Claims
- 1. A method of packaging a microarray comprising:
placing a microarray in a well of a well plate; wherein the microarray is suspended in the well.
- 2. The method of claim 1, wherein the well plate has one of more wells.
- 3. The method of claim 1, wherein the microarray is suspended in the well with buffer.
- 4. The method of claim 1, wherein the microarray is suspended in the well without buffer.
- 5. The method of claim 1, wherein the plate has an optically clear window.
- 6. The method of claim 5, wherein the clear window is made of fused silica.
- 7. A method of scanning a microarray chip comprising:
dicing one or more wafers into individual microarrays; placing the individual microarrays into a well of a well plate; wherein the individual microarrays are conatined into the well in a suspended form with an optically clear window; scanning the microarrays through the optically clear window.
- 8. The method of scanning a microarray of claim 7, wherein the optically clear window is made of fused silica.
- 9. The method of scanning a microarray of claim 7, wherein the scanning can be done with the surface of the individual microarray up.
- 10. The method of scanning a microarray of claim 7, wherein the scanning can be done with the surface of the individual microarray down.
- 11. The method of scanning a microarray of claim 7, wherein the well plate has one or more wells.
PRIORITY CLAIM
[0001] This application claims the priority of U.S. Provisional Application Serial No. 60/433,186, filed on Dec. 13, 2002, which is incorporated herein by reference for all purposes
Provisional Applications (1)
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Number |
Date |
Country |
|
60433186 |
Dec 2002 |
US |