Chip type resistor

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a structure and manufacturing method of a chip type resistor having a resistive film and terminal electrodes positioned at opposing ends of the resistive film, formed on a chip type insulating substrate.
2. Description of the Background Art
In a conventional chip type resistor such as described in Japanese Patent Laying-Open No. 60-27104, a cover coat covering a resistive film formed on a surface of a chip type insulating substrate is protruded from a surface of terminal electrodes positioned at opposing ends of the resistive film, so that there is a considerable step between the surface of the cover coat and the surface of the terminal electrodes. Therefore, it suffers from the problem that when the chip type resistor is soldered on a printed board with the side of the resistive film facing the printed board, one side of the chip type resistor rises or floats, preventing secure soldering.
In view of the foregoing, Japanese Patent Laying-Open No. 4-102302 discloses a structure of a chip type resistor in which terminal electrodes 3 are formed at opposing ends of a resistive film 2 on left and right end portions of a chip type insulating substrate 1 such that the terminal electrodes 3 each includes a main upper electrode 3a formed on the surface of insulating substrate 1 and conductive to resistive film 2, an auxiliary upper electrode 3b formed heaped up on the surface of main upper electrode 3a, a side electrode 3c formed on either side of insulating substrate 1, and a metal plate layer 3d formed over the surfaces of auxiliary upper electrode 3b and side electrode 3c, as shown in FIGS. 123 and 124. This laid-open patent application proposes, by this structure, to reduce or eliminate the step between the surface of terminal electrode 3 and the surface of cover coat 4 covering resistive film 2.
Cover coat 4 has a three-layered structure including an undercoat 4a directly covering resistive film 2, a middle coat 4b covering undercoat 4a, and an overcoat covering middle coat 4b. The undercoat and/or middle coat may be omitted.
The chip type resistor disclosed in Japanese Patent Laying-Open No. 4-102302 is manufactured through the following steps.
Step 1. On an upper surface of the insulating substrate, main upper electrodes 3a are formed and thereafter resistive film 2 is formed. Alternatively, resistive film 2 is formed first and thereafter main upper electrodes 3a are formed.
Step 2. Undercoat 4a of glass is formed on resistive film 2 (the undercoat may be omitted). Thereafter, resistive film 2 and undercoat 4a are engraved to form a trimming groove by laser beam irradiation, for example, while resistance value of resistive film 2 is measured by a conductive probe which is brought into contact with main upper electrodes 3a so that the resistance value of resistive film 2 is within a prescribed tolerable range.
Step 3. Middle coat 4b of glass is formed on the surface of undercoat 4a to fill the trimming groove. (The middle coat may be omitted.) Thereafter, overcoat 4c of glass or a synthetic resin is formed covering resistive film 2, part of the main upper electrodes 3a, undercoat 4a and middle coat 4b.
Step 4. On the surface of main upper electrodes 3a, auxiliary upper electrodes 3b are formed by heaping up a conductive paste. Thereafter, side electrodes 3c are formed on end surfaces of insulating substrate 1, and surfaces of auxiliary upper electrodes 3b and side electrodes 3c are subjected to metal plating, whereby a metal plate layer 3d is formed.
In the above described chip type resistor, the step between terminal electrodes 3 and cover coat 4 is reduced or eliminated by forming auxiliary electrodes 3b on the upper surfaces of the main upper electrodes 3a by heaping up the conductive paste thick. In other words, auxiliary upper electrodes 3b are formed simply by heaping up the conductive paste. Therefore, in order to reduce or eliminate the step between terminal electrodes 3 and cover coat 4, considerably large amount of conductive paste is used, which leads to higher cost for the material and therefore higher manufacturing cost, as well as to increased weight of the chip type resistor.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a chip type resistor having such a structure that can perfectly prevent rising or floating of an electrode of the resistor when the resistor is mounted by soldering to a printed board, even when it is mounted upside down.
Another object of the present invention is to provide a method of manufacturing the chip type resistor attaining the above described object, which suppresses increase in cost of the chip type resistor by reducing amount of material used for the chip type resistor.
The above described objects of the present invention can be attained by the chip type resistor in accordance with one aspect of the present invention having terminal electrodes positioned at opposing ends of a resistive film formed at left and right end portions of an insulating substrate, the terminal electrodes each including at least a main upper electrode formed on a surface of the insulating substrate and conductive to the resistive film, an auxiliary upper electrode formed on an upper surface of the main upper electrode, and a side electrode formed on a side surface of the insulating substrate, the chip type resistor further having a cover coat including at least a middle coat and an overcoat, covering the resistive film, wherein
the middle coat of said cover coat has an extension or an enclave (isolated patch) on a surface of the main upper electrode of the terminal electrode, and the auxiliary upper electrode is formed on the surface of the extension or the enclave of the middle coat.
According to an aspect, the method of manufacturing the chip type resistor in accordance with the present invention includes the following steps.
A resistive film and a pair of left and right main upper electrodes are formed on an insulating substrate. The resistive film is adjusted by trimming. A middle coat covering the resistive film is formed such that the middle coat has an extension or an enclave on the surface of the main upper electrodes. An overcoat is formed covering the middle coat. Auxiliary upper electrodes are formed extending over both the surfaces of the main upper electrodes and the extension or enclave of the middle coat. Side electrodes are formed on left and right end surfaces of the insulating substrate.
According to the chip type resistor and manufacturing method thereof, an extension or enclave of the middle coat, which is a part of the cover coat, is formed on the surface of the main upper electrodes of the terminal electrodes, and auxiliary upper electrodes are formed on the surface of the extension or the enclave of the middle coat. Therefore, the main upper electrode, the extension or enclave of the middle coat and the auxiliary upper electrode constitute a three-layered structure. Therefore, height from the surface of the insulating substrate to the surface of the auxiliary upper electrode is the sum of the thickness of the main upper electrode, the thickness of the auxiliary upper electrode and the thickness of the extension or enclave of the middle coat. As a result, thickness of the auxiliary upper electrode can be reduced by the thickness of the middle coat at the extension or the enclave.
Therefore, the amount of conductive paste used for forming the auxiliary upper electrode can be reduced, whereby the cost for the material can be reduced. Further, since the extension or enclave of the middle coat can be formed simultaneously with the middle coat without the necessity of adding any separate step, manufacturing cost can be reduced and the weight can also be reduced. Further, when the surface of the terminal electrodes is to be formed protruding from the surface of the cover coat, the number of application of the conductive paste for the auxiliary upper electrodes by screen printing is not increased.
Preferably, the extension or enclave of the middle coat, which is a component of the cover coat, is formed partially on the surface of the main upper electrode and the auxiliary upper electrode is formed extending over both the surface of the extension or enclave of the middle coat and the surface of the main upper electrode, so that the above described effects are provided and, in addition, the auxiliary upper electrode and the main upper electrode can surely and firmly integrated to be electrically conductive with each other.
The above described objects of the present invention can be attained by the chip type resistor in accordance with another aspect of the present invention having terminal electrodes positioned at opposing ends of a resistive film formed at left and right end portions of an insulating substrate, the terminal electrodes each including at least a main upper electrode formed on a surface of the insulating substrate and conductive to the resistive film, an auxiliary upper electrode formed on an upper surface of the main upper electrode, and a side electrode formed on a side surface of the insulating substrate, the chip type resistor further having a cover coat including at least an undercoat and an overcoat, covering the resistive film, wherein
the undercoat of said cover coat has an extension or an enclave (isolated patch) on a surface of the main upper electrode of the terminal electrode, and the auxiliary upper electrode is formed on the surface of the extension or the enclave of the undercoat.
According to another aspect, the method of manufacturing the chip type resistor in accordance with the present invention includes the following steps.
A resistive film and a pair of left and right main upper electrodes are formed on an insulating substrate. An undercoat covering the resistive film is formed such that the undercoat has an extension or an enclave on the surface of the main upper electrodes. The resistive film is adjusted by trimming. An overcoat is formed covering the undercoat. Auxiliary upper electrodes are formed extending over both the surfaces of the main upper electrodes and the extension or enclave of the undercoat. Side electrodes are formed on left and right end surfaces of the insulating substrate.
According to the chip type resistor and manufacturing method thereof, an extension or enclave of the undercoat, which is a part of the cover coat, is formed on the surface of the main upper electrodes of the terminal electrodes, and auxiliary upper electrodes are formed on the surface of the extension or the enclave of the undercoat. Therefore, the main upper electrode, the extension or enclave of the undercoat and the auxiliary upper electrode constitute a three-layered structure. Therefore, height from the surface of the insulating substrate to the surface of the auxiliary upper electrode is the sum of the thickness of the main upper electrode, the thickness of the auxiliary upper electrode and the thickness of the extension or enclave of the undercoat. As a result, thickness of the auxiliary upper electrode can be reduced by the thickness of the undercoat at the extension or the enclave.
Therefore, the amount of conductive paste used for forming the auxiliary upper electrode can be reduced, whereby the cost for the material can be reduced. Further, since the extension or enclave of the undercoat can be formed simultaneously with the undercoat without the necessity of adding any separate step, manufacturing cost can be reduced and the weight can also be reduced. Further, when the surface of the terminal electrodes is to be formed protruding from the surface of the cover coat, the number of application of the conductive paste for the auxiliary upper electrodes by screen printing is not increased.
Preferably, the extension or enclave of the undercoat, which is a component of the cover coat, is partially formed on the surface of the main upper electrode, and the auxiliary upper electrode is formed extending over both the surface of the extension or enclave of the undercoat and the surface of the main upper electrode, so that the above described effects are provided, contact of a conductive probe with the main upper electrode is ensured at the time of adjustment of the resistive film by trimming, and in addition, the auxiliary upper electrode and the main upper electrode can surely and firmly be integrated to be electrically conductive with each other.
The above described objects of the present invention can be attained by the chip type resistor in accordance with a still further aspect of the present invention having terminal electrodes positioned at opposing ends of a resistive film formed at left and right end portions of an insulating substrate, the terminal electrodes each including at least a main upper electrode formed on a surface of the insulating substrate and conductive to the resistive film, an auxiliary upper electrode formed on an upper surface of the main upper electrode, and a side electrode formed on a side surface of the insulating substrate, the chip type resistor further having a cover coat including at least an overcoat, covering the resistive film, wherein
the overcoat has an extension or an enclave (isolated patch) on a surface of the main upper electrode of the terminal electrode, and the auxiliary upper electrode is formed on the surface of the extension or the enclave of the overcoat.
According to a still further aspect, the method of manufacturing the chip type resistor in accordance with the present invention includes the following steps.
A resistive film and a pair of left and right main upper electrodes are formed on an insulating substrate. The resistive film is adjusted by trimming. An overcoat covering the resistive film is formed such that the overcoat has an extension or an enclave on the surface of the main upper electrodes. Auxiliary upper electrodes are formed extending over both the surface of the main upper electrodes and the extension or enclave of the overcoat. Side electrodes are formed on left and right end surfaces of the insulating substrate.
According to the chip type resistor and manufacturing method thereof, an extension or enclave of the overcoat, which is a part of the cover coat, is formed on the surface of the main upper electrodes of the terminal electrodes, and auxiliary upper electrodes are formed on the surface of the extension or the enclave of the overcoat. Therefore, the main upper electrode, the extension or enclave of the overcoat and the auxiliary upper electrode constitute a three-layered structure. Therefore, height from the surface of the insulating substrate to the surface of the auxiliary upper electrode is the sum of the thickness of the main upper electrode, the thickness of the auxiliary upper electrode and the thickness of the extension or enclave of the overcoat. As a result, thickness of the auxiliary upper electrode can be reduced by the thickness of the overcoat at the extension or the enclave.
Therefore, the amount of conductive paste used for forming the auxiliary upper electrode can be reduced, whereby the cost for the material can be reduced. Further, since the extension or enclave of the overcoat can be formed simultaneously with the overcoat without the necessity of adding any separate step, manufacturing cost can be reduced and the weight can also be reduced. Further, when the surface of the terminal electrodes is to be formed protruding from the surface of the cover coat, the number of application of the conductive paste for the auxiliary upper electrodes by screen printing is not increased.
Preferably, the extension or enclave of the overcoat, which is a component of the cover coat, is formed partially on the surface of the main upper electrode, and the auxiliary upper electrode is formed extending over both the surface of the extension or enclave of the overcoat and the surface of the main upper electrode, so that the above described effects are provided and, in addition, the auxiliary upper electrode and the main upper electrode can surely and firmly integrated to be electrically conductive with each other.
According to a still further aspect, the above described object can be attained by the chip type resistor of the present invention having terminal electrodes positioned at opposing ends of a resistive film at left and right end portions of an insulating substrate, the terminal electrodes each including a main upper electrode conductive to the resistive film on the surface of the insulating substrate and an auxiliary upper electrode formed on a surface of the main upper electrode, the chip type resistor further having a cover coat covering the resistive film formed on the surface of the insulating substrate, in which extensions or enclaves of the cover coat are formed on opposing sides of the main upper electrode, and an auxiliary upper electrode is formed at a portion between the extensions or enclaves positioned on opposing sides of the surface of the main upper electrode.
Preferably, the extension or enclave of the cover coat may be an extension or enclave of the undercoat, middle coat or overcoat, which is one layer of the cover coat.
According to a still further aspect, the method of manufacturing a chip type resistor of the present invention includes the following steps. A resistive film and a pair of left and right main upper electrodes are formed on an insulating substrate. A cover coat covering the resistive film is formed with extensions or enclaves positioned on opposing sides of each of the main upper electrodes. An auxiliary upper electrode is formed at a portion between the extensions or enclaves positioned on opposing sides of the surface of each of the main upper electrodes.
Preferably, the extension or enclave of the cover coat may be an extension or enclave of the undercoat, middle coat or overcoat, which is one layer of the cover coat.
According to the chip type resistor and manufacturing method thereof described above, extensions or enclaves of the cover coat are formed on opposing sides of the main upper electrode of the terminal electrode. The auxiliary upper electrode is formed at a portion between the extensions or enclaves positioned on opposing sides of the surface of the main upper electrode. Therefore, when the auxiliary upper electrode is formed by application of a conductive paste by screen printing or the like followed by sintering, the extensions or enclaves positioned on both sides thereof function as dams preventing the conductive paste applied to the portion therebetween from flowing in the widthwise direction of the insulating substrate. As a result, the height of the auxiliary upper electrode from the surface of the main upper electrode can be increased with smaller amount of conductive paste.
Therefore, when the height from the surface of the insulating substrate to the surface of the auxiliary upper electrode is made higher to be approximately equal to the height from the surface of the insulating substrate to the surface of the cover coat to reduce or eliminate the step therebetween, the amount of conductive paste necessary for forming the auxiliary upper electrode can be reduced. Therefore, as compared with the prior art, the cost of the material, the manufacturing cost and the weight of the resistor can be reduced.
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with a first embodiment.
FIG. 2 is a perspective view showing a state in which a resistive film and thereafter an undercoat are formed on the insulating substrate shown in FIG. 1.
FIG. 3 is a plan view showing a state in which a middle coat is formed on the insulating substrate shown in FIG. 1.
FIG. 4 is a cross section taken along the line A--A of FIG. 3.
FIG. 5 is a cross section taken along the line B--B of FIG. 3.
FIG. 6 is a plan view showing a state in which an overcoat is formed on the insulating substrate.
FIG. 7 is a cross section taken along the line C--C of FIG. 6.
FIG. 8 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 9 is a cross section taken along the line D--D of FIG. 8.
FIG. 10 is a cross section taken along the line E--E of FIG. 8.
FIG. 11 is a vertical section showing a chip type resistor in accordance with the first embodiment.
FIG. 12 is a cross section taken along the line F--F of FIG. 11.
FIGS. 13 to 19 are plan views showing first to seventh modifications of the middle coat in accordance with the first embodiment.
FIG. 20 is a plan view showing a state in which main upper electrodes, a resistive film, an undercoat and a middle coat are formed on an insulating substrate in accordance with a second embodiment.
FIG. 21 is a cross section taken along the line G--G of FIG. 20.
FIG. 22 is a plan view showing a state in which an overcoat is formed on the insulating substrate.
FIG. 23 is a cross section taken along the line H--H of FIG. 22.
FIG. 24 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 25 is a cross section taken along the line I--I of FIG. 24.
FIG. 26 is a vertical section showing a chip type resistor in accordance with the second embodiment.
FIG. 27 is a cross section taken along the line J--J of FIG. 26.
FIG. 28 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with a third embodiment.
FIG. 29 is a perspective view showing a state in which a resistive film is formed on the insulating substrate.
FIG. 30 is a plan view showing a state in which an undercoat is formed on the insulating substrate.
FIG. 31 is a cross section taken along the line A--A of FIG. 30.
FIG. 32 is a cross section taken along the line B--B of FIG. 31.
FIG. 33 is a plan view showing a state in which a trimming groove is engraved in the resistive film on the insulating substrate.
FIG. 34 is a plan view showing a state in which a middle coat is formed on the insulating substrate.
FIG. 35 is a cross sections taken along the line C--C of FIG. 34.
FIG. 36 is a plan view showing a state in which an overcoat is formed on the insulating substrate.
FIG. 37 is a cross section taken along the line D--D of FIG. 36.
FIG. 38 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 39 is a cross section taken along the line E--E of FIG. 38.
FIG. 40 is a cross section taken along the line F--F of FIG. 38.
FIG. 41 is a vertical section showing a chip type resistor in accordance with the third embodiment.
FIG. 42 is a cross section taken along the line G--G of FIG. 41.
FIGS. 43 to 47 are plan views showing first to fifth modifications of the middle coat in accordance with the third embodiment.
FIG. 48 is a plan view showing a state in which main upper electrodes, a resistive film and an undercoat are formed on an insulating substrate in accordance with a fourth embodiment.
FIG. 49 is a cross section taken along the line H--H of FIG. 48.
FIG. 50 is a plan view showing a state in which a middle coat is formed on the insulating substrate.
FIG. 51 is a cross section taken along the line I--I of FIG. 50.
FIG. 52 is a plan view showing a state in which an overcoat is formed on the insulating substrate.
FIG. 53 is a cross section taken along the line J--J of FIG. 52.
FIG. 54 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 55 is a cross section taken along the line K--K of FIG. 54.
FIG. 56 is a vertical section showing a chip type resistor in accordance with the fourth embodiment.
FIG. 57 is a cross section taken along the line L--L of FIG. 56.
FIG. 58 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with a fifth embodiment.
FIG. 59 is a perspective view showing a state in which a resistive film and thereafter an undercoat are formed on the insulating substrate.
FIG. 60 is a plan view showing a state in which a middle coat is formed on the insulating substrate.
FIG. 61 is a cross section taken along the line A--A of FIG. 60.
FIG. 62 is a plan view showing a state in which an overcoat is formed on the insulating substrate.
FIG. 63 is a cross section taken along the line B--B of FIG. 62.
FIG. 64 is a cross section taken along the line C--C of FIG. 62.
FIG. 65 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 66 is a cross section taken along the line D--D of FIG. 65.
FIG. 67 is a cross section taken along the line E--E of FIG. 65.
FIG. 68 is a vertical section showing a chip type resistor in accordance with the fifth embodiment.
FIG. 69 is a cross section taken along the line F--F of FIG. 68.
FIG. 70 is a plan view showing a modification of the middle coat in accordance with the fifth embodiment.
FIG. 71 is a plan view showing another modification of the middle coat in accordance with the fifth embodiment.
FIG. 72 is a plan view showing a still further modification of the middle coat in accordance with the fifth embodiment.
FIG. 73 is a plan view showing a state in which main upper electrodes, a resistive film, an undercoat, a middle coat and an overcoat are formed on an insulating substrate in accordance with a sixth embodiment.
FIG. 74 is a cross section taken along the line G--G of FIG. 73.
FIG. 75 is a cross section taken along the line H--H of FIG. 75.
FIG. 76 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate.
FIG. 77 is a cross section taken along the line I--I of FIG. 76.
FIG. 78 is a cross section taken along the line J--J of FIG. 76.
FIG. 79 is a vertical section showing a chip type resistor in accordance with the sixth embodiment.
FIG. 80 is a cross section taken along the line K--K of FIG. 79.
FIG. 81 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with a seventh embodiment.
FIG. 82 is a perspective view showing a state in which a resistive film and thereafter an undercoat are formed on the insulating substrate in accordance with the seventh embodiment.
FIG. 83 is a plan view showing a state in which a middle coat is formed on the insulating substrate in accordance with the seventh embodiment.
FIG. 84 is a cross section taken along the line A--A of FIG. 83.
FIG. 85 is a cross section taken along the line B--B of FIG. 83.
FIG. 86 is a plan view showing a state in which an overcoat is formed on the insulating substrate in accordance with the seventh embodiment.
FIG. 87 is a cross section taken along the line C--C of FIG. 86.
FIG. 88 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate in accordance with the seventh embodiment.
FIG. 89 is a cross section taken along the line D--D of FIG. 88.
FIG. 90 is a cross section taken along the line E--E of FIG. 88.
FIG. 91 is a vertical section showing a chip type resistor in accordance with the seventh embodiment.
FIG. 92 is a cross section taken along the line F--F of FIG. 91.
FIG. 93 is a plan view showing a modification of the middle coat in accordance with the seventh embodiment.
FIG. 94 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with an eighth embodiment.
FIG. 95 is a perspective view showing a state in which a resistive film is formed on the insulating substrate in accordance with the eighth embodiment.
FIG. 96 is a plan view showing a state in which an undercoat is formed on the insulating substrate in accordance with the eighth embodiment.
FIG. 97 is a cross section taken along the line G--G of FIG. 96.
FIG. 98 is a cross section taken along the line H--H of FIG. 96.
FIG. 99 is a plan view showing a state in which a trimming groove is engraved in the resistive film in accordance with the eighth embodiment.
FIG. 100 is a plan view showing a state in which a middle coat is formed on the insulating substrate in accordance with the eighth embodiment.
FIG. 101 is a cross section taken along the line I--I of FIG. 100.
FIG. 102 is a plan view showing a state in which an overcoat is formed on the insulating substrate in accordance with the eighth embodiment.
FIG. 103 is a cross section taken along the line J--J of FIG. 102.
FIG. 104 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate in accordance with the eighth embodiment.
FIG. 105 is a cross section taken along the line K--K of FIG. 104.
FIG. 106 is a cross section taken along the line L--L of FIG. 104.
FIG. 107 is a vertical section showing a chip type resistor in accordance with the eighth embodiment.
FIG. 108 is a cross section taken along the line M--M of FIG. 107.
FIG. 109 is a plan view showing a modification of the undercoat in accordance with the eighth embodiment.
FIG. 110 is a perspective view showing a state in which main upper electrodes are formed on an insulating substrate in accordance with a ninth embodiment.
FIG. 111 is a perspective view showing a state in which a resistive film and thereafter an undercoat are formed on the insulating substrate in accordance with the ninth embodiment.
FIG. 112 is a plan view showing a state in which a middle coat is formed on the insulating substrate in accordance with the ninth embodiment.
FIG. 113 is a cross section taken along the line N--N of FIG. 112.
FIG. 114 is a plan view showing a state in which an overcoat is formed on the insulating substrate in accordance with the ninth embodiment.
FIG. 115 is a cross section taken along the line O--O of FIG. 114.
FIG. 116 is a cross section taken along the line P--P of FIG. 114.
FIG. 117 is a plan view showing a state in which auxiliary upper electrodes are formed on the insulating substrate in accordance with the ninth embodiment.
FIG. 118 is a cross section taken along the line Q--Q of FIG. 117.
FIG. 119 is a cross section taken along the line R--R of FIG. 117.
FIG. 120 is a vertical section showing a chip type resistor in accordance with the ninth embodiment.
FIG. 121 is a cross section taken along the line S--S of FIG. 120.
FIG. 122 is a plan view showing a modification of the middle coat in accordance with the ninth embodiment.
FIG. 123 is a perspective view showing a chip type resistor of the prior art.
FIG. 124 is an enlarged cross section taken along the line T--T of FIG. 123.

DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of the present invention will be described with reference to the figures.
First Embodiment
FIGS. 1 to 12 show the first embodiment.
The method of manufacturing the chip type resistor in accordance with the first embodiment will be described.
Step 1. First, as shown in FIG. 1, a pair of left and right main upper electrodes 13a are formed on an upper surface of a chip type insulating substrate 11 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 2, a resistive film 12 is formed on the upper surface of insulating substrate 11 by screen printing of a paste and sintering (alternatively, resistive film 12 may be formed first and main upper electrodes 13a may be formed thereafter). An undercoat 14a of glass covering resistive film 12 is formed by screen printing and sintering.
A trimming groove 12a is engraved in resistive film 12 and undercoat 14a by laser beam irradiation, for example, while the resistance value of resistive film 12 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 13a so that the resistance value of resistive film 12 is within a prescribed tolerable range. Resistive film 12 may be adjusted by trimming with undercoat 14a omitted.
Step 3. A middle coat 14b of glass is formed by screen printing and sintering on a surface of undercoat 14a to fill trimming groove 12a. At this time, extensions 14b' integral with and extending from middle coat 14b are formed simultaneously, on both sides of the surface of each of main upper electrodes 13a, as shown in FIGS. 3 to 5.
Step 4. An overcoat 14c of glass or a synthetic resin is formed, at portions other than the extensions 14b', on the surface of middle coat 14b by screen printing and sintering, whereby a cover coat 14 is provided, as shown in FIGS. 6 and 7.
Step 5. On the surface of main upper electrodes 13a, auxiliary upper electrodes 13b are formed by screen printing and sintering of a conductive paste such that the auxiliary upper electrodes extend over the surface of main upper electrodes 13a and the surface of extensions 14b' of middle coat 14b, as shown in FIGS. 8 to 10. Auxiliary upper electrodes 13b may be formed simultaneously with side electrodes 13c, which will be described later.
Step 6. On both left and right end surfaces of insulating substrate 11, side electrodes 13c are formed by application and sintering of a conductive paste, and thereafter surfaces of the auxiliary upper electrodes 13b and side electrodes 13c are metal plated, whereby metal plate layer 13d is formed and thus terminal electrodes 13 are completed, as shown in FIGS. 11 and 12.
The chip type resistor manufactured in this manner has extensions 14b' of middle coat 14b formed on the surface of main upper electrodes 13a of terminal electrodes 13 as shown in FIGS. 11 and 12, and auxiliary upper electrodes 13b are formed on the surfaces of extensions 14b'. Therefore, the resistor has a three-layered structure. As a result, the height H1 from the surface of insulating substrate 11 to the surface of auxiliary upper electrode 13b (more accurately, from the surface of insulating substrate 11 to the surface of metal plate layer 13d) is the sum of thickness Ta of main upper electrode 13a and thickness Tb of auxiliary upper electrode 13b plus thickness T1 of extension 14b' of middle coat 14b.
Therefore, when the height H1 from the surface of insulating substrate 11 to the surface of auxiliary upper electrode 13b (more accurately, the height from the surface of insulating substrate 11 to the surface of metal plate layer 13d) is made equal to that of the prior art example described above, the thickness Tb of auxiliary upper electrode 13b can be reduced by the thickness T1 of extension 14b' of middle coat 14b as compared with the prior art structure. As a result, the amount of conductive paste used for auxiliary upper electrode 13b can be reduced, which results in reduced material cost and reduced weight.
When the height H1 from the surface of insulating substrate 11 to the surface of auxiliary upper electrode 13b (more accurately, the height from the surface of insulating substrate 11 to the surface of metal plate layer 13d) is made higher than the height H0 from the surface of insulating substrate 11 to the surface of overcoat 14c so that surfaces of terminal electrodes 13 are protruded from the surface of overcoat 14c, increase in number of application of conductive paste for auxiliary upper electrodes by screen printing is not increased.
Meanwhile, extensions 14b' of middle coat 14b are formed at portions on the surface of main upper electrodes 13a, while auxiliary upper electrodes 13b are formed covering both the surface of extensions 14b' of middle coat 14b and the surface of main upper electrodes 13a. Therefore, auxiliary upper electrodes 13b and main upper electrodes 13a can surely and firmly be integrated to be electrically conductive with each other.
As for the planar pattern of extension 14b' of middle coat 14b, not only the planar pattern shown in FIG. 6 but planar patterns shown in FIGS. 13, 14, 15 and 16 may be possible. Further, in place of the extension, enclaves 14b" of middle coat 14b may be simultaneously formed with middle coat 14b, on both left and right sides on the surface of the main upper electrodes 13a, and auxiliary upper electrodes 13b may be formed covering both the surface of enclaves 14b" and the surface of main upper electrodes 13a, as shown in FIG. 17. Further, two extensions 14b' or enclaves 14b' may be provided on one of the main upper electrodes 13a and one extension 14b' or enclave 14b" may be formed on the other one of the main upper electrodes, as shown in FIGS. 18 and 19.
Second Embodiment
The second embodiment will be described with reference to FIGS. 20 to 27.
According to the method of manufacturing a chip type resistor of the second embodiment, upper electrodes 13a, resistive film 12 and undercoat 14a are formed on insulating substrate 11, adjustment by trimming is performed, and thereafter middle coat 14b of glass is formed. Here, extensions 14b' of middle coat 14b are formed on portions of main upper electrodes 13a as shown in FIGS. 20 and 21. Thereafter, similar to the first embodiment, overcoat 14c is formed as shown in FIGS. 22 and 23. Then, auxiliary upper electrodes 13b are formed as shown in FIGS. 24 and 25. Further, side electrodes 13c are formed as shown in FIGS. 26 and 27 and metal plate layer 13d is formed, thus terminal electrodes 13 are completed.
In the chip type resistor in accordance with the second embodiment also, extensions 14b' of middle coat 14b are formed on portions of the surface of main upper electrodes 13a of terminal electrodes 13. Auxiliary upper electrodes 13b are formed covering both the surface of extensions 14b' of middle coat 14b and the surface of main upper electrodes 13a. By the adoption of this structure, similar function and effect as the first embodiment can be provided.
Rather than forming extensions 14b' or enclaves 14b" of middle coat 14b only on the surface of main upper electrodes 13a and forming auxiliary upper electrodes 13b thereon as in the above described embodiments, extensions or enclaves of undercoat 14a may be formed on the surface of main upper electrodes 13a, extensions 14b' or enclaves 14b" of middle coat 14b may be formed thereon and auxiliary upper electrodes 13b may further be formed thereon. Alternatively, extensions 14b' or enclaves 14b" of middle coat 14b may be formed on the surface of main upper electrodes 13a, extensions or enclaves of overcoat 14c may be formed thereon and auxiliary upper electrodes 13b may be further formed thereon. The amount of conductive paste used for the auxiliary upper electrode can further be reduced in any of the structures provided through such steps.
Alternatively, extensions or enclaves of undercoat 14a may be formed on the surface of main upper electrodes 13a, extensions 14b' or enclaves 14b" of middle coat 14b may be formed thereon, extensions or enclaves of overcoat 14c may be formed further thereon and auxiliary upper electrode 13b may be formed thereon.
Third Embodiment
FIGS. 28 to 47 show the third embodiment.
The method of manufacturing the chip type resistor in accordance with the third embodiment will be described.
Step 1. First, as shown in FIG. 28, a pair of left and right main upper electrodes 113a are formed on an upper surface of a chip type insulating substrate 111 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 29, a resistive film 112 is formed on the upper surface of insulating substrate 111 by screen printing of a paste and sintering (alternatively, resistive film 112 may be formed first and main upper electrodes 113a may be formed thereafter).
Step 3. An undercoat 114a of glass covering resistive film 112 is formed on the surface of insulating substrate 111 by screen printing and sintering and at this time, extensions 114a' extending from and integral with undercoat 114 are formed simultaneously, on opposing sides of the surface of main upper electrodes 113a as shown in FIGS. 30 to 32.
Step 4. A trimming groove 112a is engraved in resistive film 112 and undercoat 114a by laser beam irradiation, for example, as shown in FIG. 33, while the resistance value of resistive film 112 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 113a so that the resistance value of resistive film 112 is within a prescribed tolerable range.
Step 5. A middle coat 114b of glass is formed by screen printing and sintering on a surface of undercoat 114a to fill trimming groove 112a, as shown in FIGS. 34 and 35.
Step 6. An overcoat 114c of glass or a synthetic resin is formed at portions other than the extensions 114a' of undercoat 114a on the surface of middle coat 114b by screen printing and sintering, whereby a cover coat 114 is provided, as shown in FIGS. 36 an 37.
Step 7. On the surface of main upper electrodes 113a, auxiliary upper electrodes 113b are formed by screen printing and sintering of a conductive paste such that the auxiliary upper electrodes extend over the surface of main upper electrodes 113a and the surface of extensions 114a' of undercoat 114a, as shown in FIGS. 38 to 40. Auxiliary upper electrode 113b may be formed simultaneously with side electrodes 113c, which will be described later.
Step 6. On both left and right end surfaces of insulating substrate 111, side electrodes 113c are formed by application and sintering of a conductive paste, and thereafter entire surface is metal plated, whereby metal plate layers 113d are formed and thus terminal electrodes 113 are completed, as shown in FIGS. 41 and 42.
The chip type resistor manufactured in this manner has extensions 114a' of undercoat 114a formed on the surface of main upper electrodes 113a of terminal electrodes 113 as shown in FIGS. 41 and 42, and auxiliary upper electrodes 113b are formed on the surfaces of extensions 114a'. Therefore, the resistor has a three-layered structure. As a result, the height H1 from the surface of insulating substrate 111 to the surface of auxiliary upper electrode 113b (more accurately, from the surface of insulating substrate 111 to the surface of metal plate layer 113d) is the sum of thickness Ta of main upper electrode 113a and thickness Tb of auxiliary upper electrode 113b plus thickness T1 of extension 114a' of undercoat 114a.
Therefore, when the height H1 from the surface of insulating substrate 111 to the surface of auxiliary upper electrode 113b (more accurately, the height from the surface of insulating substrate 111 to the surface of metal plate layer 113d) is made equal to that of the prior art example described above, the thickness Tb of auxiliary upper electrode 113b can be reduced by the thickness T1 of extension 114a' of undercoat 114a as compared with the prior art structure. As a result, the amount of conductive paste used for auxiliary upper electrode 113b can be reduced, which results in reduced material cost and reduced weight.
When the height H1 from the surface of insulating substrate 111 to the surface of auxiliary upper electrode 113b (more accurately, the height from the surface of insulating substrate 111 to the surface of metal plate layer 113d) is made higher than the height H0 from the surface of insulating substrate 111 to the surface of overcoat 114c so that surfaces of terminal electrodes 113 are protruded from the surface of overcoat 114c, increase in number of application of conductive paste for auxiliary upper electrodes by screen printing is not increased.
The extensions 114a' of undercoat 114a are formed at portions of the surface of main upper electrodes 113a, and auxiliary upper electrodes 113b are formed covering both the surface of extensions 114a' of undercoat 114a and the surface of main upper electrodes 113a. Therefore, when resistive film 12 is adjusted by trimming, the conductive probe can surely be brought into contact with that portions of main upper electrodes 113a on which the extension 114a' of undercoat 114a is not formed, and simultaneously, auxiliary upper electrodes 113b and main upper electrodes 113a can surely and firmly be integrated to be electrically conductive with each other.
As for the planar pattern of extensions 114a' of undercoat 114a, not only the planar pattern shown in FIG. 6 but planar patterns shown in FIGS. 43 and 44 may be possible. Further, in place of the extensions 114a', enclaves 114a" of undercoat 114a may be simultaneously formed with undercoat 114a, on opposing sides on the surface of the main upper electrodes 113a, and auxiliary upper electrodes 113b may be formed covering both the surface of enclaves 114a" and the surface of main upper electrodes 113a, as shown in FIG. 45. Further, two extensions 114a' or enclaves 114a" may be provided on one of the main upper electrodes 113a and one extension 114a' or enclave 114a" may be formed on the other one of the main upper electrodes, as shown in FIGS. 46 and 47.
Fourth Embodiment
FIGS. 48 to 57 show the fourth embodiment.
As compared with the structure of the third embodiment described above, in the fourth embodiment, upper electrodes 113a and resistive film 112 are formed on insulating substrate 111 and thereafter undercoat 114a is formed, with extensions 114a' of undercoat 114a formed on portions of main upper electrodes 113a as shown in FIGS. 48 and 49. Thereafter, similar to the third embodiment, trimming adjustment is performed by engraving a trimming groove 112a, which is represented by a two-dotted line in FIGS. 48 and 49, middle coat 114b is formed as shown in FIGS. 50 and 51, overcoat 114c is formed as shown in FIGS. 52 and 53, auxiliary upper electrodes 113b are formed as shown in FIGS. 54 and 55, side electrodes 113c are formed as shown in FIGS. 56 and 57 and, thereafter, metal plate layer 113d is formed, thus terminal electrodes 113 are completed.
In the chip type resistor in accordance with this embodiment also, extensions 114a' of undercoat 114a are formed on portions of the surface of main upper electrodes 113a of terminal electrodes 113. Auxiliary upper electrodes 113b are formed covering both the surface of extensions 114a' of undercoat 114a and the surface of main upper electrodes 113a. By the adoption of this structure, similar function and effect as the third embodiment can be provided.
Rather than forming extensions 114a' or enclaves 114a" of undercoat 114a only on the surface of main upper electrodes 113a and forming auxiliary upper electrodes 113b thereon as in the above described embodiments, extensions or enclaves of undercoat 114a may be formed on the surface of main upper electrodes 113a, extensions or enclaves of middle coat 114b may be formed thereon and auxiliary upper electrodes 113b may further be formed thereon. Alternatively, extensions 114a' or enclaves 114a" of undercoat 114a may be formed first on the surface of main upper electrodes 113a, extensions or enclaves of overcoat 114c may be formed thereon and auxiliary upper electrodes 113b may be further formed thereon. The amount of conductive paste used for the auxiliary upper electrode can further be reduced in any of the structures provided through such steps.
Alternatively, extensions 114a' or enclaves 114a" of undercoat 114a may be formed first on the surface of main upper electrodes 113a, extensions or enclaves of middle coat 114b may be formed thereon, extensions or enclaves of overcoat 114c may be formed further thereon and auxiliary upper electrode 113b may be formed thereon.
Fifth Embodiment
FIGS. 58 to 72 show the fifth embodiment.
The method of manufacturing the chip type resistor in accordance with the fifth embodiment will be described.
Step 1. First, as shown in FIG. 58, a pair of left and right main upper electrodes 213a are formed on an upper surface of a chip type insulating substrate 211 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 59, a resistive film 212 is formed on the upper surface of insulating substrate 211 by screen printing of a paste followed by sintering (alternatively, resistive film 212 may be formed first and main upper electrodes 213a may be formed thereafter). An undercoat 214a of glass covering resistive film 212 is formed by screen printing and sintering. Thereafter, a trimming groove 212a is engraved in resistive film 212 and undercoat 214a by laser beam irradiation, for example, while the resistance value of resistive film 212 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 213a so that the resistance value of resistive film 212 is within a prescribed tolerable range. Resistive film 212 may be adjusted by trimming with undercoat 214a omitted.
Step 3. A middle coat 214b of glass is formed by screen printing and sintering on a surface of undercoat 214a to fill trimming groove 212a as shown in FIGS. 60 and 61.
Step 4. An overcoat 214c of glass or a synthetic resin is formed on the surface of middle coat 214b by screen printing and sintering, and extensions 214c' integral with and extending from overcoat 214c are simultaneously formed on opposing sides of main upper electrodes, thus providing cover coat 214 as shown in FIGS. 62 to 64.
Step 5. On the surface of main upper electrodes 213a, auxiliary upper electrodes 213b are formed by screen printing and sintering of a conductive paste such that the auxiliary upper electrodes extend over the surface of main upper electrodes 213a and the surface of extensions 214c' of overcoat 214c, as shown in FIGS. 65 to 67. Auxiliary upper electrode 213b may be formed simultaneously with side electrodes 213c, which will be described later.
Step 6. On both left and right end surfaces of insulating substrate 211, side electrodes 213c are formed by application and sintering of a conductive paste, and thereafter entire surfaces of the auxiliary upper electrodes 213b and side electrodes 213c are metal plated, whereby metal plate layers 213d are formed and thus terminal electrodes 213 are completed, as shown in FIGS. 68 and 69.
The chip type resistor manufactured in this manner has extensions 214c' of overcoat 214c formed on the surface of main upper electrodes 213a of terminal electrodes 213 as shown in FIGS. 68 and 69 and auxiliary upper electrodes 13b are formed on the surfaces of extensions 214c' of overcoat 214c. Therefore, the resistor has a three-layered structure. As a result, the height H1 from the surface of insulating substrate 211 to the surface of auxiliary upper electrode 213b (more accurately, from the surface of insulating substrate 211 to the surface of metal plate layer 213d) is the sum of thickness Ta of main upper electrode 213a and thickness Tb of auxiliary upper electrode 213b plus thickness T1 of extension 214c' of overcoat 214c.
Therefore, when the height H1 from the surface of insulating substrate 211 to the surface of auxiliary upper electrode 213b (more accurately, the height from the surface of insulating substrate 211 to the surface of metal plate layer 213d) is made equal to that of the prior art example described above, the thickness Tb of auxiliary upper electrode 213b can be reduced by the thickness T1 of extension 214c' of overcoat 214c as compared with the prior art structure. As a result, the amount of conductive paste used for auxiliary upper electrode 213b can be reduced, which results in reduced material cost and reduced weight.
When the height H1 from the surface of insulating substrate 211 to the surface of auxiliary upper electrode 213b (more accurately, the height from the surface of insulating substrate 211 to the surface of metal plate layer 213d) is made higher than the height H0 from the surface of insulating substrate 211 to the surface of overcoat 214c so that surfaces of terminal electrodes 213 are protruded from the surface of overcoat 214c, increase in number of application of conductive paste for auxiliary upper electrodes by screen printing is not increased.
Meanwhile, extensions 214c' of overcoat 214c are formed at portions on the surface of main upper electrodes 213a, while auxiliary upper electrodes 213b are formed covering both the surface of extensions 214c' of overcoat 214c and the surface of main upper electrodes 213a. Therefore, auxiliary upper electrodes 213b and main upper electrodes 213a can surely and firmly be integrated to be electrically conductive with each other.
In place of extensions 214c' of overcoat 214c, when overcoat 214c is formed, enclaves 214c" of overcoat 214c may be formed simultaneously with overcoat 214c, on opposing sides of the surface of the main upper electrodes 213a, and auxiliary upper electrodes 213b may be formed to cover both the surface of enclaves 214c" and the surface of main upper electrodes 213a, as shown in FIG. 70. Alternatively, two extensions 214c' or enclaves 214c" may be formed on one of the main upper electrodes 213a and one extension 214c' or enclave 214c" may be formed on the other, as shown in FIGS. 71 and 72.
Sixth Embodiment
FIGS. 73 to 80 show the sixth embodiment.
According to the method of manufacturing a chip type resistor of the sixth embodiment as compared with the fifth embodiment described above, upper electrodes 213a, resistive film 212 and undercoat 214a are formed on insulating substrate 211, adjustment by trimming is performed, middle coat 214b of glass is formed and thereafter, overcoat 214c of glass or a synthetic resin is formed. Here, extensions 214c' of overcoat 214c are formed on portions of main upper electrodes 213a as shown in FIGS. 73 to 75. Thereafter, similar to the fifth embodiment, auxiliary upper electrodes 213b are formed as shown in FIGS. 76 to 78. Further, side electrodes 213c are formed as shown in FIGS. 79 and 80 and metal plate layer 213d is formed, thus terminal electrodes 213 are completed.
In the chip type resistor in accordance with this embodiment also, extensions 214c' of overcoat 214c are formed on portions of the surface of main upper electrodes 213a of terminal electrodes 13. Auxiliary upper electrodes 213b are formed covering both the surface of extensions 214c' of overcoat 214c and the surface of main upper electrodes 213a. By the adoption of this structure, similar function and effect as the fifth embodiment can be provided.
Rather than forming extensions 214c' or enclaves 214c" of overcoat 214c only on the surface of main upper electrodes 213a and forming auxiliary upper electrodes 213b thereon as in the above described fifth and sixth embodiments, extensions or enclaves of undercoat 214a may be formed on the surface of main upper electrodes 213a, extensions 214c' or enclaves 214c" of overcoat 214c may be formed thereon and auxiliary upper electrodes 213b may further be formed thereon. Alternatively, extensions or enclaves of middle coat 214b may be formed first on the surface of main upper electrodes 213a, extensions 214c' or enclaves 214c" of overcoat 214c may be formed thereon and auxiliary upper electrodes 213b may be further formed thereon. The amount of conductive paste used for the auxiliary upper electrode can further be reduced in any of the structures provided through such steps.
Alternatively, extensions or enclaves of undercoat 214a may be formed on the surface of main upper electrodes 213a, extensions or enclaves of middle coat 214b may be formed thereon, extensions 214c' or enclaves 214c" of overcoat 214c may be formed further thereon and auxiliary upper electrode 213b may be formed thereon.
In the fifth and sixth embodiments, cover coat 214 has been described as having a three-layered structure including undercoat 214a, middle coat 214b and overcoat 214c. However, the present invention is not limited thereto. The present invention is similarly applicable when cover coat 214 consists of undercoat 214a and overcoat 214c, or middle coat 214b and overcoat 214c, or when it consists only of overcoat 214c.
Seventh Embodiment
FIGS. 81 to 93 show the seventh embodiment.
The method of manufacturing the chip type resistor in accordance with the seventh embodiment will be described.
Step 1. First, as shown in FIG. 81, a pair of left and right main upper electrodes 313a are formed on an upper surface of a chip type insulating substrate 311 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 82, a resistive film 312 is formed on the upper surface of insulating substrate 311 by screen printing of a paste followed by sintering (alternatively, resistive film 312 may be formed first and main upper electrodes 313a may be formed thereafter). An undercoat 314a of glass covering resistive film 312 is formed by screen printing and sintering. Thereafter, a trimming groove 312a is engraved in resistive film 312 and undercoat 314a by laser beam irradiation, for example, while the resistance value of resistive film 312 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 313a so that the resistance value of resistive film 312 is within a prescribed tolerable range. Resistive film 312 may be adjusted by trimming with undercoat 314a omitted.
Step 3. A middle coat 314b of glass is formed by screen printing and sintering on a surface of undercoat 314a (when undercoat 314a is omitted, on a surface of resistive film 312) to fill trimming groove 312a. At this time, extensions 314b' integral with and extending from middle coat 314b are formed simultaneously, on opposing sides of the surface of main upper electrodes 313a, as shown in FIGS. 83 to 85.
Step 4. An overcoat 314c of glass or a synthetic resin is formed at portions other than the extensions 314b' on the surface of middle coat 314b by screen printing and sintering, whereby a cover coat 314 having a three-layered structure including undercoat 314a, middle coat 314b and overcoat 314c is provided, as shown in FIGS. 86 and 87.
Step 5. On the surface of main upper electrodes 313a, auxiliary upper electrodes 313b are formed by screen printing and sintering of a conductive paste at portions between extensions 314b positioned on opposing sides of each of the main upper electrodes, as shown in FIGS. 88 to 90.
Auxiliary upper electrodes 313b may be formed simultaneously with side electrodes 313c, which will be described later. More specifically, auxiliary upper electrodes may be formed simultaneously when conductive paste for side electrodes 313c are applied to left and right end surfaces of insulating substrate 311, by applying the conductive paste for side electrodes 313c additionally to the portion between extensions 314b' on the surface of main upper electrodes 303a, and by sintering thereafter.
Step 6. On both left and right end surfaces of insulating substrate 311, side electrodes 313c are formed by application and sintering of a conductive paste, and thereafter surfaces of the auxiliary upper electrodes 13b and side electrodes 313c are metal plated, whereby metal plate layers 313d are formed and thus terminal electrodes 313 are completed, as shown in FIGS. 91 and 92.
In the chip type resistor manufactured in this manner, referring to FIGS. 91 and 92, extensions 314b' of middle coat 314b are positioned on opposing sides of main upper electrodes 313a of terminal electrodes 313, and auxiliary upper electrodes 313b are formed at portions between extensions 314b' on the surface of main upper electrodes 313a. Therefore, when auxiliary upper electrode 313b is formed by application of conductive paste by screen printing followed by sintering, extensions 314b of middle coat 314b positioned on the left and right sides thereof function as dams preventing the conductive paste applied to the portion therebetween from flowing in the widthwise direction of the insulating substrate 311. Therefore, the height from the surface of the main upper electrode 313a to the auxiliary upper electrode 313b (more accurately, the height from the surface of main upper electrode 313a to the surface of metal plate layer 313b) is ensured with smaller amount of conductive paste.
Therefore, when the height H1 from the surface of insulating substrate 311 to the surface of auxiliary upper electrode 313b (more accurately, the height from the surface of insulating substrate 311 to the surface of metal plate layer 313d) is made approximately equal to the height HO from the surface of insulating substrate 311 to the surface of overcoat 314c, the amount of conductive paste used for auxiliary upper electrode 313b can be reduced, which results in reduced material cost and reduced weight.
In place of extensions 314b' of middle coat 314b, when middle coat 314b is formed, enclaves 314b" of middle coat 314b may be formed simultaneously on opposing sides of main upper electrodes 313a, and auxiliary upper electrodes 313b may be formed at the portion between enclaves 314b" on the surface of each of the main upper electrodes 313a, as shown in FIG. 93. The extensions 314b' or enclave 314b" of middle coat 314b should preferably be formed partially overlapping main upper electrodes 313a as shown in FIG. 93. However, since middle coat 314b is larger in thickness than main upper electrode 313a, it may be formed not overlapping main upper electrode 313a.
Eighth Embodiment
FIGS. 94 to 109 show the eight embodiment.
The method of manufacturing the chip type resistor in accordance with the eighth embodiment will be described.
Step 1. First, as shown in FIG. 94, a pair of left and right main upper electrodes 313a are formed on an upper surface of a chip type insulating substrate 311 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 95, a resistive film 312 is formed on the upper surface of insulating substrate 311 by screen printing of a paste followed by sintering (alternatively, resistive film 312 may be formed first and main upper electrodes 313a may be formed thereafter).
Step 3. An undercoat 314a of glass covering resistive film 312 is formed on the surface of insulating substrate 311 by screen printing and sintering. At this time, extensions 314a' integral with and extending from undercoat 314a are formed simultaneously, on opposing sides of the surface of main upper electrodes 313a, as shown in FIGS. 96 to 98.
Step 4. A trimming groove 312a is engraved in resistive film 312 and undercoat 314a by laser beam irradiation, for example, while the resistance value of resistive film 312 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 313a so that the resistance value of resistive film 312 is within a prescribed tolerable range as shown in FIG. 99.
Step 5. Referring to FIGS. 100 and 101, a middle coat 314b of glass is formed by screen printing and sintering on a surface of undercoat 314a to fill trimming groove 312a at portions other than extensions 314a'.
Step 6. An overcoat 314c of glass or a synthetic resin is formed at portions other than the extensions 314a' of undercoat 314a on the surface of middle coat 314b by screen printing and sintering, whereby a cover coat 314 having a three-layered structure including undercoat 314a, middle coat 314b and overcoat 314c is provided, as shown in FIGS. 102 and 103.
Step 7. On the surface of main upper electrodes 313a, auxiliary upper electrodes 313b are formed by screen printing and sintering of a conductive paste at portions between extensions 314a' on opposing sides of the surface of each of the main upper electrodes 313a, as shown in FIGS. 104 to 106.
Auxiliary upper electrodes 313b may be formed simultaneously with side electrodes 313c, which will be described later. More specifically, auxiliary upper electrodes may be formed simultaneously when conductive paste for side electrodes 313c are applied to left and right end surfaces of insulating substrate 311, by applying the conductive paste for side electrodes 313c additionally to the portion between extensions 314a' on the surface of main upper electrodes 313a, and by sintering thereafter.
Step 8. On both left and right end surfaces of insulating substrate 311, side electrodes 313c are formed by application and sintering of a conductive paste, and thereafter surfaces of the auxiliary upper electrodes 313b and side electrodes 313c are metal plated, whereby metal plate layers 313d are formed and thus terminal electrodes 313 are completed, as shown in FIGS. 107 and 108.
In the chip type resistor manufactured in this manner, referring to FIGS. 107 and 108, extensions 314a' of undercoat 314a are positioned both on opposing sides of main upper electrodes 313a of terminal electrodes 313, and auxiliary upper electrodes 313b are formed at portions between extensions 314a' on the surface of main upper electrodes 313a. Therefore, when auxiliary upper electrode 313b is formed by application of conductive paste by screen printing followed by sintering, extensions 314a' of undercoat 314a positioned on both sides thereof function as dams preventing the conductive paste applied to the portion therebetween from flowing in the widthwise direction of the insulating substrate 311. Therefore, the height from the surface of the main upper electrode 313a to the auxiliary upper electrode 313b (more accurately, the height from the surface of main upper electrode 313a to the surface of metal plate layer 313b) is ensured with smaller amount of conductive paste.
Therefore, when the height H1 from the surface of insulating substrate 311 to the surface of auxiliary upper electrode 313b (more accurately, the height from the surface of insulating substrate 311 to the surface of metal plate layer 313d) is made approximately equal to the height H0 from the surface of insulating substrate 311 to the surface of overcoat 314c, the amount of conductive paste used for auxiliary upper electrode 313b can be reduced, which results in reduced material cost and reduced weight.
In place of extensions 314a' of undercoat 314a, when undercoat 314a is formed, enclaves 314a" of undercoat 314a may be formed simultaneously on opposing sides of main upper electrodes 313a, and auxiliary upper electrodes 313b may be formed at the portion between enclaves 314a" on the surface of the main upper electrodes 313a, as shown in FIG. 93. The extension 314a' or enclave 314a" of undercoat 314a should preferably be formed partially overlapping main upper electrodes 313a as shown in the figure. However, since undercoat 314a is larger in thickness than main upper electrode 313a, it may be formed not overlapping main upper electrode 313a.
Ninth Embodiment
FIGS. 110 to 122 show the ninth embodiment.
The method of manufacturing the chip type resistor in accordance with the ninth embodiment will be described.
Step 1. First, as shown in FIG. 110, a pair of left and right main upper electrodes 313a are formed on an upper surface of a chip type insulating substrate 311 by screen printing of a conductive paste followed by sintering.
Step 2. Referring to FIG. 111, a resistive film 312 is formed on the upper surface of insulating substrate 311 by screen printing of a paste and sintering (alternatively, resistive film 312 may be formed first and main upper electrodes 313a may be formed thereafter). An undercoat 314a of glass covering resistive film 312 is formed by screen printing and sintering. Thereafter, a trimming groove 312a is engraved in resistive film 312 and undercoat 314a by laser beam irradiation, for example, while the resistance value of resistive film 312 is measured by bringing a conductive probe (not shown) into contact with main upper electrodes 313a so that the resistance value of resistive film 312 is within a prescribed tolerable range. Resistive film 312 may be adjusted by trimming with undercoat 314a omitted.
Step 3. A middle coat 314b of glass is formed by screen printing and sintering on a surface of undercoat 314a (when undercoat 314a is omitted, on the surface of resistive film 312) to fill trimming groove 312a as shown in FIGS. 112 and 113.
Step 4. An overcoat 314c of glass or a synthetic resin is formed on the surface of middle coat 314b by screen printing and sintering, whereby a cover coat 314 having a three-layered structure including undercoat 314a, middle coat 314 and overcoat 314c is provided, as shown in FIGS. 114 to 116. At this time, extensions 314c' extending from and integral with overcoat 314c are formed on opposing ends of main upper electrodes 313a.
Step 5. On the surface of main upper electrodes 313a, auxiliary upper electrodes 313b are formed by screen printing and sintering of a conductive paste between extensions 314c' positioned on opposing sides of main upper electrodes, as shown in FIGS. 117 to 119.
Auxiliary upper electrodes 313b may be formed simultaneously with side electrodes 313c, which will be described later. More specifically, auxiliary upper electrodes may be formed simultaneously when conductive paste for side electrodes 313c are applied to left and right end surfaces of insulating substrate 311, by applying the conductive paste for side electrodes 313c additionally to the portion between extensions 314b' on the surface of main upper electrodes 303a, and by sintering thereafter.
Step 6. On both left and right end surfaces of insulating substrate 311, side electrodes 313c are formed by application and sintering of a conductive paste, and thereafter surfaces of the auxiliary upper electrodes 13b and side electrodes 313c are metal plated, whereby metal plate layers 313d are formed and thus terminal electrodes 313 are completed, as shown in FIGS. 120 and 121.
In the chip type resistor manufactured in this manner, referring to FIGS. 120 and 121, extensions 314c' of overcoat 314c are positioned on opposing sides of main upper electrodes 313a of terminal electrodes 313, and auxiliary upper electrodes 313b are formed at portions between extensions 314c' on the surface of main upper electrodes 313a, as in the seventh and eighth embodiments. Therefore, when auxiliary upper electrode 313b is formed by application of conductive paste by screen printing followed by sintering, extensions 314c' of overcoat 314c positioned on opposing sides thereof function as dams preventing the conductive paste applied to the portion therebetween from flowing in the widthwise direction of the insulating substrate 311. Therefore, the height from the surface of the main upper electrode 313a to the auxiliary upper electrode 313b (more accurately, the height from the surface of main upper electrode 313a to the surface of metal plate layer 313b) is ensured with smaller amount of conductive paste.
Therefore, when the height H1 from the surface of insulating substrate 311 to the surface of auxiliary upper electrode 313b (more accurately, the height from the surface of insulating substrate 311 to the surface of metal plate layer 313d) is made approximately equal to the height H0 from the surface of insulating substrate 311 to the surface of overcoat 314c, the amount of conductive paste used for auxiliary upper electrode 313b can be reduced, which results in reduced material cost and reduced weight.
In place of extensions 314c' of overcoat 314c, when overcoat 314c is formed, enclaves 314c" of overcoat 314c may be formed simultaneously on opposing sides of main upper electrodes 313a, and auxiliary upper electrodes 313b may be formed at the portion between enclaves 314c" on the surface of the main upper electrodes 313a, as shown in FIG. 122. The extension 314c' or enclave 314c" of overcoat 314c should preferably be formed partially overlapping main upper electrodes 313a as shown in the figure. However, since overcoat 314c is larger in thickness than main upper electrode 313a, it may be formed not overlapping main upper electrode 313a.
In the seventh to ninth embodiments above, extensions 314b' or enclaves 314b" of middle coat 314b, extensions 314a' or enclaves 314a" of undercoat 314a or extensions 314c' or enclaves 314c" of overcoat 314c only are formed on opposing sides of main upper electrodes 313a. However, the present invention is not limited thereto. Extensions 314b' or enclaves 314b" of middle coat 314b and extensions 314a' or enclaves 314a" of undercoat 314a may be formed overlapped as the same positions, extensions 314b or enclaves 314b" of middle coat 314b and extensions 314c' or enclaves 314c" of overcoat 314c may be formed overlapped at the same positions, extensions 314a' or enclaves 314a" of undercoat 314a and extensions 314c' or enclaves 314c" of overcoat 314c may be formed overlapped at same positions, or, alternatively, extensions 314b' or enclaves 314b" of middle coat 314b, extensions 314a' or enclaves 314a" of undercoat 314a and extensions 314c' or enclaves 314c" of overcoat 314c, that is, extensions or enclaves of all three coats, may be formed overlapped at same positions, on opposing sides of main upper electrodes 313a. Such structure increases the height of the extensions or enclaves formed on opposing sides of main upper electrodes 313a, and therefore the amount of conductive paste used for forming the auxiliary upper electrodes can further be reduced.
Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.

Number	Date	Country
8-341383	Dec 1996	JPX
8-341384	Dec 1996	JPX
8-344013	Dec 1996	JPX
9-001532	Jan 1997	JPX

Number	Name	Date
5122812	Hess et al.	Jun 1992
5345361	Billotte et al.	Sep 1994
5757076	Kambara	May 1998

Number	Date	Country
0417749A2	Mar 1991	EPX
60-27104	Feb 1985	JPX
4-102302	Apr 1992	JPX
6-275401	Sep 1994	JPX

Chip type resistor

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CPC

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