TREA

Chemical vapor deposition wafer carrier with thermal cover

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Information

  • Patent Grant
  • D863239
  • Patent Number
    D863,239
  • Date Filed
    Monday, March 26, 2018
    6 years ago
  • Date Issued
    Tuesday, October 15, 2019
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D15 144
    • D15 1441
    • D15 1442
    • D23 323
    • D23 328
    • D23 335
    • D23 336
    • D23 337
    • D23 341
    • D23 352
    • D23 357
    • D23 385
    • D23 386
    • D23 397
    • D23 399
    • D23 400
    • D23 406
    • D23 411
    • D23 413
    • D23 499
    • CPC
    • C23C16/455
    • C23C16/45502
    • C23C16/45517
    • C23C16/4582
    • C23C16/4583
    • C23C16/4584
    • C23C16/4585
    • C23C16/4401
    • C23C16/4402
    • C23C16/4409
    • H01L21/50
    • H01L21/4817
    • H01L21/4871
    • H01L23/02
    • H01L23/04
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H05K3/30
    • B24B37/27
    • B24B37/28
    • B24B37/30
    • B24B41/06
    • B24B41/067
    • B24B37/04
    • B64C11/04
    • B64C11/16
    • B64C11/14
    • B64C11/18
    • B64C11/20
    • B64C2001/009
    • F03D3/062
    • F04D19/002
    • F24F1/0018
    • B64D13/02
    • E04C2/427
  • International Classifications
    • 1303
    • Term of Grant
      15Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Information
Abstract
Description


FIG. 1 is a perspective view of a first embodiment of a chemical vapor deposition wafer carrier with thermal cover showing our new design.



FIG. 2 is a top plan view thereof.



FIG. 3 is a right side view thereof, with the left side view, front view, and rear view being identical.



FIG. 4 is a bottom plan view thereof.



FIG. 5 is a perspective view of a second embodiment of a chemical vapor deposition wafer carrier with thermal cover, showing our new design, which differs from the embodiment shown in FIG. 1 in that it includes staples extending through the thickness of the chemical vapor deposition wafer carrier with thermal cover; and,



FIG. 6 is a perspective view of the thermal cover of the chemical vapor deposition wafer carrier with thermal cover, shown separately from the base without staples for ease of illustration.


In each of the figures, portions or features shown in broken lines form no part of the claimed design.


Claims
  • The ornamental design for a chemical vapor deposition wafer carrier with thermal cover, as shown and described.
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