Claims
- 1. A conditioner apparatus of a chemical mechanical polishing system, comprising:a housing positionable over a polishing surface of the chemical mechanical polishing system, the housing including at least one aperture therein; an abrasive element coupled to the housing and engageable with the polishing surface; and a fluid source to direct fluid into the housing and through the aperture to prevent particles from entering the housing.
- 2. The conditioner apparatus of claim 1, further comprising a drive assembly surrounded by the housing, the drive assembly coupled to the abrasive element to transmit rotation to the abrasive element.
- 3. The conditioner apparatus of claim 2, further comprising a bearing coupling the drive assembly to the housing and enabling rotation of the drive assembly within the housing.
- 4. The conditioner apparatus of claim 3, wherein the fluid source directs fluid past the bearing to prevent particles from contaminating the bearing.
- 5. The conditioner apparatus of claim 2, further comprising a drive shaft coupling the abrasive element to the drive assembly, the drive shaft extending through the aperture in the housing.
- 6. The conditioner apparatus of claim 1, wherein the aperture forms a labyrinth path within the housing.
- 7. The conditioner apparatus of claim 1, further comprising a support arm to support the housing and a fluid line to carry fluid from the source through the support and into the housing.
- 8. The conditioner apparatus of claim 1, wherein the fluid is a gas selected from the group consisting of nitrogen, argon, helium and air.
- 9. The conditioner apparatus of claim 1, wherein the fluid is a liquid selected from the group consisting of water and reactive solvents.
- 10. A conditioner head of a chemical mechanical polishing system, comprising:a housing positionable over a polishing surface of the chemical mechanical polishing system, the housing including at least one aperture therein; an abrasive element coupled to a member extending through the aperture and engageable with the polishing surface; and a fluid source to direct fluid through the aperture to prevent particles from entering the housing.
- 11. A method for conditioning a polishing surface, comprising:supporting an abrasive conditioning element by a member that extends through an aperture in a conditioner head; bringing the abrasive conditioning element into contact with the polishing surface; creating relative motion between the abrasive conditioning element and the polishing surface; and directing a fluid through the aperture to prevent particles from reaching an interior of the conditioner head.
Parent Case Info
This is a continuation application of U.S. application Ser. No. 09/162,916, filed Sep. 29, 1998 now U.S. Pat. No. 6,033,290.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO 9902305 |
Jan 1999 |
WO |
Continuations (1)
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Number |
Date |
Country |
Parent |
09/162916 |
Sep 1998 |
US |
Child |
09/489291 |
|
US |