Patent Application
20050057907
Computer systems and other electronic devices commonly employ a circuit board which functions as a communications highway between various electronic components secured to the circuit board. Some electronic components are permanently secured to the circuit board by such means as soldering. Other electronic components are releasably connected to the circuit board using one or more connectors which facilitate the transmission of signals between the electronic component and the circuit board. One example of such a connector is a pin and socket connector. Such connectors are frequently used to connect central processing units (CPUs) to a circuit board.
In many applications, the connectors used to connect the electronic component in the circuit board are relatively fragile or susceptible to deformation or bending. As a result, it is essential that the connector portion of the circuit board and the connector portion of the electronic component to be mounted to the circuit board be precisely aligned with one another during their connection. For example, it is important that the pins be precisely aligned with their corresponding sockets in those applications that employ pin and socket connectors.
In one known system for connecting a CPU to the mother board using a pin and socket connector, the sockets are provided with chamfers that guide the individual connector pins into the respective socket receptacles. The socket body additionally includes two protruding bosses that extend from the socket body located on the circuit board and which locate into corresponding slots in the CPU board. In addition, the CPU is surrounded with a picture-frame like shroud that locates on the outside of the socket body. Although these arrangements facilitate alignment of the pins with the sockets, such alignment does not occur before the pins of the CPU begin to engage the socket. As a result, the pins of such connectors are susceptible to stubbing and bending.
a is a sectional view of the circuit board assembly of
b is a sectional view of the circuit board assembly of
Electronic component 24 generally comprises an electronic component configured to be releasably connected to circuit board 22. In one embodiment, electronic component 24 may comprise a circuit board connected to circuit board 22. In another embodiment, electronic component 24 may comprise an active component such as an integrated circuit directly or indirectly connected to circuit board 22. For example, component 24 may comprise an integrated circuit directly connected to a connector which is connected to printed circuit board 22 or may comprise an integrated circuit connected to a circuit board which is connected to a connector connected to printed circuit board 22. The integrated circuit may also be connected to other structures in addition to circuit board 22. For example, electronic component 24 may include an integrated circuit such as a processor unit 36 connected to a heat sink 38.
Connector portions 26 and 28 engage and connect with one another to connect electronic component 24 to printed circuit board 22 so as to transmit signals to and from electronic component 24 and circuit board 22. In one embodiment, connector portion 26 may include a plurality of pins while connector portion 28 includes a plurality of sockets configured to receive the plurality of pins. In yet another embodiment, connector portion 26 may include a plurality of sockets while connector portion 28 includes a plurality of pins. In still other embodiments, connector portions 26 and 28 may comprise other conventionally known or future developed arrangements for connecting electronic component 24 to circuit board 22 and for transmitting signals in at least one direction between electronic component 24 and circuit board 22.
Alignment members 30 and 32 are coupled to electronic component 24 and circuit board 22, respectively. For purposes of this disclosure, the term “coupled” means the joining of two members directly or indirectly to one another. Such joining may be stationary in nature or movable in nature. Such joining may be achieved with the two members or the two members and any additional intermediate members being integrally formed as a single unitary body with one another or with the two members or the two members and any additional intermediate member being attached to one another. Such joining may be permanent in nature or alternatively may be removable or releasable in nature.
Alignment members 30 and 32 interact with one another to provide at least gross alignment of connector portions 26 and 28 prior to initial engagement and connection of connector portions 26 and 28. After initial engagement of alignment members 30 and 32, alignment members 30 and 32 either move and/or change shape to accommodate the continued movement of connector portion 26 towards connector portion 28 in the direction indicated by arrow 40 to enable connection of connector portions 26 and 28 without requiring perforations in circuit board 22. In particular, at least one of alignment members 30 and 32 has a terminal portion extending beyond a terminal portion of connector portion 26 or connector portion 28. In the particular embodiment illustrated alignment member 30 has a terminal portion 42 extending beyond terminal portion 44 of connector portion 26 while alignment member 32 has a terminal portion 46 extending beyond terminal portion 48 of connector portion 28. Terminal portions 42 and 46 are configured to mate with one another in a fashion so as to align connector portions 26 and 28 along at least one axis. Because portions 42 and 46 engage one another prior to engagement of connector portions 26 and 28, connector portions 26 and 28 are already in proper alignment with one another upon initial contact between connector portions 26 and 28, reducing the potential for damage to connector portions 26 and 28 caused by accidental misalignment of connector portions 26 and 28.
As shown by
Alignment member 132 may employ various configurations or mechanisms which facilitate their movement or change in shape to enable their terminal portions to move between an extended position and a retracted position relative to terminal portions of connectors 26 and 28 of at least one of connector portions 26 and 28. In one embodiment, alignment member 30 or 132 may comprise a movable pin. In one embodiment, the pin may be resiliently biased by a spring or other resiliently biased mechanism. In another embodiment, alignment member 30 or 132 may comprise a member which is rigid in a direction parallel to circuit board 22 but which is compressible in a direction perpendicular to circuit board 22. In one embodiment, alignment member 30 or 132 may include a bellows or other structure which functions similarly.
Memory 208 is coupled to base board 204 and provides additional memory storage for computing device 202. In the particular embodiment shown, memory 208 comprises two memory extenders comprising boards carrying a plurality of memory cards.
Processor system 210 does much of the computing or calculations for computing device 202 and generally includes a processor board or circuit board 222, a plurality of processor components 224 and a control 212 (known as a computer electronic control or CEC). Circuit board 222 generally comprises a conventionally known or future developed circuit board (also known as a printed circuit assembly) capable of serving as an interface between the various elements connected to circuit board 222. Circuit board 222 is coupled to base board 22 and electronically connects each of processor components 224 to control 212.
Control 212 serves as a traffic cop between each of the processor components 224 and memory 208. Although not shown, computing device 20 may additionally include a power supply for supplying power to each of the components, one or more cooling fans and a housing for enclosing and supporting each of the components. Overall, input/output 206, memory 208 and processor system 210 cooperate with one another to provide information retrieval and processing.
Heat sink assembly 238 includes heat sink 256 and heat sink mounts 258. Heat sink 256 generally comprises a structure extending adjacent to chip 250 and bore 252 so as to dissipate heat generated by processor assembly 236. Although not illustrated, heat sink 256 may additionally include cooling fins to further facilitate the dissipation of heat. As shown by
Mounts 258 secure processor component 224 to circuit board 222. In the particular embodiment illustrated, mounts 258 each include a fastener 262 and a spring 264. Fastener 262 generally comprises an elongate bolt having a threaded end which extends through heat sink 256 and is configured to engage an opposite component mounting portion 225. Springs 264 comprise compression springs captured between a portion of fastener 262 and heat sink 256. Springs 264 resiliently bias component 224 towards circuit board 222. Springs 264 regulate the amount of force by which connector portion 226 is electrically connected to connector portion 228. In alternative embodiments, springs 264 may be omitted wherein fastener 262 directly bears against component 224 to couple component 224 to circuit board 222.
Component mounting portions 225 comprise structures secured to circuit board 222 and configured to interact with mount 258 to releasably couple component 224 to circuit board 222. In the particular embodiment illustrated, component mounting portions 225 comprise an internally threaded cylinder extending through alignment member 232 and into engagement with circuit board 222. In one embodiment, mounting portion 225 is pressed to circuit board 222. In another embodiment, mounting portion 222 threadably receives a fastener which captures circuit board 222 between its head and alignment member 232. In still other alternative embodiments, mounting portion 225 may comprise an internally threaded bore formed directly into alignment member 232. In still other embodiments, mounting portion 225 may be formed separate from connector member 232 and may have various other configurations depending upon the configuration of mount 258.
Connector portion 226 is configured to interact with connector portion 228 to connect chip 250 to circuit board 222 and to facilitate the transmission of signals therebetween. Connector portion 226 comprises a pin connector having a plurality of pins. Connector portion 228 is coupled to circuit board 222 and includes a plurality of sockets configured to receive the plurality of pins of connector portion 226. In the particular embodiment illustrated, connector portions 226 and 228 comprise a conventionally known zero-in-force (ZIF) connector sold by Intel. In alternative embodiments, connector portions 226 and 228 may comprise other conventionally known or future developed connector portions.
Alignment members 230 and 232 comprise two members configured to interact with one another so as to align in at least one direction the plurality of pins of connector portion 226 with their corresponding plurality of sockets provided by connector portion 228 prior to actual engagement of sockets of connector portion 228 by the pins of connector portion 226. At the same time, alignment member 230 is configured to move relative to a terminal portion of connector portion 226 (the ends of the pins) between an extended position in which each member 230 extends beyond the pins and a retracted position in which members 230 extend beyond the terminal ends of the pins of connector portion 226 by a lesser distance. In some instances, members 230 may actually be retracted so as to not extend past the terminal end portions of the pins of connector portion 226.
In the retracted position shown in
As further shown by
As shown by
Once the pins of connector portion 226 have been inserted into the sockets of connector portion 228, a lever (not shown) is actuated to move connector portion 226 and the entire processor component 224 relative to connector portion 228 and circuit board 222. Such movement locks the pins of connector portion 226 in engagement with the sockets of connector portion 228. As best shown by
In alternative embodiments, bore 282 and surface 284 may have other configurations which permit the shifting of alignment member 230 within bore 282 during the shifting of connector portion 226 relative to connector portion 228. For example, bore 282 and surface 284 may alternatively comprise a rectangular slot. In alternative embodiments where connector portion 226 is not shifted relative to connector portion 228, bore 282 and tapered surface 284 may be circular in shape rather than ovular.
During movement of processor component 224 towards circuit board 222, tip 242 initially engages tapered surface 284 and enters bore 282 to align connector portions 226 and 228 prior to engagement of connector portions 226 and 228. Although not shown, during connection of connector portions 226 and 228, tip 242 engages the end of bore 282 such that continued movement of component 224 towards circuit board 222 moves collar 270 towards circuit board 222 to compress spring 276. As a result, the extent to which tip 242 extends beyond bore 272 is reduced as compared to the extent to which tip 242 extends beyond bore 272 prior to insertion into bore 282. This enables the length of bore 282 to be reduced, enabling the overall height of heatsink 256 to also be reduced. Reducing the height of heatsink 256 facilitates a more compact processor component.
In the particular embodiment illustrated in
Although the present invention has been described with reference to example embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention. For example, although different example embodiments may have been described as including one or more features providing one or more benefits, it is contemplated that the described features may be interchanged with one another or alternatively be combined with one another in the described example embodiments or in other alternative embodiments. Because the technology of the present invention is relatively complex, not all changes in the technology are foreseeable. The present invention described with reference to the example embodiments and set forth in the following claims is manifestly intended to be as broad as possible. For example, unless specifically otherwise noted, the claims reciting a single particular element also encompass a plurality of such particular elements.
