1. Field of the Invention
The present invention relates to circuit board connectors for connecting two circuit boards together.
2. Description of the Related Art
There are two types of circuit board connectors for connecting two circuit boards each other; one type is a socket housing type that can be dismantled even after product assembling and the other is a type that is fixed by soldering during product assembling. Among the latter type, which is fixed by soldering, the one as described below is known. This circuit board connector comprises, as illustrated in
As illustrated in
The outer shape of the above-described circuit board connector is, as illustrated in
However, cut surfaces 11 created by the press cutting are not provided with the plating layers and therefore have lower solder wettability than those in which a plating layer is formed on the entire surfaces. Moreover, there is a certain length of time until an electronic device equipped with the circuit board connector is shipped to the user and mounted onto a circuit board of an electronic apparatus. During that time, the second connecting portion of the circuit board connector is oxidized or rusted, and consequently a problem arises that solder wettability reduces.
In order to solve the foregoing problem, a method has been proposed in which re-plating is carried out for the circuit board connector after the press-cutting so that a plating layer is formed on the entire surface.
Re-plating the terminal, however, adds an extra manufacturing step and also increases cost. Moreover, the re-plating process usually adopts a barrel plating method, which involves putting samples to be plated into a barrel-shaped container containing a plating solution and revolving the barrel-shaped container, and in the course of this process, the terminals deform or get tangled, reducing the yield and leading to a further increase in cost. Furthermore, if a thin conductive plate material is used for cost reduction, the mechanical strength of the circuit board connector degrades, resulting in breakage during the manufacturing process and the mounting process to a circuit board, which also reduces the manufacturing yield.
The present invention has been accomplished to solve such problems, and it provides a circuit board connector with which good soldering is possible even without performing a re-plating process.
A circuit board connector of the present invention comprises a main body portion, a first connecting portion for connection to a first circuit board, and a second connecting portion for connection to a second circuit board; and
the circuit board connector is obtained by cutting a conductive plate material provided with plating layers on front and back sides thereof, and thereafter forming the second connecting portion so as to have an annular transverse cross section in such a manner that one of the plating layers forms an outer circumferential surface of the second connecting portion.
In a circuit board connector of the present invention, cut surfaces at both edges of the second connecting portion oppose each other in addition to the foregoing configuration.
Moreover, in a circuit board connector of the present invention, a gap is provided between the cut surfaces at both edges of the second connecting portion that oppose each other.
In addition, a circuit board connector of the present invention is such that a circuit board connector comprising a first connecting portion for connection to a first circuit board and a second connecting portion connected to a second circuit board, wherein:
the circuit board connector is obtained by cutting a conductive plate material provided with plating layers on front and back sides, and thereafter forming the second connecting portion so as to have an annular transverse cross section and bending the second connecting portion so that cut surfaces are located inside the annular cross-sectional shape.
By allowing one of the plating layers of the second connecting portion to form the outer circumferential surface, solder wettability can be improved without performing an extra plating process. Moreover, by processing the second connecting portion so as to have an annular cross section, the mechanical strength of the circuit board connector can be improved, and therefore, a conductive plate material that is thinner than that in conventional products can be used; thereby, cost can be reduced.
Since the cut surfaces at both edges of the second connecting portion oppose each other, the cut surfaces, which are not plated, are not present in the outer circumferential surface; thus, solder wettability can be improved.
Moreover, by providing a gap between the cut surfaces at both edges of the second connecting portion, solder comes into the gap by capillary action, making it possible to improve solder wettability.
By forming the second connecting portion so as to have an annular transverse cross section and bending the second connecting portion so that the cut surfaces are located inside the annular shape, the cut surfaces that are not plated are kept away from the outer circumferential surface that is to be soldered. Therefore, rusting that develops on the cut surfaces over time does not easily reach the outer circumferential surface, making it possible to conduct good soldering.
A circuit board connector according to the present invention comprises a main body portion 2, a first connecting portion 1 for connection to a first circuit board in an electronic device, a second connecting portion 4 for connection to a second circuit board in an electronic apparatus, a lead portion 3 between the second connecting portion 4 and the main body portion 2, and an auxiliary connecting portion 21 formed from a part of the main body portion.
The circuit board connector of the present invention is formed by cutting a conductive plate material provided with plating layers on its front and back sides, and thereafter forming the second connecting portion into a shape having an annular cross section so that one of the plating layers forms the outer circumferential surface of the second connecting portion.
Herein, the term “annular shape” used in the present invention is intended to describe the shape that forms an inner hollow 16, and the outer shape is not particularly limited. Examples of annular cross-sectional shapes that may be adopted include, as illustrated in
There are no particular limitations on the plating layers used for the conductive plate material in the present invention as long as their materials have high electrical conductivity, and usable materials include gold, silver, copper, nickel, and palladium. In the following embodiments, a tin-plated conductive plate material was used.
The circuit board connector according to the present invention is fabricated as follows. As illustrated in
Thereafter, as illustrated in
In addition, because the second connecting portion 4 needed to be drawn out in a vertical direction from the circuit board arranged horizontally in the electronic device, the first connecting portion 1 and the auxiliary connecting portion 21 of the terminal were subjected to a bending process such as to be bent at right angles with respect to the second connecting portion.
A circuit board connector of a third embodiment according to the present invention was obtained as follows. The outer shape was formed by press cutting a conductive plate material as in the first embodiment. Thereafter, the second connecting portion was processed as illustrated in
In the above-described embodiments of the present invention, when the circuit board connector is in use, the first connecting portion 1 and the auxiliary connecting portion 21 are fixed onto the first circuit board by soldering and the second connecting portion 4 is fixed onto the second circuit board by soldering.
With the above-described configurations, the cut surfaces 11 of the conductive plate material 13 after the press-cutting are not present on the outer circumferential surface of the second connecting portion 4 of the terminal that is to be soldered, and therefore, solder wettability can be improved over conventional products.
Moreover, the terminal of the second embodiment is provided with a small gap between the cut surfaces 11 at both edges of the second connecting portion 4; therefore, solder comes into the gap by capillary action, making it possible to improve solder wettability.
Furthermore, the terminal of the third embodiment has the cut surfaces 11 of the second connecting portion 4 that are bent so as to come inside the annular shape, making it possible to keep the cut surfaces 11 that are not plated away from the outer circumferential surface that is to be soldered. Consequently, even when rusting develops on the cut surfaces 11 over time and corrosion due to the rusting reaches the plated surface, the rust does not easily reach the outer circumferential surface of the second connecting portion, and therefore, it is possible to conduct good soldering. To obtain this effect, it is sufficient that the cut surfaces come inside the annular shape, and for example, the same effect can be attained with a shape as illustrated in
As illustrated in
In addition, the terminal in which the second connecting portion 4 is formed to have an annular transverse cross section as in the embodiments can improve the mechanical strength of the second connecting portion over the conventional product that is not subjected to a bending process. For this reason, it is possible to use a conductive material that is thinner than that in conventional products, leading to cost reduction. Furthermore, the mechanical strength of the terminal can be further improved by applying a bending process an O-shaped or C-shaped cross section or the like to the lead portion, as in the embodiments.
The embodiments used one having an auxiliary connecting portion formed from a portion of the main body portion and the first connecting portion and the auxiliary connecting portion was bending-processed at right angles with respect to the second connecting portion; however, the number and shape of the first connecting portion(s) are not limited to the foregoing and may be varied within the scope of the claims.
When the first connecting portion of a terminal of the present invention as described above is used for an electronic device that is arranged uprightly, such as a tuner, it is possible to make effective use of the space on the circuit and to prevent occurrences of rusting and oxidation of the second connecting portion of the terminal. Consequently, good soldering can be conducted even when a certain time has elapsed after shipment of the electronic device until mounting of the electronic device onto an electronic apparatus.
With the circuit board connector of the present invention, good soldering is possible since a plating layer is formed on the outer circumferential surface of the second connecting portion. Moreover, it is possible to use a conductive plate material that is thinner than was conventionally possible because the mechanical strength of the second connecting portion is improved. Therefore, cost reduction can be achieved.
Number | Date | Country | Kind |
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2002-350834 | Dec 2002 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP03/15497 | 12/3/2003 | WO | 00 | 6/3/2005 |
Publishing Document | Publishing Date | Country | Kind |
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WO2004/051810 | 6/17/2004 | WO | A |
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Number | Date | Country | |
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20060011373 A1 | Jan 2006 | US |