The present invention relates generally to printed circuit boards with end-to-end connection capabilities, and more particularly to printed circuit boards with sensor controlled illumination units and end-to-end connection capabilities.
The desire to activate and deactivate lighting elements based on detection of events in a surrounding environment is common. In general, lighting elements can be connected to sensors or detectors, and illuminate an area or object in response to an environmental signal, such as motion, sound, heat, humidity, etc. However, the size of the packaging to implement this functionality can be large because the necessary sensors may require special power requirements, lensing, and/or placement that is independent of a circuits that controls the lighting element.
In other examples, the lighting element is physically decoupled from the sensor, and the lighting element and sensor are on separate independent circuits. In these examples, the sensor may be coupled to a switch that controls power supplied to the lighting element. This arrangement can be practical in light of size limitations and/or availability of off the shelf sensors and lighting elements.
The present invention relates broadly to printed circuit boards with sensor controlled illumination units and end-to-end connection capabilities. For example, an illumination circuit, sensor/detector, and computational control element are implemented on a same printed circuit board. The printed circuit board also includes end-to-end connection terminals (such as input/output (I/O data and power circuits and/or lines)) that provide for multiple printed circuit boards to be coupled together in a series and/or parallel configuration. This provides a scalable system that can be modularized to a base unit for installation in various packages, orientations, or environments.
By incorporating sensor and illumination circuitry on the printed circuit board, the overall package size can be minimized and assembly complexity reduced. Further, by providing I/O data and power circuits and/or lines, multiple printed circuit boards can be operatively coupled together to increase system capacity or to increase overall size, as needed. Such a modular sensor based illumination system can be scaled and controlled by external switches or data computational elements.
In an embodiment, the present invention relates broadly to a light module. The light module includes a printed circuit board having a power circuit with first and second input/output (I/O) power terminals, and a first data circuit with first and second I/O data terminals. A microcontroller module is disposed on the printed circuit board and operably coupled to the first data circuit. A sensor module is disposed on the printed circuit board and operably coupled to the microcontroller module via a second data circuit, wherein the microcontroller module is adapted to send and/or receive data from the sensor module. An illumination circuit is disposed on the printed circuit board and includes a switching element and a light element. The light element (e.g., LED) is operably coupled to the power circuit, and the switching element is operably coupled to the microcontroller module via the first data circuit, and the switching element is adapted to send and/or receive a signal from the microcontroller module to cause the light element to illuminate.
In an embodiment, the light module may be a first light module operably coupled to a second light module. For example, the first I/O power terminal of the second printed circuit board can be operably coupled to the second I/O power terminal of the first printed circuit board, and the first I/O data terminal of the second printed circuit board can be operably coupled to the second I/O data terminal of the first printed circuit board.
For the purpose of facilitating an understanding of the subject matter sought to be protected, there is illustrated in the accompanying drawing embodiments thereof, from an inspection of which, when considered in connection with the following description, the subject matter sought to be protected, its construction and operation, and many of its advantages, should be readily understood and appreciated.
While this invention is susceptible of embodiments in many different forms, there is shown in the drawings, and will herein be described in detail, a preferred embodiment of the invention with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the broad aspect of the invention to embodiments illustrated. As used herein, the term “present invention” is not intended to limit the scope of the claimed invention and is instead a term used to discuss exemplary embodiments of the invention for explanatory purposes only.
The present invention relates broadly to printed circuit boards with sensor controlled illumination units and end-to-end connection capabilities. For example, a printed circuit board (PCB) of the invention generally includes a sensor module, a microcontroller module, an illumination circuit, a power management module, an electrical circuit adapted to provide electrical energy to the modules, and a data circuit to operably couple the microcontroller module to the illumination circuit and the sensor module. The data and power circuits are operably coupled to points of contact on at least one location, and preferably two or more locations on the PCB where similarly configured or identically configured PCBs may be operably coupled to the power and data circuits. For example, input/output (I/O) connecting points for the data and electrical circuit may be at opposing sides of the PCB to allow the PCB to be operably coupled in series or parallel configuration to another PCB. This provides a scalable system that can be modularized to a base unit for installation in various packages, orientations, or environments.
By incorporating the sensor module and illumination circuit on the printed circuit board, the overall package size can be minimized and assembly complexity reduced. Further, by providing I/O data and power circuits and/or lines, multiple printed circuit boards can be operably coupled together to increase system capacity and/or to increase overall size, as needed. Such a modular sensor based illumination system can be scaled and controlled by external switches and/or data computational elements.
Referring to
The PCB 102 may also include input/output (I/O) terminals for transmitting electrical energy or power, such as a first and second power terminals T1/P, T2/P operably coupled to the electrical circuit 112; I/O terminals for data, such as, first and second O data terminals T1/O, T2/O operably coupled to the first data circuit 116, first and second S data terminals T1/S, T2/S operably coupled to the second data circuit 118, and first and second D data terminals T1/D, T2/D operably coupled to the third data circuit 120; and I/O terminals for ground, such as first and second ground terminals T1/G, T2/G operably coupled to ground circuit 114.
The sensor module 104 is operably coupled to the microcontroller module (MCU) 106 via an I/O data circuit 122, and may be operably coupled to the power circuit 112 via the power management module (PMC) 110. The sensor module 104 may be any type of sensor adapted to detect a trigger, such as, for example, motion, temperature, humidity, proximity of a user or operator, etc.
The MCU 106 is also operably coupled to the first second, and third data circuits 116, 118, and 120, and may be operably coupled to the power circuit 112 via the power management module (PMC) 110. The first and third data circuits 116, 120 may also function as I/O connectivity into and out of the PCB 102. The MCU 106 processes, conditions, and interprets data received from sensor module 104 via the I/O data circuit 122 to make logical decisions based on instructions stored in a memory of the MCU 106.
The illumination circuit 108 and power management module (PMC) 110 are operably coupled to the power circuit 112. The PMC 110 may convert input power (such as, for example, 12V DC power) to another level, such as a lower power level, for example 2.8V DC. The lower power level, 2.8V DC, can be used to power other components on the PCB 102 such as the sensor module 104 and the MCU 106.
The illumination circuit 108 is also operably coupled to the second data circuit 118 and the MCU 106 via the second data circuit 118. In an embodiment, the illumination circuit 108 includes a lighting element 124, a switching element, such as, for example, a MOSFET 126, and a legend 128. The lighting element 124 may be any type of element that illuminates. In an example, the lighting element 124 is a light emitting diode (LED).
As illustrated, the lighting element 124, MOSFET 126, and legend 128 may be operably coupled to the power circuit 112. The MOSFET 126 may also be operably coupled to the second data circuit 118. The MCU 106 uses data received from a sensor source of the sensor module 104 via the I/O data circuit 122 to send signals and/or data to the MOSFET 126 to instruct the MOSFET 126, via the second data circuit 118, to switch between OFF and ON states, and to thereby selectively cause the lighting element 124 to operate or not operate.
In an embodiment, the MOSFET 126 may cause illumination or cease illumination of the lighting element 124 by operably coupling or decoupling the lighting element 124 to/from the ground circuit 114. In an another embodiment, the MOSFET 126 may trigger a switching operation to open or close the power circuit 112 into the lighting element 124. The signal from the MCU 106 that triggers the MOSFET 126 is also operably coupled to the second data circuit 118 and first and second S data terminals T1/S and T2/S. In this configuration, the MOSFET 126 can also receive signals via the second data circuit 118 which originate from a source external to the MCU 106 (such as an external switch or other module 100).
Referring to
As described above, the PCB 102 may include dual I/O terminals for power (T1/P, T2/P) and dual I/O data terminals (T1/O, T2/O; T1/S, T2/S; and T1/D, T2/D). The first terminals may be positioned at a first end of the PCB 102, and the second terminals may be positioned at a second end (opposite the first end) of the PCB. The dial I/O terminal allows for the PCB 102 (or module 100) to be operably coupled to additional PCBs 102 (or modules 100).
Referring to
The first module 100 may also be operably coupled to a power source 202 and a switch 204. For example, the first power terminal T1/P and first ground terminal T1/G of the first module 100 are operably coupled to the power supply 202. The power source 202 may send power and/or act as a ground. The first O data terminal T1/O and first S data terminal T1/S of the first module 100 are operably coupled to the switch 204. The switch 204 can thus selectively communicate with the MCU 106 of one or more of the modules 100, 100′, 100″ via the first data circuit 116, and/or communicate with the MCU 106 and illumination circuit 108 of one or more of the modules 100, 100′, 100″ via the second data circuit 118. The communication over the second data circuit 118 may be used, for example, to select pre-programmed functions and/or algorithms stored on the memory of the MCU 106 of one or more of the modules 100, 100′, 100″ that direct or control operation of the system or network and connected modules 100, 100′, 100″.
In an example, and referring to
In another example, referring to
In yet another example, and referring to
It should be appreciated that any number of modules 100 may be operably coupled together to form a system or network as desired. Further, each MCU 106 may include the same or different instructions stored in memory to cause illumination or cease illumination of the respective lighting element 124, as desired. Thus, each of the modules 100 can function in accordance with their own instructions, or operate based on instruction received from another module 100.
For example, each MCU 106 may include a central processing unit (CPU) for processing data and computer-readable instructions, and a memory. The MCU 106 retrieves data signals from the sensor module 104 and uses the memory for storage of instructions and data. The memory may include one or more types of volatile and/or non-volatile solid-state storage, such as random access memory (RAM), flash memory, read-only memory (ROM), magneto resistive RAM (MRAM), phase-change memory, etc. Computer instructions for operating the module(s) and its various components may be executed by the MCU 106, using the memory as temporary “working” storage at runtime. The computer instructions may be stored in memory or an external device. Alternatively, some-or-all of the executable instructions may be embedded in hardware or firmware in addition to or instead of software.
The modules 100 disclosed herein may be implemented on any number of different devices, including but not limited to, power tools, hand tools, tool storage units, etc. In an example, and referring to
As described herein, by providing a module 100 incorporating the sensor module 104 and illumination circuit 108 on a printed circuit board 102, the overall package size can be minimized and/or assembly complexity reduced. Further, by providing I/O data and power circuits and/or lines, multiple modules 100 can be operably coupled together to increase system capacity and/or to increase overall size, as needed. Such a modular sensor based illumination system can be scaled and controlled by external switches or data computational elements to operate in accordance with the needs and desires of a manufacturer or operator.
As used herein, the term “coupled” and its functional equivalents are not intended to necessarily be limited to direct, mechanical coupling of two or more components. Instead, the term “coupled” and its functional equivalents are intended to mean any direct or indirect mechanical, electrical, or chemical connection between two or more objects, features, work pieces, and/or environmental matter. “Coupled” is also intended to mean, in some examples, one object being integral with another object. As used herein, the term “a” or “one” may include one or more items unless specifically stated otherwise.
The matter set forth in the foregoing description and accompanying drawings is offered by way of illustration only and not as a limitation. While particular embodiments have been shown and described, it will be apparent to those skilled in the art that changes and modifications may be made without departing from the broader aspects of the inventors' contribution. The actual scope of the protection sought is intended to be defined in the following claims when viewed in their proper perspective based on the prior art.
Number | Name | Date | Kind |
---|---|---|---|
4791536 | James | Dec 1988 | A |
5997152 | Ogihara et al. | Dec 1999 | A |
6016038 | Mueller | Jan 2000 | A |
6166496 | Lys | Dec 2000 | A |
6461019 | Allen et al. | Oct 2002 | B1 |
6491412 | Mohacsi et al. | Dec 2002 | B1 |
6494590 | Paganini et al. | Dec 2002 | B1 |
6659622 | Iso et al. | Dec 2003 | B2 |
6971765 | Wu | Dec 2005 | B2 |
7036962 | Chan | May 2006 | B2 |
7102172 | Fraitag et al. | Sep 2006 | B2 |
7178941 | Morgan et al. | Feb 2007 | B2 |
7322718 | Matsui et al. | Jan 2008 | B2 |
7658501 | Niemann | Feb 2010 | B2 |
7775681 | Kim et al. | Aug 2010 | B2 |
7862195 | Douglas et al. | Jan 2011 | B2 |
8001455 | Gloege et al. | Aug 2011 | B2 |
8262250 | Li et al. | Sep 2012 | B2 |
8305717 | Parker et al. | Nov 2012 | B2 |
8308320 | Carney et al. | Nov 2012 | B2 |
8344410 | Burghardt et al. | Jan 2013 | B2 |
8604509 | Wendler et al. | Dec 2013 | B2 |
8611057 | Crawbuck et al. | Dec 2013 | B2 |
8632214 | Tickner et al. | Jan 2014 | B1 |
8641229 | Li | Feb 2014 | B2 |
8757838 | Hente et al. | Jul 2014 | B2 |
8764220 | Chan et al. | Jul 2014 | B2 |
8777453 | Deely et al. | Jul 2014 | B2 |
8905579 | Dobbins et al. | Dec 2014 | B2 |
9101027 | Donegan et al. | Aug 2015 | B2 |
9222655 | Radermacher | Dec 2015 | B2 |
9228732 | Li | Jan 2016 | B2 |
9476579 | Kamitani et al. | Oct 2016 | B2 |
9510413 | Athalye et al. | Nov 2016 | B2 |
9518706 | Chan et al. | Dec 2016 | B2 |
9573257 | Kynast et al. | Feb 2017 | B2 |
9638401 | Li | May 2017 | B2 |
9967957 | Hall et al. | May 2018 | B2 |
10207380 | Hegarty et al. | Feb 2019 | B2 |
10724712 | Li | Jul 2020 | B2 |
10757767 | Song | Aug 2020 | B2 |
10813201 | Ghahramani | Oct 2020 | B1 |
20020149933 | Furry et al. | Oct 2002 | A1 |
20030057886 | Lys | Mar 2003 | A1 |
20030222587 | Dowling, Jr. | Dec 2003 | A1 |
20060002110 | Dowling et al. | Jan 2006 | A1 |
20090021955 | Kuang | Jan 2009 | A1 |
20090129088 | Custodis | May 2009 | A1 |
20090147503 | Bennett | Jun 2009 | A1 |
20100219758 | Melzner | Sep 2010 | A1 |
20120050606 | Debevec | Mar 2012 | A1 |
20120320595 | Enke | Dec 2012 | A1 |
20160234892 | Niebert | Aug 2016 | A1 |
20170103926 | Aoyagi et al. | Apr 2017 | A1 |
20200096162 | May | Mar 2020 | A1 |
20200323059 | Hua | Oct 2020 | A1 |
20210144834 | De Vries | May 2021 | A1 |
Number | Date | Country |
---|---|---|
201244796 | May 2009 | CN |
204235469 | Apr 2015 | CN |
111713180 | Sep 2020 | CN |
112154714 | Dec 2020 | CN |
102008003484 | Jul 2009 | DE |
2009226513 | Oct 2009 | JP |
2011020230 | Feb 2011 | JP |
201340777 | Oct 2013 | TW |
2009008428 | Jan 2009 | WO |
2012160390 | Nov 2012 | WO |
2017207423 | Dec 2017 | WO |
Entry |
---|
Combined Search and Examination Report for corresponding Application No. GB2200882.5 dated Jul. 13, 2022, 8 pages. |
Taiwan Office Action for corresponding Application No. 11120760590 dated Aug. 3, 2022, 9 pages. |
Number | Date | Country | |
---|---|---|---|
20220248519 A1 | Aug 2022 | US |