Claims
- 1. A method of manufacturing a chip coil, comprising the steps of:
- (a) preparing a substrate having an insulating surface;
- (b) forming a conductive film on the whole insulating surface of said substrate by a thin-film technique;
- (c) removing an unnecessary portion of said conductive film by etching to form a coil conductor and a pair of terminal electrodes;
- (d) forming an insulation film of a polyimide or polyamide resin on said substrate so as to cover said coil conductor and said pair of terminal electrodes; and
- (e) removing an unnecessary portion of said insulation film by photolithographic etching to expose at least said pair of terminal electrodes.
- 2. A manufacturing method in accordance with claim 1, wherein said step (c) includes a step of forming a spiral coil conductor, the outermost end of which is connected to one terminal electrode and the innermost end of which is open.
- 3. A manufacturing method in accordance with claim 2, further comprising the steps of: (f) etching said insulation film by photolithography to form a throughhole at a portion corresponding in position to said innermost end of said spiral coil conductor; and (g) forming a connecting conductor which connects said innermost end of said spiral coil conductor to the other terminal electrode through said throughhole on said insulation film.
- 4. A manufacturing method in accordance with claim 3, wherein said step (g) includes the steps of (g-1) forming a further conductive film on the whole surface of said insulation film and (g-2) etching said further conductive film to form said connecting conductor.
- 5. A manufacturing method in accordance with claim 4, further comprising steps of: (h) forming a further insulation film on said substrate so as to cover said terminal electrodes, said insulation film and said connecting conductor; and (i) removing an unnecessary portion of said further insulation film to expose said first and second terminal electrodes.
- 6. A manufacturing method in accordance with claim 1, wherein said insulation film is formed in step (d) of a polyimide or polyamide resin having photosensitivity.
- 7. A manufacturing method in accordance with claim 1, wherein said insulation film is formed in step (d) of a polyimide or polyamide film having substantially no photosensitivity, and said step of removing an unnecessary portion of said insulation film in step (e) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.
- 8. A manufacturing method in accordance with claim 3, wherein said insulation film is formed in step (d) of a polyimide or polyamide resin having photosensitivity.
- 9. A manufacturing method in accordance with claim 3, wherein said insulation film is formed in step (d) of a polyimide or polyamide film having substantially no photosensitivity, and said step of removing an unnecessary portion of said insulation film in step (e) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.
- 10. A manufacturing method in accordance with claim 9, wherein step (f) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.
Priority Claims (1)
Number |
Date |
Country |
Kind |
63-206951 |
Aug 1988 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 07/395,907 filed on Aug. 18, 1981, now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0051902A1 |
May 1982 |
EPX |
60-15905 |
Jan 1985 |
JPX |
60-246605 |
Dec 1985 |
JPX |
1394086A |
May 1975 |
GBX |
1416246A |
Dec 1975 |
GBX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
395907 |
Aug 1989 |
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