particle amount threshold, the controller 160 determines that the particles are insufficiently absorbed, and the procedure returns to step S4. If the amount of absorbed particles is not greater than the predetermined particle amount threshold, the controller 160 determines that the particles are sufficiently absorbed. If it is determined that the particles are sufficiently absorbed, the operation of removal of particles inside the semiconductor production apparatus 500 executed by the charging system 100 ends. The predetermined particle amount threshold in step S11 can be a value different from that in step S6.


Alternatively, in step S11, it can be determined whether particles in the target area are sufficiently absorbed based on a detection result of the charge-amount detector 51. In this case, the charge amount of the particle absorption tool 10 is detected by the charge-amount detector 51. If the charge amount of the particle absorption tool 10 detected by the charge-amount detector 51 is not greater than the predetermined charge amount threshold, the controller 160 determines that the charge amount was decreased by absorbing the particles in the same target area, and determines that the particles are detected. In this case, the controller determines that the particles are insufficiently absorbed, and the procedure returns to step S4. If the charge amount of the particle absorption tool 10 detected by the charge-amount detector 51 is greater than the predetermined charge amount threshold, the controller 160 determines that particles are not additionally absorbed so that the particles are sufficiently absorbed, and the control procedure ends.


In a case in which a plurality of target areas for absorption of particles are specified, processes from step S8 to step S11 can be executed for each of the plurality of target areas to determine whether particles are completely absorbed for each of the plurality of target areas.


Advantages of First Embodiment

The charging system 100 includes the charger 20 arranged in operating space of a robot arm 152 that is configured to convey a substrate 1 in an interior of a substrate conveyor 200, and configured to electrostatically charge the particle absorption tool 10 so as to build up the static electric charge. Accordingly, because the charger 20 is arranged in the aligner 140 arranged in the interior of the substrate conveyor 200, the particle absorption tool 10 can be charged by the charger 20 in the interior space of the substrate conveyor 200. Consequently, it is possible to charge the particle absorption tool 10 without opening the substrate conveyor 200.


The charging system 100 includes the robot arm 152, the hand 151 attached to the robot arm 152 and configured to hold the particle absorption tool 10, and the controller 160 configured to absorb particles in at least one of the interior of the substrate conveyor 200 and an interior of a substrate processor 300 by using the charged particle absorption tool 10 held by the hand 151. Accordingly, particles can be absorbed by the particle absorption tool 10 that is sufficiently charged.


The robot arm 152 is moved so as to bring the particle absorption tool 10 held by the hand 151 into contact with the voltage applier 22, and to charge the particle absorption tool 10 by the controller 160. Because the particle absorption tool 10 can be charged by movement of the robot arm 152 without manual intervention, it is possible to save labor of operators.


The charging system includes an aligner 140 arranged in the interior of the substrate conveyor 200. The voltage applier 22 is arranged inside the tool container 30, and faces downward; and the controller 160 directs the robot arm 152 to move the particle absorption tool 10 held by the hand 151 upward to bring the particle absorption tool into contact with the voltage applier 22 so as to charge the particle absorption tool 10. Accordingly, the particle absorption tool 10 can be easily charged simply by moving the particle absorption tool 10 upward by using the robot arm 152. In addition, because the charger 20 is provided to the aligner 140, it is possible to prevent increase of a footprint area of equipment in the substrate conveyor 200 although the charger 20 is provided dissimilar to a case in which a place for arrangement of the charger 20 is prepared separately from the aligner 140.


The charger 20 includes a contact detector 23 configured to detect information on the contact of the voltage applier 22 with the particle absorption tool 10. The charger 20 is configured to start to apply the voltage to the particle absorption tool 10 through the voltage applier 22 in response to the detection of the information on the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23. Because the controller 160 does not required to control application of a voltage to the particle absorption tool 10 through the voltage applier 22, it is possible to reduce a control load of the controller 160.


The charging system 100 includes the particle detector 50 configured to detect a degree of particle absorption by the particle absorption tool 10 during a series of operations of the robot arm 152. Accordingly, because the controller 160 determines whether the particle absorption tool 10 can further absorb particles based on the detection result obtained by the particle detector 50, it is possible to prevent that ineffective absorption operation, which uses the particle absorption tool 10 that cannot absorb particles, continues.


The particle detector 50 includes at least one of a charge-amount detector 51 configured to detect a charge amount of the particle absorption tool 10, and an image capturer 52 configured to capture an image of the particles that are absorbed by the particle absorption tool 10. Accordingly, because the charge-amount detector 51 can detect that the charge amount of the particle absorption tool 10 is relatively large, the controller 160 can determine whether the particle absorption tool 10 can further absorb particles. Also, because it can be detected that an amount of particles adhered onto the particle absorption tool 10 is relatively small based on an image of the particles, which are adhered onto the particle absorption tool 10, captured by the image capturer 52, the controller 160 can determine whether the particle absorption tool 10 can further absorb particles.


The particle detector 50 is provided to the aligner 140. Accordingly, it is possible to prevent increase of a size of the charging system 100 as compared with a case in which the detection of a degree of particle absorption and the charging of the particle absorption tool 10 are executed in separate places.


The charging system 100 includes the cleaner 60 configured to clean the particle absorption tool 10. After absorbing particles by using the particle absorption tool 10, the controller 160 moves the robot arm 152 so as to move the particle absorption tool 10 to the cleaner 60; and the cleaner 60 cleans the particle absorption tool 10 moved. Accordingly, because the particle absorption tool 10 onto which particles are adhered can be cleaned, the cleaned particle absorption tool 10 can be charged and used in the next particle absorption operation. Consequently, it is not necessary to prepare a plurality of particle absorption tools 10.


The charger 20 includes the electric-power storage 40 configured to be charged by electric power supplied to the aligner 140 so as to store the electric power. Because the aligner 140 has been designed to be supplied with power, no additional power supply for charging the electric-power storage 40 is required. Accordingly, the configuration of the charging system 100 can be simple.


Second Embodiment

The following description describes an aligner 240 according to a second embodiment of this disclosure.


In the second embodiment, as shown in FIG. 14, the aligner 140 includes a movement mechanism 241 configured to move the particle absorption tool 10 in an upward/downward direction so as to bring the particle absorption tool 10 in contact with the voltage applier 22. The movement mechanism 241 moves the particle absorption tool 10 upward so as to bring the particle absorption tool in contact with the voltage applier 22 provided to the aligner 140 and facing downward. Specifically, the movement mechanism 241 includes a holder 241a configured to hold a lower side of the particle absorption tool 10, and a lifter 241b configured to move the holder 241a upward and downward. As shown in FIG. 15, the holder 241a has a U-shape as viewed in the Z direction, and a flat plate shape, for example. The lifter 241b includes a driver such as an electric motor for moving the holder 241a upward and downward. That is, in the second embodiment, dissimilar to the first embodiment, as shown in FIG. 16, the particle absorption tool 10 is brought into contact with the voltage applier 22 not by the hand 151 of the robot 150 by the movement mechanism 241. The movement mechanism 241 is controlled by the controller 160, for example. Subsequently, after moving the robot arm 152 so that the particle absorption tool 10 charged is held by the hand 151, the controller 160 absorbs particles in at least one of the interior of the substrate conveyor 200 and the interior of the substrate processor 300. The other configuration of the second embodiment is similar to the first embodiment.


Advantages of Second Embodiment

The aligner 240 includes the movement mechanism 241 configured to move the particle absorption tool 10 in an upward/downward direction so as to bring the particle absorption tool 10 in contact with the voltage applier 22. Because the particle absorption tool 10 can be charged by movement of the aligner 240 without manual intervention, it is possible to save labor of operators.


The voltage applier 22 is provided to the aligner 140 and faces downward, and the movement mechanism 241 moves the particle absorption tool 10 upward to bring the particle absorption tool into contact with the voltage applier 22. Accordingly, the particle absorption tool 10 can be easily charged simply by moving the particle absorption tool 10 upward by using the movement mechanism 241.


Modified Embodiments

Note that the embodiment disclosed this time must be considered as illustrative in all points and not restrictive. The scope of the present disclosure is not shown by the above description of the embodiments but by the scope of claims for patent, and all modifications or modified examples within the meaning and scope equivalent to the scope of claims for patent are further included.


While the example in which the robot 150 for holding the substrate 1 is used as the robot 150 for holding the particle absorption tool 10 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the robot for holding the particle absorption tool 10 can be provided separately from the robot 150 for holding the board 1.


While the example in which the particle absorption tool 10 is accommodated in the tool container 30 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the particle absorption tool 10 can be accommodated not in the tool container 30 but in the substrate conveyor 200 or the substrate processor 300.


While the example in which the voltage applier 22 of the charger 20 is provided to the aligner 140 and faces downward has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the voltage applier 22 of the charger 20 faces upward.


While the example in which the charger 20 is configured to start to apply the voltage to the particle absorption tool 10 through the voltage applier 22 in response to the detection of the information on the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the controller 160 can be configured to start to apply the voltage to the particle absorption tool 10 through the voltage applier 22 in response to the detection of the information on the contact of the voltage applier 22 with the particle absorption tool 10 detected by the contact detector 23.


While the example in which the charging system 100 includes the particle detector 50 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the charging system 100 can have no particle detector 50. In this case, for example, if one cycle of particle absorption operations of the particle absorption tool 10 ends, the cycle of particle absorption operations is completed.


While the example in which the particle detector 50 is arranged in the aligner 140 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the particle detector 50 can be arranged in a place other than the aligner 140, such as in the substrate conveyor 200 or the substrate processor 300.


While the example in which the cleaner 60 is arranged in the substrate processor 300 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the cleaner 60 can be arranged in the substrate conveyor 200.


While the example in which the particle removal operation ends after the particle absorption tool 10 is cleaned by the cleaner 60 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, after the particle absorption tool 10 is cleaned by the cleaner 60, the charger 20 can recharge the particle absorption tool 10 and restart the particle removal operation.


While the example in which the charger 20 is charged by electric power supplied to the aligner 140 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the charger 20 can be charged by electric power that is supplied separately from the electric power that is supplied to the aligner 140.


While the example in which the particle charger 20 is provided to the aligner 140 has been shown in the aforementioned first and second embodiments, the present disclosure is not limited to this. For example, alternatively, the charger 20 can be arranged in operating space of the robot arm other than in operating space of the aligner 140 in the interior of the substrate conveyor 200. In a case in which the charger 20 is arranged at a relatively high position in the interior of the substrate conveyor 200, the robot arm 152 necessarily moves not only in a horizontal plane but also in a vertical direction.


Functions of elements disclosed in this specification can be realized by a circuit or processing circuit including a general purpose processor, a dedicated processor, an Integrated circuit, ASIC (Application Specific Integrated Circuits), a conventional circuit and/or combination of them configured or programmed to realize the functions disclosed. Because processors include transistors and other circuits, they are considered as a processing circuit or a circuit. In the present disclosure, circuits, units or means are hardware for realizing the functions stated above, or hardware programmed to realize the functions stated above. The hardware can be hardware disclosed in this specification, or can be other known hardware programed or configured to realize the functions stated above. In the case in which the hardware is a processor that can be considered as one type of circuits, the circuit, means or unit is a combination of hardware and software, and the software is used for configuration of the hardware and/or the processor.


Modes

The aforementioned exemplary embodiment will be understood as concrete examples of the following modes by those skilled in the art.


(Mode 1)

A charging system includes a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge.


(Mode 2)

In the charging system according to mode 1, a robot arm, a hand attached to the robot arm and configured to hold the particle absorption tool, and a controller is configured to direct the hand of the robot arm to hold the particle absorption tool, and to absorb particles in at least one of the interior of the substrate conveyor and an interior of a substrate processor by using the charged particle absorption tool held by the hand are further provided.


(Mode 3)

In the charging system according to mode 2, the charger includes a voltage applier configured to contact the particle absorption tool and to apply a voltage to the particle absorption tool; and the controller is configured to direct the robot arm to move the particle absorption tool held by the hand to bring the particle absorption tool into contact with the voltage applier so as to charge the particle absorption tool.


(Mode 4)

In the charging system according to mode 3, an aligner arranged in the interior of the substrate conveyor is further provided; the voltage applier is provided to the aligner and faces downward; and the controller is configured to direct the robot arm to move the particle absorption tool held by the hand upward to bring the particle absorption tool into contact with the voltage applier so as to charge the particle absorption tool.


(Mode 5)

In the charging system according to mode 3 or 4, the charger includes a contact detector configured to detect information on the contact of the voltage applier with the particle absorption tool, and the charger is configured to start to apply the voltage to the particle absorption tool through the voltage applier in response to the detection of the information on the contact of the voltage applier with the particle absorption tool detected by the contact detector.


(Mode 6)

In the charging system according to any of modes 2 to 5, an aligner arranged in the interior of the substrate conveyor is further provided; the charger includes a voltage applier configured to contact the particle absorption tool and to apply a voltage to the particle absorption tool; and the aligner includes a movement mechanism configured to move the particle absorption tool in an upward/downward direction so as to bring the particle absorption tool in contact with the voltage applier.


(Mode 7)

In the charging system according to mode 6, the voltage applier is provided to the aligner and faces downward; and the movement mechanism is configured to move the particle absorption tool upward so as to bring the particle absorption tool in contact with the voltage applier.


(Mode 8)

In the charging system according to any of modes 2 to 7, a particle detector configured to detect a degree of particle absorption by the particle absorption tool during a series of operations of the robot arm is further provided.


(Mode 9)

In the charging system according to mode 8, the particle detector includes at least one of a charge-amount detector configured to detect a charge amount of the particle absorption tool, and an image capturer configured to capture an image of the particles that are absorbed by the particle absorption tool.


(Mode 10)

In the charging system according to mode 8 or 9, an aligner arranged in the interior of the substrate conveyor is further provided; and the particle detector is provided to the aligner.


(Mode 11)

In the charging system according to any of modes 2 to 10, a cleaner configured to clean the particle absorption tool is further provided; the controller is configured to, after absorbing particles by using the particle absorption tool, move the robot arm so as to move the particle absorption tool to the cleaner; and the cleaner is configured to clean the particle absorption tool moved.


(Mode 12)

In the charging system according to any of modes 1 to 11, an aligner arranged in the interior of the substrate conveyor is further provided; the charger includes an electric-power storage configured to be charged by electric power supplied to the aligner so as to store the electric power.


(Mode 13)

A method for controlling a charging system includes electrostatically charging a particle absorption tool so as to build up a static electric charge for absorbing particles by using a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor; and absorbing the particles by using the particle absorption tool building up the static electric charge.

Claims
  • 1. A charging system comprising: a particle absorption tool configured to be electrostatically charged so as to build up a static electric charge for absorbing particles; anda charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor, and configured to electrostatically charge the particle absorption tool so as to build up the static electric charge.
  • 2. The charging system according to claim 1 comprising the robot arm,a hand attached to the robot arm and configured to hold the particle absorption tool, anda controller configured to direct the hand of the robot arm to hold the particle absorption tool, and to absorb particles in at least one of the interior of the substrate conveyor and an interior of a substrate processor by using the charged particle absorption tool held by the hand.
  • 3. The charging system according to claim 2, wherein the charger includes a voltage applier configured to contact the particle absorption tool and to apply a voltage to the particle absorption tool; andthe controller is configured to direct the robot arm to move the particle absorption tool held by the hand to bring the particle absorption tool into contact with the voltage applier so as to charge the particle absorption tool.
  • 4. The charging system according to claim 3 further comprising an aligner arranged in the interior of the substrate conveyor, wherein the voltage applier is provided to the aligner and faces downward; andthe controller is configured to direct the robot arm to move the particle absorption tool held by the hand upward to bring the particle absorption tool into contact with the voltage applier so as to charge the particle absorption tool.
  • 5. The charging system according to claim 3, wherein the charger includes a contact detector configured to detect information on the contact of the voltage applier with the particle absorption tool, andthe charger is configured to start to apply the voltage to the particle absorption tool through the voltage applier in response to the detection of the information on the contact of the voltage applier with the particle absorption tool detected by the contact detector.
  • 6. The charging system according to claim 2 further comprising an aligner arranged in the interior of the substrate conveyor, wherein the charger includes a voltage applier configured to contact the particle absorption tool and to apply a voltage to the particle absorption tool; andthe aligner includes a movement mechanism configured to move the particle absorption tool in an upward/downward direction so as to bring the particle absorption tool in contact with the voltage applier.
  • 7. The charging system according to claim 6, wherein the voltage applier is provided to the aligner and faces downward; andthe movement mechanism is configured to move the particle absorption tool upward so as to bring the particle absorption tool in contact with the voltage applier.
  • 8. The charging system according to claim 2 further comprising a particle detector configured to detect a degree of particle absorption by the particle absorption tool during a series of operations of the robot arm.
  • 9. The charging system according to claim 8, wherein the particle detector includes at least one of a charge-amount detector configured to detect a charge amount of the particle absorption tool, and an image capturer configured to capture an image of the particles that are absorbed by the particle absorption tool.
  • 10. The charging system according to claim 8 further comprising an aligner arranged in the interior of the substrate conveyor, wherein the particle detector is provided to the aligner.
  • 11. The charging system according to claim 2 further comprising a cleaner configured to clean the particle absorption tool, wherein the controller is configured to, after absorbing particles by using the particle absorption tool, move the robot arm so as to move the particle absorption tool to the cleaner; andthe cleaner is configured to clean the particle absorption tool moved.
  • 12. The charging system according to claim 1 further comprising an aligner arranged in the interior of the substrate conveyor, wherein the charger includes an electric-power storage configured to be charged by electric power supplied to the aligner so as to store the electric power.
  • 13. A method for controlling a charging system comprising: electrostatically charging a particle absorption tool so as to build up a static electric charge for absorbing particles by using a charger arranged in operating space of a robot arm that is configured to convey a substrate in an interior of a substrate conveyor; andabsorbing the particles by using the particle absorption tool building up the static electric charge.