Patent Grant
11646504
The following description relates to a chip antenna module array.
Mobile communications data traffic is increasing rapidly every year. Technology is being developed to support such increasing data traffic in real time in wireless networks. For example, the content of Internet-based data (IoT)-based data, Augmented Reality (AR), Virtual Reality (VR), Live VR/AR combined with SNS, Autonomous driving, Sync View, Micro-camera Applications such as real-time video transmission require communication (e.g., 5G communications, mmWave communications, etc.) to support the exchange of large amounts of data.
Therefore, recently, millimeter wave (mmWave) communications including 5G (5G) communications have been researched, and studies into the commercialization/standardization of chip antenna modules that smoothly implement mmWave communications are also being conducted.
RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the manner in which they are delivered, so that the quality of communications can drop dramatically. Therefore, an antenna for high frequency communications may demand a technical approach that is different than the technical approach of a conventional antenna, and it may be necessary to separate the antenna gain (Gain), the integration of the antenna and the RFIC, and the effective isotropic radiated power (EIRP). Development of special technologies, such as power amplifiers, may be needed.
This Summary is provided to introduce a selection of concepts in simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
In one general aspect, a chip antenna module array includes a first chip antenna module including: a first dielectric layer; a first solder layer disposed on a lower surface of the first dielectric layer; a first feed via forming a first feed path through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, configured to be fed from the first feed via, and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and configured to not overlap the first patch antenna pattern in a vertical direction. The chip antenna module array includes a second chip antenna module including: a second dielectric layer; a second solder layer disposed on a lower surface of the second dielectric layer; a second feed via forming a second feed path through the second dielectric layer; a second patch antenna pattern disposed on an upper surface of the second dielectric layer, configured to be fed from the second feed via, and having a second resonant frequency different from the first resonant frequency; and a second coupling pattern disposed at a level in a vertical direction higher than the second patch antenna pattern, spaced apart from the second patch antenna pattern, and overlapping the second patch antenna pattern in the vertical direction. The chip antenna module array includes a connection member electrically connected to the first chip antenna module and the second chip antenna module, respectively, and having a top surface on which the first chip antenna module and the second chip antenna module are spaced apart from each other.
The second coupling pattern may include a slot.
The first coupling pattern may have a polygonal shape and may not include a slot.
The first chip antenna module may further include a third coupling pattern disposed at a level in the vertical direction higher than the first patch antenna pattern, spaced apart from the first patch antenna pattern, and overlapping the first patch antenna pattern in the vertical direction. The third coupling pattern may have a polygonal shape and may not include a slot.
The second chip antenna module may further include a fourth coupling pattern spaced apart from the second patch antenna pattern, overlapping the second patch antenna pattern in the vertical direction, and disposed between the second patch antenna pattern and the second coupling pattern. The fourth coupling pattern may have a polygonal shape and may not include a slot.
The second chip antenna module may further include a space filled with an insulating material or air. The space may not overlap the second patch antenna pattern in the vertical direction, and may overlap the second dielectric layer in the vertical direction.
A size of the upper surface of the second dielectric layer may be smaller than a size of the upper surface of the first dielectric layer.
The first chip antenna module may further include: a first feed pattern extending from an upper end of the first feed via and overlapping at least a portion of the first coupling pattern, below the first coupling pattern; and a second feed pattern extending from a lower end of the first feed via and overlapping at least a portion of the first coupling pattern, below the first coupling pattern.
The first coupling pattern may surround at least a portion of an edge of the first patch antenna pattern.
The first coupling pattern and the first patch antenna pattern may be disposed at a same level in the vertical direction.
The upper surface of the first dielectric layer may have a polygonal shape. The first patch antenna pattern may have a polygonal shape, and at least some sides of the first patch antenna pattern may be oblique with respect to each side, among sides, of the upper surface of the first dielectric layer.
The upper surface of the second dielectric layer may have a polygonal shape. The second patch antenna pattern may have a polygonal shape, and at least some sides of the second patch antenna pattern may be oblique with respect to each side, among sides, of the upper surface of the second dielectric layer.
The chip antenna module may further include: a plurality of first chip antenna modules including the first chip antenna module; and a plurality of second chip antenna modules including the second chip antenna module. At least a portion of the plurality of first chip antenna modules and at least a portion of the plurality of second chip antenna modules may overlap in a first horizontal direction. The plurality of second chip antenna modules may be offset from the plurality of first chip antenna modules in a second horizontal direction different from the first horizontal direction.
A dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer may be different from each other.
The second feed via may be in contact with the second patch antenna pattern. The first feed via may not be in contact with the first patch antenna pattern.
In another general aspect, a chip antenna module array includes a plurality of first chip antenna modules each including: a first dielectric layer; a first solder layer disposed on a lower surface of the first dielectric layer; a first feed via forming a first feed path through the first dielectric layer; and a first patch antenna pattern disposed on a upper surface of the first dielectric layer, configured to be fed from the first feed via, and having a first resonant frequency. The chip antenna module array includes a plurality of second chip antenna module each including: a second dielectric layer a second solder layer disposed on a lower surface of the second dielectric layer; a second feed via forming a second feed path through the second dielectric layer; and a second patch antenna pattern disposed on a upper surface of the second dielectric layer, configured to be fed from the second feed via, and having a second resonant frequency different from the first resonant frequency. The chip antenna module array includes a connection member having a top surface on which the plurality of first chip antenna modules and the plurality of second chip antenna modules are spaced apart from each other and disposed in an alternating order, and electrically connected to the plurality of first chip antenna modules and the plurality of second chip antenna modules, respectively. The second feed via is in contact with the second patch antenna pattern. The first feed via is not in contact with the first patch antenna pattern.
Each of the plurality of second chip antenna modules may further include a second coupling pattern spaced apart from the second patch antenna pattern, above the second patch antenna pattern, and overlapping the second patch antenna pattern in a vertical direction. Each of the plurality of first chip antenna modules may further include third coupling patterns spaced apart from the first patch antenna pattern, above the first patch antenna pattern, and overlapping the first patch antenna pattern in a vertical direction. The second coupling pattern may include a slot and may have a ring shape. The third coupling pattern may have a polygonal shape and may not include a slot.
A size of the upper surface of the second dielectric layer may be smaller than a size of the upper surface of the first dielectric layer.
Each of the plurality of first chip antenna modules may further include: a first coupling pattern spaced apart from the first patch antenna pattern and not overlapping the first patch antenna pattern in a vertical direction; a first feed pattern extending from an upper end of the first feed via and overlapping at least a portion of the first coupling pattern, below the first coupling pattern; and a second feed pattern extending from a lower end of the first feed via and overlapping at least a portion of the first coupling pattern, below the first coupling pattern.
At least a portion of the plurality of first chip antenna modules and at least a portion of the plurality of second chip antenna modules may overlap in a first horizontal direction. The plurality of second chip antenna modules may be offset from the plurality of first chip antenna modules in a second horizontal direction different from the first horizontal direction.
A dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer may be different from each other.
In another general aspect, a chip antenna module array includes: a connection member; a first chip antenna module; and a second chip antenna module. The first chip antenna module is disposed on the connection member, is in electrical connection with the connection member, and includes: a first solder layer; a first patch antenna pattern disposed above the first solder layer; a first dielectric layer disposed between the first solder layer and the first patch antenna pattern; a first feed via forming a first feed path to the through the first dielectric layer and configured to feed the first patch antenna pattern; a first coupling pattern having a polygonal shape and excluding a slot, wherein the first coupling pattern is laterally spaced apart from the first patch antenna pattern and does not overlap the a first patch antenna pattern in a space above the first patch antenna pattern. The second chip antenna module is disposed spaced apart from the first chip antenna module on the connection member, is in electrical connection with the connection member, and includes: a second solder layer; a second patch antenna pattern disposed above the second solder layer; a second dielectric layer disposed between the second solder layer and the second patch antenna pattern; a second feed via forming a second feed path through the second dielectric layer and configured to feed the second patch antenna pattern; and a second coupling pattern having a polygonal shape and including a slot, wherein the second coupling pattern is disposed spaced apart from the second patch antenna pattern, above the second patch antenna pattern, and overlaps the second patch antenna pattern in a space above the second patch antenna pattern.
A size of an upper surface of the second dielectric layer may be smaller than a size of an upper surface of the first dielectric layer.
The first coupling pattern and the first patch antenna pattern may be disposed at a same height.
A frequency band of the first chip antenna module may be lower than a frequency band of the second chip antenna module.
Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.
Throughout the drawings and the detailed description, the same reference numerals refer to the same elements. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order. Also, descriptions of features that are known in the art may be omitted for increased clarity and conciseness.
The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.
Herein, it is noted that use of the term “may” with respect to an example or embodiment, e.g., as to what an example or embodiment may include or implement, means that at least one example or embodiment exists in which such a feature is included or implemented while all examples and embodiments are not limited thereto.
Throughout the specification, when an element, such as a layer, region, or substrate, is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween.
As used herein, the term “and/or” includes any one and any combination of any two or more of the associated listed items.
Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.
Spatially relative terms such as “above,” “upper,” “below,” and “lower” may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being “above” or “upper” relative to another element will then be “below” or “lower” relative to the other element. Thus, the term “above” encompasses both the above and below orientations depending on the spatial orientation of the device. The device may also be oriented in other ways (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein are to be interpreted accordingly.
The terminology used herein is for describing various examples only, and is not to be used to limit the disclosure. The articles “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “includes,” and “has” specify the presence of stated features, numbers, operations, members, elements, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, members, elements, and/or combinations thereof.
Due to manufacturing techniques and/or tolerances, variations of the shapes illustrated in the drawings may occur. Thus, the examples described herein are not limited to the specific shapes illustrated in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways as will be apparent after an understanding of the disclosure of this application. Further, although the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the disclosure of this application.
Referring to
The connection member may have a top surface on which a plurality of the first chip antenna modules 101a and a plurality of second chip antenna modules 102a are arranged in an alternating order while being spaced apart from each other, and the connection member may be respectively electrically connected to the plurality of first chip antenna modules 101a and the plurality of second chip antenna modules 102a. For example, the connection member may have a stacked structure in which a plurality of ground planes and a plurality of insulating layers are alternately stacked, and may be electrically connected between the plurality of first and second chip antenna modules 101a and 102a and an integrated circuit (IC).
The first chip antenna module 101a may include a first dielectric layer 150a-1, a first solder layer 138a, first feed vias 121a-1 and 121a-2, a first patch antenna pattern 111a, and coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4.
The second chip antenna module 102a may include a second dielectric layer 150a-2, a second solder layer 139a, second feed vias 122a-1 and 122a-2, a second patch antenna pattern 112a, and a second coupling pattern 114a.
Upper surfaces of the first and second dielectric layers 150a-1 and 150a-2 may be used as arrangement spaces of the first and second patch antenna patterns 111a and 112a, respectively, and lower surfaces of the first and second dielectric layers 150a-1 and 150a-2 may be used as arrangement spaces of the first and second solder layers 138a and 139a, respectively. That is, the first and second patch antenna patterns 111a and 112a may be disposed on the upper surfaces of the first and second dielectric layers 150a-1 and 150a-2, respectively, and first and second solder layers 138a and 139a may be disposed on the lower surfaces of the first and second dielectric layers 150a-1 and 150a-2, respectively.
The first and second dielectric layers 150a-1 and 150a-2 may function as passage paths for radio frequency (RF) signals radiated through lower surfaces of the first and second patch antenna patterns 111a and 112a. The RF signal may have a wavelength in the first and second dielectric layers 150a-1 and 150a-2 corresponding to the dielectric constants of the first and second dielectric layers 150a-1 and 150a-2, respectively.
A separation distance between the first and second patch antenna patterns 111a and 112a and the first and second solder layers 138a and 139a may be optimized based on the wavelength of the RF signal, and the shorter the wavelength is, the more easily the separation distance may be shortened. Therefore, the thickness of the first and second dielectric layers 150a-1 and 150a-2 in a vertical direction, for example, in the Z direction, may be more easily reduced as the dielectric constants of the first and second dielectric layers 150a-1 and 150a-2 are further increased.
The horizontal (for example, X and/or Y direction) size of each of the first and second patch antenna patterns 111a and 112a and the first and second solder layers 138a and 139a may be optimized, based on the wavelength of the RF signal. The shorter the wavelength of the RF signal is, the more easily the horizontal size of each of the first and second patch antenna patterns 111a and 112a and the first and second solder layers 138a and 139a may be reduced. Accordingly, the horizontal (for example, X and/or Y direction) sizes of the first and second dielectric layers 150a-1 and 150a-2 may be more easily reduced as dielectric constants of the first and second dielectric layers 150a-1 and 150a-2 are increased.
Therefore, the overall size of the first and second chip antenna modules 101a and 102a may be more easily reduced as the dielectric constants of the first and second dielectric layers 150a-1 and 150a-2 are increased.
In general, patch antennas may be implemented as a portion of a substrate, such as a printed circuit board (PCB), but miniaturization of patch antennas may be limited by the relatively low dielectric constant of the general insulating layer of a printed circuit board (PCB).
Since the first and second chip antenna modules 101a and 102a may be manufactured separately from a substrate such as a printed circuit board (PCB), it may be easier to implement the first and second dielectric layers 150a-1 and 150a-2 to have a higher dielectric constant than a dielectric constant of a general insulating layer of the printed circuit board (PCB).
For example, the first and second dielectric layers 150a-1 and 150a-2 may include a ceramic material configured to have a dielectric constant higher than a dielectric constant of a general insulating layer of a printed circuit board (PCB).
For example, the first and second dielectric layers 150a-1 and 150a-2 may be formed of a material having a relatively high dielectric constant, for example, a ceramic-based material such as a low temperature co-fired ceramic (LTCC) or a glass-based material. The first and second dielectric layers 150a-1 and 150a-2 may further include any one or any combination of any two or more of magnesium (Mg), silicon (Si), aluminum (Al), calcium (Ca), and titanium (Ti), thereby providing a relatively high dielectric constant or high durability. For example, the first and second dielectric layers 150a-1 and 150a-2 may include any one or any combination of any two or more of Mg2SiO4, MgAlO4, and CaTiO3.
For example, the first and second dielectric layers 150a-1 and 150a-2 may have a structure in which a plurality of dielectric layers are stacked. The spaces between the dielectric layers may be arrangement spaces of the first feed patterns 126a-1 and 126a-2 and/or the second feed patterns 127a-1 and 127a-2. In the spaces between the plurality of dielectric layers, portions in which the first feed patterns 126a-1 and 126a-2 and/or the second feed patterns 127a-1 and 127a-2 are not disposed may be filled with an adhesive material (for example, a polymer).
The first and second solder layers 138a and 139a may be configured to support mounting of the first and second chip antenna modules 101a and 102a on the connection member. For example, the first and second solder layers 138a and 139a may be disposed along the edges of the first and second dielectric layers 150a-1 and 150a-2. For example, the first and second solder layers 138a and 139a may be configured to facilitate bonding to tin-based solders having a relatively low melting point, and, thus, may include a tin plating layer and/or a nickel plating layer, to facilitate coupling to the solders.
In addition, the first and second solder layers 138a and 139a may each have a structure in which a plurality of cylinders are arranged, to efficiently support mounting of the first and second chip antenna modules 101a and 102a on the connection member.
The first feed vias 121a-1 and 121a-2 and the second feed vias 122a-1 and 122a-2 may form first and second feed paths, respectively, through the first and second dielectric layers 150a-1 and 150a-2, respectively.
For example, the first feed vias 121a-1 and 121a-2 and the second feed vias 122a-1 and 122a-2 may have a structure extending in the vertical direction in the first and second dielectric layers 150a-1 and 150a-2, respectively, and may be formed by a process of filling through-holes formed by the laser in the first and second dielectric layers 150a-1 and 150a-2 with a conductive material such as copper, nickel, tin, silver, gold, palladium, or the like.
The first patch antenna patterns 111a may be fed from the first feed vias 121a-1 and 121a-2, and the second patch antenna patterns 112a may be fed from the second feed vias 122a-1 and 122a-2. The first and second patch antenna patterns 111a and 112a may be configured to transmit and/or receive an RF signal.
For example, the first and second patch antenna patterns 111a and 112a may be formed as a conductive paste is dried in a state in which the conductive paste is applied and/or filled on the first and second dielectric layers 150a-1 and 150a-2, respectively.
The wavelength of the RF signal emitted from the first and second patch antenna patterns 111a and 112a may correspond to the horizontal direction (for example, the X direction and/or the Y direction) size of the first and second patch antenna patterns 111a and 112a. Accordingly, the first and second patch antenna patterns 111a and 112a may be configured to form a radiation pattern in the vertical direction (for example, the Z direction) while generating resonance.
When the first chip antenna module 101a is configured to have a first resonant frequency (for example, 28 GHz), the first patch antenna pattern 111a may have a size corresponding to the wavelength of the first resonant frequency. When the second chip antenna module 102a is configured to have a second resonant frequency (for example, 39 GHz) different from the first resonant frequency, the second patch antenna pattern 112a may have a size corresponding to the wavelength of the second resonant frequency.
According to an example, when the first chip antenna module 101a is configured to have the first resonant frequency, the upper surface of the first dielectric layer 150a-1 may have a size corresponding to the wavelength of the first resonant frequency, and when the second chip antenna module 102a is configured to have a second resonant frequency, the upper surface of the second dielectric layer 150a-2 may have a size corresponding to the wavelength of the second resonant frequency.
For example, when the second resonant frequency is higher than the first resonant frequency, the size of the second patch antenna pattern 112a may be smaller than the size of the first patch antenna pattern 111a, and the size of the upper surface of the second dielectric layer 150a-2 may be smaller than the size of the upper surface of the first dielectric layer 150a-1.
In the case in which the plurality of first chip antenna modules 101a and the plurality of second chip antenna modules 102a are arranged in an alternating order to be spaced apart from each other, the plurality of second chip antenna modules 102a may affect the electromagnetic boundary conditions of the plurality of first chip antenna modules 101a, and the plurality of first chip antenna modules 101a may affect the electromagnetic boundary conditions of the plurality of second chip antenna modules 102a.
For example, in the case which the plurality of first chip antenna modules 101a and the plurality of second chip antenna modules 102a are arranged in an alternating order to be spaced apart from each other, separation distances between the plurality of first and second chip antenna modules 101a and 102a may be similar to each other, and may act as an element affecting the resonant frequencies of the plurality of respective first and second chip antenna modules 101a and 102a. In such an example additionally having the first resonant frequency that is lower than the second resonant frequency, the resonant frequency based on the separation distance may be higher than the first resonant frequency, and may be lower than the second resonant frequency. Accordingly, there is an antenna design element that the antenna characteristics (for example, gain and bandwidth) of the plurality of first chip antenna modules 101a and the antenna characteristics of the plurality of second chip antenna modules 102a are to be harmonized with each other.
Accordingly, the chip antenna module array 100a, according to an example, may be configured such that an electromagnetic coupling structure of the first patch antenna pattern 111a of the first chip antenna module 101a, and an electromagnetic coupling structure of the second patch antenna pattern 112a of the second chip antenna module 102a are different from each other.
As a result, the influence of the separation distance of the plurality of first and second chip antenna modules 101a and 102a on the antenna characteristics of the plurality of first and second chip antenna modules 101a and 102a may be reduced. Therefore, the overall antenna performance of the first and second chip antenna modules 101a and 102a may be improved, and the plurality of first and second chip antenna modules 101a and 102a may be arranged more compactly.
For example, in comparison to a conventional chip antenna module array, the size of the chip antenna module array 100a for a given number of chip antenna modules in the chip antenna module array 100a may be reduced, and the antenna performance may be improved compared with the size of the chip antenna module array 100a.
The first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may be spaced apart from the first patch antenna pattern 111a in a horizontal direction (for example, in the X direction and/or the Y direction), and may not overlap the first patch antenna pattern 111a in the vertical direction (for example, the Z direction).
The second coupling pattern 114a may be disposed above (for example, in the Z direction) the second patch antenna pattern 112a so as to be spaced apart from the second patch antenna pattern 112a in the vertical direction (for example, the Z direction), and may overlap the second patch antenna pattern 112a in the vertical direction (for example, the Z direction).
Accordingly, the electromagnetic coupling direction of the first patch antenna pattern 111a may be close to the horizontal direction (for example, the X direction and/or the Y direction), and the electromagnetic coupling direction of the second patch antenna pattern 112a may be closed to the vertical direction (for example, the Z direction). Thus, the electromagnetic coupling directions of the first and second patch antenna patterns 111a and 112a may be different from each other.
Electromagnetic coupling directions of the first and second patch antenna patterns 111a and 112a may affect radiation pattern characteristics of the first and second chip antenna modules 101a and 102a.
The plurality of first and second chip antenna modules 101a and 102a may be configured such that the effect of a difference in electromagnetic coupling directions between the first and second patch antenna patterns 111a and 112a may be cancelled by the effect of a resonance frequency difference and an electromagnetic boundary condition element of the plurality of first and second chip antenna modules 101a and 102a.
Accordingly, the overall antenna performance of the plurality of first and second chip antenna modules 101a and 102a may be improved, and the plurality of first and second chip antenna modules 101a and 102a may be arranged more compactly.
Referring to
The first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may have a polygonal shape that does not include a slot.
Accordingly, the difference in electromagnetic coupling characteristics of the first and second patch antenna patterns 111a and 112a may be further increased, so that the antenna performance of the plurality of first and second chip antenna modules 101a and 102a is more freely designed. Further, the overall antenna performance of the chip antenna module array 100a may be further improved.
Referring to
Accordingly, the second chip antenna module 102a may obtain a relatively wider bandwidth without increasing the size of the second chip antenna module 102a in the horizontal direction.
The fourth coupling pattern 113a may have a polygonal shape that does not include a slot.
Accordingly, the difference between the impedance provided by the fourth coupling pattern 113a and the impedance provided by the second coupling pattern 114a may be further increased without increasing the horizontal size of the second chip antenna module 102a. Thus, the second patch antenna pattern 112a may receive more various impedances and may have a relatively wider bandwidth.
Referring to
Accordingly, since the electromagnetic coupling of the second patch antenna pattern 112a may be further concentrated in the vertical direction, the difference between the electromagnetic coupling characteristics of the first and second patch antenna patterns 111a and 112a may be further increased. Therefore, the antenna performance of the plurality of first and second chip antenna modules 101a and 102a may be designed more freely, and the overall antenna performance of the chip antenna module array 100a may be further improved.
Referring to
The first feed patterns 126a-1 and 126a-2 are disposed to be lower (for example, in the Z direction) than the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 and may extend, in an XY plane, from upper ends of the first feed vias 121a-1 and 121a-2 to overlap at least portions of the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 in the vertical direction (for example, the Z direction).
Since the first feed patterns 126a-1 and 126a-2 overlap the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 in the vertical direction (for example, the Z direction), the first feed patterns 126a-1 and 126a-2 and the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may form a first capacitance. Since the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 are electromagnetically coupled to the first patch antenna pattern 111a, the first capacitance may be transferred to the first patch antenna pattern 111a.
Therefore, the bandwidth of the first patch antenna pattern 111a may be further widened.
For example, the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may have a form extending in a first direction (for example, in an XY plane), and the first feed patterns 126a-1 and 126a-2 may have a shape extending from the upper ends of the first feed vias 121a-1 and 121a-2 in a second direction (for example in an XY plane) different from the first direction. For example, the first direction and the second direction may be perpendicular to each other.
Accordingly, the first capacitance may be easily adjusted by at least one of the second direction length, width, and a separation distance of the first feed patterns 126a-1 and 126a-2, and a bandwidth of the first patch antenna pattern 111a may be widened more efficiently.
The second feed patterns 127a-1 and 127a-2 may provide an inductance that may affect the resonant frequency of the first patch antenna pattern 111a to the first patch antenna pattern 111a. The inductance may be adjusted by adjusting the lengths of the second feed patterns 127a-1 and 127a-2.
For example, the second feed patterns 127a-1 and 127a-2 are disposed to be lower (for example, in the Z direction) than the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4, and may extend in an XY plane from lower ends of the first feed vias 121a-1 and 121a-2 to overlap at least portions of the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4.
When the second feed patterns 127a-1 and 127a-2 overlap the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 in the vertical direction (for example, the Z direction), the first feed patterns 126a-1 and 126a-2 and the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may form a second capacitance.
The distance between the second feed patterns 127a-1 and 127a-2 and the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 in the vertical direction (for example, the Z direction) may be greater than the distance between the first feed patterns 126a-1 and 126a-2 and the first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 in the vertical direction (for example, the Z direction). Thus, the second capacitance may be smaller than the first capacitance.
Since the first chip antenna module 101a may relatively easily increase the dielectric constant of the first dielectric layer 150a-1, the second capacitance may be greater than the capacitance based on a general insulating layer of a substrate such as a printed circuit board (PCB).
Therefore, the first chip antenna module 100a may not only use the first capacitance, but may also use the second capacitance.
A lowest frequency of a bandwidth of the first patch antenna pattern 111a may be efficiently implemented based on a relatively low resonant frequency based on the first capacitance, and a highest frequency of the bandwidth may be efficiently implemented based on a relatively high resonant frequency based on the second capacitance.
The second feed patterns 127a-1 and 127a-2 may have a form extending from the lower ends of the first feed vias 121a-1 and 121a-2 in the second direction. For example, the second feed patterns 127a-1 and 127a-2, the first feed vias 121a-1 and 121a-2, and the first feed patterns 126a-1 and 126a-2 may form a U shape. Accordingly, since the second capacitance may be easily adjusted by adjusting a length of the second feed patterns 127a-1 and 127a-2 in the second direction, the bandwidth of the first patch antenna pattern 111a may be more efficiently widened.
The first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 may be arranged to surround at least a portion of an edge of the first patch antenna pattern 111a. The first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4 and the first patch antenna pattern 111a may be at the same level in the Z direction.
Accordingly, since the electromagnetic coupling direction of the first patch antenna pattern 111a may be more concentrated in the horizontal direction, the difference in electromagnetic coupling characteristics of the first and second patch antenna patterns 111a and 112a may be further increased. Therefore, the antenna performance of the plurality of first and second chip antenna modules 101a and 102a may be designed more freely, and the overall antenna performance of the chip antenna module array 100a may be further improved.
The feed connection structure 128a-1 may be connected between the second feed patterns 127a-1 and 127a-2 and the detour pattern 129a-1.
The detour pattern 129a-1 may be disposed at the same level in the Z direction as the second feed patterns 127a-1 and 127a-2 or at a level lower in the Z direction than the second feed patterns 127a-1 and 127a-2, and may be electrically connected to the second feed patterns 127a-1 and 127a-2. The detour pattern 129a-1 may have a curved form extending in a path around one point.
The detour pattern 129a-1 may provide an inductance used for impedance matching of the second feed patterns 127a-1 and 127a-2, and may provide a relatively great inductance as it has a shape that is curved around one point.
Referring to
For example, the first patch antenna pattern 111a may be fed indirectly by the first feed vias 121a-1 and 121a-2, the first feed patterns 126a-1 and 126a-2, the second feed patterns 127a-1 and 127a-2, and first coupling patterns 130a-1, 130a-2, 130a-3 and 130a-4, and the second patch antenna pattern 112a may be fed directly by the second feed vias 122a-1 and 122a-2.
Accordingly, the overall coupling characteristics of the first patch antenna pattern 111a and the overall coupling characteristics of the second patch antenna pattern 112a may be different from each other.
Overall coupling characteristics of the first and second patch antenna patterns 111a and 112a may affect radiation pattern characteristics of the first and second chip antenna modules 101a and 102a.
The plurality of first and second chip antenna modules 101a and 102a may use the difference in electromagnetic coupling characteristics of the first and second patch antenna patterns 111a and 112a for canceling the differences in the electromagnetic boundary condition elements of the plurality of first and second chip antenna modules 101a, 102a.
Accordingly, the overall antenna performance of the plurality of first and second chip antenna modules 101a and 102a may be improved, and the plurality of first and second chip antenna modules 101a and 102a may be arranged more compactly.
Referring to
The plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 may include: first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4, respectively; first feed vias 121b-1, 121b-2, 121b-3, 121b-4, respectively; first solder layers 138a-1, 138a-2, 138a-3, and 138a-4, respectively; and a third coupling patterns 115b-1, 115b-2, 115b-3, and 115b-4, respectively.
The third coupling patterns 115b-1, 115b-2, 115b-3, and 115b-4 may be disposed to overlap with the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4, respectively, in the vertical direction (for example, the Z direction), and may be spaced apart from the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4, respectively, in the vertical direction (for example, the Z direction).
Accordingly, since the third coupling patterns 115b-1, 115b-2, 115b-3, and 115b-4 have additional resonant impedances that are respectively provided to the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4, the bandwidth of the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 may be wider.
In addition, the third coupling patterns 115b-1, 115b-2, 115b-3, and 115b-4 may have a polygonal shape that does not include a slot.
Accordingly, since the difference in the electromagnetic coupling characteristics of the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 and the plurality of second chip antenna modules 102a-1, 102a-2, 102a-3, and 102a-4 may be greater, the antenna performance of the plurality of first and second chip antenna modules 101b-1, 101b-2, 101b-3, 101b-4, 102a-1, 102a-2, 102a-3 and 102a-4 may be more freely designed, and the overall antenna performance of the chip antenna module array 100b may be further improved.
Referring to
For example, in an example in which upper surfaces of the first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 and the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 have a shape of a quadrangle, respectively, the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 may be rotated 45 degrees with respect to the top surface of the respective first chip antenna module 101b-1, 101b-2, 101b-3, or 101b-4. In an example in which the top surfaces of the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 have a shape of a square, the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 may have a shape of a rhombus.
Since surface currents of the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 may flow from one side to another side of the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4, respectively, the electric field according to the surface currents may be formed in a first horizontal direction. The magnetic field according to the surface current may be formed in a second horizontal direction.
In an example in which at least some sides of the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 are oblique to each side of the upper surface of the a respective first chip antenna module 101b-1, 101b-2, 101b-3, or 101b-4, horizontal directions of electric field and the magnetic field according to the surface currents of the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, 101b-4 may be rotated in comparison to a configuration in which sides of patch antenna patterns are parallel to corresponding sides of an upper surface of a respective chip antenna module.
In order to reduce the overall size of the chip antenna module array 100b, the chip antenna modules 101b-1, 101b-2, 101b-3, 101b-4, 102a-1, 102a-2, 102a-3, 102a-4 may be disposed such that side surfaces of the first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 are parallel to side surfaces of the second chip antenna modules 102a-1, 102a-2, 102a-3, 102a-4. In such an example, horizontal directions of the electric field and the magnetic field according to the surface current of the first patch antenna patterns 111b-1, 111b-2, 111b-3, and 111b-4 may be different from an arrangement direction of the plurality of first and second chip antenna modules.
Accordingly, the electromagnetic interference between the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 and the plurality of second chip antenna modules 102a-1, 102a-2, 102a-3, and 102a-4 may be reduced, the overall gain of the chip antenna module array 100b may be improved, and the overall size of the chip antenna module array 100b may be reduced.
Referring to
Accordingly, the electromagnetic interference between the plurality of second chip antenna modules 102a-1, 102a-2, 102a-3, and 102a-4 and the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4 may be reduced, the overall gain of the chip antenna module array 100b according to an example may be improved, and the overall size of the chip antenna module array 100b may be reduced.
Referring to
Referring to
Referring to
Referring to
Accordingly, since the effects of the electric and magnetic fields of the plurality of first chip antenna modules 101b-1, 101b-2, 101b-3, and 101b-4/101c-1, 101c-2, 101c-3, and 101c-4 and the plurality of second chip antennas modules 102a-1, 102a-2, 102a-3, and 102a-4/102b-1, 102b-2, 102b-3 and 102b-4 on each other may be further reduced, chip antenna module arrays 100f, 100g, and 100h may have a further improved gain.
Referring to
Each of the endfire antennas ef1, ef2, ef3, and ef4 may include a plurality of endfire antenna patterns 210a and a feed line 220a, and may further include a director pattern 215a.
Referring to
Each of the endfire antennas ef5, ef6, ef7, and ef8 may include a radiator body 431 and a dielectric body 432, respectively.
Referring to
Referring to
For example, the connection member 200 may have a structure in which the first ground plane 201a and second, third and fourth ground planes 202a, 203a, and 204a are sequentially stacked in an alternating order with a plurality of insulating layers. A connection-member solder layer 180a or the peripheral via 185a may be further included in the connection member 200.
Referring to
Referring to
Referring to
For example, the 1-3-th, 1-5-th, 2-3-th, and 2-5-th dielectric layers 151b-1, 151c-1, 151b-2, and 151c-2 may include the same material as a material of the first and second dielectric layers 151a-1 and 151a-2, and the 1-2-th and 1-4-th dielectric layers 152b-1 and 152c-1 may include the same material as a material of the 2-2-th and 2-4-th dielectric layers 152b-2 and 152c-2.
For example, the 1-2-th, 1-4-th, 2-2-th, and 2-4-th dielectric layers 152b-1, 152c-1, 152b-2, and 152c-2 may include materials different from those of the first, 1-3-th, 1-5-th, second, 2-3-th and 2-5-th dielectric layers 151a-1, 151b-1, 151c-1, 151a-2, 151b-2 and 151c-2. For example, the 1-2-th, 1-4-th, 2-2-th, and 2-4-th dielectric layers 152b-1, 152c-1, 152b-2, and 152c-2 may include a polymer having adhesive properties for increasing bonding force between the first, 1-3-th, 1-5-th, second, 2-3-th and 2-5-th dielectric layers 151a-1, 151b-1, 151c-1, 151a-2, 151b-2, and 151c-2. For example, the 1-2-th, 1-4-th, 2-2-th, and 2-4-th dielectric layers 152b-1, 152c-1, 152b-2, and 152c-2 may include ceramic materials having a dielectric constant lower than that of the first, 1-3-th, 1-5-th, second, 2-3-th and 2-5-th dielectric layers 151a-1, 151b-1, 151c-1, 151a-2, 151b-2, and 151c-2 to form dielectric medium interfaces between the first, 1-3-th, 1-5-th, second, 2-3-th and 2-5-th dielectric layers 151a-1, 151b-1, 151c-1, 151a-2, 151b-2, and 151c-2, may include a material having relatively high flexibility such as liquid crystal polymer (LCP) or polyimide, or may include materials such as an epoxy resin or Teflon to have relatively strong durability and relatively high adhesion.
The dielectric medium interface may refract the propagation direction of the RF signal to further concentrate the direction of forming the radiation pattern of the chip antenna module 100b in the vertical direction (for example, Z direction).
Referring to
Referring to
Referring to
Meanwhile, the dielectric constants of the first and second dielectric layers 151a-1 and 151a-2 may be different from each other.
For example, when the first frequency band of the first chip antenna module 101a is lower than the second frequency band of the second chip antenna module 102a, and the dielectric constant of the first dielectric layer 151a-1 is higher than the dielectric constant of the second dielectric layer 151a-2, the difference between the size of the first chip antenna module 101a and the size of the second chip antenna module 102a may be small.
Accordingly, since the arrangement regularity of a structure in which the plurality of first chip antenna modules 101a and the plurality of second chip antenna modules 102a are arranged in an alternating order may be further improved, the plurality of first chip antenna modules 101a and the plurality of first chip antenna modules 101a may be improved. The plurality of second chip antenna modules 102a may be arranged more compactly in general while ensuring antenna performance for the first and second frequency bands.
Referring to
The IC 310 may be disposed under the connection member 200, and frequency conversion, amplification, filtering, and may perform phase control on the RF signal remotely transmitted and/or received by a chip antenna module according to an embodiment disclosed herein. The IC 310 may be electrically connected to wiring of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to the ground plane 201a of the connection member 200 to receive ground.
The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.
The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, or pads. The electrical connection structure 330 may have a lower melting point than the wiring and the ground plane 201a of the connection member 200, and may be electrically connected the IC 310 and the connection member 200 through a predetermined process using the low melting point.
The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented by a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.
The passive component 350 may be disposed on the lower surface of the connection member 200, and may be electrically connected to the wiring and/or the ground plane 201a of the connection member 200 through the electrical connection structure 330. For example, the passive component 350 may include any one or any combination of any two or more of a capacitor (for example, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.
The core member 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside environment and transmit the received IF signal to the IC 310 or from the IC 310. The core member 410 may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside environment. In such an example, the frequency (for example, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (for example, 2 GHz, 5 GHz, 10 GHz, etc.).
For example, the core member 410 may transmit or receive an IF signal or a baseband signal to or from the IC 310 through a wire that may be included in the IC ground plane of the connection member 200.
Referring to
The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shielding member 360 may be arranged to cover (for example, conformally shield) the IC 310 and the passive component 350 together or to separately cover (for example, compartmentally shield) the IC 310 and the passive component 350. For example, the shielding member 360 may have a shape of a hexahedron having one surface open, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a material having high conductivity such as copper to have a short skin depth, and may be electrically connected to the ground plane 201a of the connecting member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.
The connector 420 may have a connection structure of a cable (for example, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground plane of the connection member 200, and may have a function similar to that of the core member 410 described above. For example, the connector 420 may receive an IF signal, a baseband signal and/or a power from a cable, or provide an IF signal and/or a baseband signal to a cable.
The end-fire chip antenna 430 may transmit or receive an RF signal in support of a chip antenna module, according to an example. For example, the end-fire chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both sides of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground plane 201a of the connection member 200.
Referring to
The electronic device 700g may be, for example, a smartphone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a personal computer, a monitor, a tablet, a laptop, a netbook, a television, a video game device, a smartwatch, an automotive component, or the like, but is not limited to the foregoing examples.
A communication module 610g and a baseband circuit 620g may also be disposed on the set substrate 600g. The chip antenna module may be electrically connected to the communication module 610g and/or the baseband circuit 620g through a coaxial cable 630g.
The communication module 610g may include: a memory chip such as volatile memory (for example, DRAM), non-volatile memory (for example, ROM), or flash memory to perform digital signal processing; application processor chips such as central processors (for example, CPUs), graphics processors (for example, GPUs), digital signal processors, cryptographic processors, microprocessors, and/or microcontrollers; and at least a portion of a logic chip, such as an analog-to-digital converter, or an application-specific IC (ASIC).
The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on an analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the chip antenna module through a cable.
For example, the base signal may be transmitted to the IC through an electrical connection structure, core vias, and wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.
Referring to
Referring to
The dielectric and insulating layers disclosed herein may be formed of an FR4, a liquid crystal polymer (LCP), a low temperature co-fired ceramic (LTCC), a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide resin, a resin in which the thermosetting resin or the thermoplastic resin is mixed with an inorganic filler or is impregnated together with an inorganic filler in a core material such as a glass fiber (or a glass cloth or a glass fabric), for example, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), or the like, a photoimageable dielectric (PID) resin, a copper clad laminate (CCL), a glass or ceramic-based insulating material, or the like.
The patterns, the vias, the planes, the strips, the lines, and the electrical connection structures disclosed herein may include a metal material (for example, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), alloys thereof, or the like), and may be formed using a plating method such as chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, a subtractive process, an additive process, a semi-additive process (SAP), a modified semi-additive process (MSAP), or the like, but are not limited to the foregoing materials and formation methods.
RF signals disclosed herein may be Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, or EDGE signals. The RF signals may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated.
As set forth above, a chip antenna module array according to embodiments disclosed herein may provide a transmission and reception means for a plurality of different frequency bands to improve the antenna performance (for example, gain, bandwidth, directivity, transmission and reception rate, and the like), and/or may be easily miniaturized.
While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2019-0149272 | Nov 2019 | KR | national |
This application is a continuation of application Ser. No. 16/822,867 filed on Mar. 18, 2020, which claims the benefit under 35 USC § 119(a) of Korean Patent Application No. 10-2019-0149272 filed on Nov. 20, 2019 in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.
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| Entry |
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| Korean Office Action dated Oct. 14, 2020 in counterpart Korean Patent Application No. 10-2019-0149272. (6 pages in English, 5 pages in Korean). |
| Number | Date | Country | |
|---|---|---|---|
| 20220231431 A1 | Jul 2022 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 16822867 | Mar 2020 | US |
| Child | 17715425 | US |
