Claims
- 1. A process for chemical metallization of electrically non-conducting porous needle felt substrates having a porosity of from 40 to 97%, comprising the steps of activating fiber surfaces of the substrates with a noble metal-containing solution, placing the activated substrates in at least four layers, one above the other, in a metallizing tank whereby the lower layers are immediately brought into contact with a chemical metallizing solution and the remaining layers are initially not filled with the chemical metallizing solution and chemically metallizing the activated substrates by adding an initial volume of the chemical metallizing solution which is from 10 to 30% less than the free pore volume of the substrates and thereafter increasing the initial volume by evolution of gas to fill the remaining layers.
- 2. The process according to claim 1, wherein the porous substance are coppered with the chemical metallizing solution.
- 3. The process according to claim 1, wherein the porous substrates are nickelized with the chemical metallizing solution.
- 4. The process according to claim 1 wherein the electrically non-conducting porous substrates are selected from the group consisting of polyethylene, polyester, polyamide and polyacrylonitrile fibers.
- 5. A process for chemical metallization of electrically non conducting, open-pore substrates having a porosity of from 40 to 97%, comprising the steps of activating pore wall surfaces of the substrates with a noble metal containing solution, placing the activated substrates in at least four layers, one above the other, in a metallizing tank whereby the lower layers are immediately brought into contact with a chemical metallizing solution and the remaining layers are initially not filled with the chemical metallizing solution, and chemically metallizing the activated substrates by adding an initial volume of the chemical metallizing solution which is from 10 to 30% less than the free pore volume of the substrates and thereafter increasing the initial volume by evolution of gas to fill the remaining layers.
- 6. The process according to claim 5, wherein the porous substrates are coppered with the chemical metallizing solution.
- 7. The process according to claim 5, wherein the porous substrates are nickelized with the chemical metallizing solution.
- 8. The process according to claim 5, wherein the electrically non-conducting porous substrates are selected from the group consisting of polyethylene, polyester, polyamide and polyacrylonitrile fibers.
- 9. A process for chemical metallization of electrically non-conducting porous needle felt and of non-woven substrates having a porosity of from 40 to 97%, comprising the steps of activating fiber surfaces of the substrates with a noble metal-containing solution, placing the activated substrates in at least four layers, one above the other, in a metallizing tank, bringing said substrates into contact with a chemical metallizing solution with an initial volume of the chemical metallizing solution which is from 10 to 30% less than the free pore volume of the substrates whereby only the lower layers are immediately into contact with a chemical metallizing solution and the remaining layers are initially not filled with the chemically metallizing solution and thereafter chemically metallizing all the activated substrates by increasing the initial volume by evolution of gas to fill also the remaining layers.
Priority Claims (1)
Number |
Date |
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39 25 232.9 |
Jul 1989 |
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Parent Case Info
This application is a continuation of U.S. patent application Ser. No. 07/553,622, filed Jul. 18, 1990, now abandoned.
US Referenced Citations (12)
Foreign Referenced Citations (3)
Number |
Date |
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2749151 |
May 1979 |
DEX |
2196651 |
May 1988 |
GBX |
2225028 |
May 1990 |
GBX |
Continuations (1)
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Number |
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Parent |
553622 |
Jul 1990 |
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