BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to light emitting diode (LED) display panel, particularly to the printed circuit board for large screen LED display panels.
2. Brief Description of Related Art
Large screen LED display requires more than two LED matrix array circuit boards pieced together. FIG. 1 shows a bottom view of a prior art LED display panel having a more than two circuit boards, such as circuit boards 101, 102, 103, placed side by side with each other. The LED matrix array mounted at the front of the circuit board is not shown. The different circuit boards are held together with links 14. These links are held in place with screws 13 anchored in the fixed nuts 11. Due to manufacturing tolerances in sawing the different circuit boards and in the placement of the nuts 14 on the circuit boards, it is difficult to achieve a seamless interface without any crevice in butting the different circuit boards together. As a result, the matrix arrays on different circuit board may be misaligned and dangling with respect to each other.
SUMMARY OF THE INVENTION
An object of this invention is to intimately butting the different LED circuit board. Another object of this invention is to increase the rigidity of the large screen LED display.
These objects are achieved by mounting L-shaped brackets between the butting edges of adjacent circuit boards. These brackets are then pressed together by clamps at the butting edges, and further tightened with set screws at a jaw and on top of the clamp.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows the backside of a prior art three LED matrix array circuit boards pieced together by screws and nuts.
FIG. 2 shows the backside of two LED matrix array circuit boards pieced together by brackets based on the present invention.
FIG. 3 shows the clamp for pressing two LED circuit boards together.
FIG. 4 shows a 2-dimensional clamp to tighten to circuit boards in two dimensions.
FIG. 5 shows a vertical set screw to press the clamp in the vertical direction.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 2 shows the basic structure of the present invention. Two L-shaped brackets 24 are mounted on the bottom sides of two butting edges of two circuit boards 101, 102, to which matrix LED array is attached on the top side of each circuit board. The horizontal faces of the brackets 24 are attached to the circuit boards, 101, 102 by means of screws 231. The vertical walls of the brackets are aligned with the butting edges of the circuit boards. A clamp 21 straggles over the vertical walls of the butting brackets 24 to pull the two circuit boards 101, 102 together. The brackets also prevent the two circuit boards to dangle with respect to each other.
FIG. 3 shows a second embodiment of the present invention. A set screw 23 is inserted on one jaw of the clamp 21. By tightening the set screw 23, the clamp can exert greater pressure to butt the two circuit boards 101, 102 together. Otherwise, the same reference numerals correspond to the same functional parts as in FIG. 2.
FIG. 4 shows a third embodiment of the present invention. In addition to the horizontal set screw 23, an additional vertical set screw 233 is inserted on top of the clamp 21. The vertical set screw 233 exerts vertical pressure on the clamp, and prevents any misalignment of the two circuit boards 101, 102 in the vertical direction. Otherwise, the same reference numerals correspond to the same functional parts as in FIG. 2.
FIG. 5 shows a fourth embodiment of the present invention A set screw 233 is inserted on top of the clamp 21 described in FIG. 2. The vertical set screw 233 exerts vertical pressure on the clamp 21, and presents any misalignment of the two circuit boards 101, 102 in the vertical direction. Otherwise, the same reference numerals correspond to the same functional part as in FIG. 2.
While the preferred embodiments of the invention have been described, it will be obvious to those skilled in the art that various modifications may be made without departing from the spirit of the present invention. Such modifications are all within the scope of this invention.