This application is based on and claims priority from Japanese Patent Application No. 2019-112233 filed on Jun. 17, 2019, and the entire contents of which are incorporated herein by reference.
The present invention relates to a circuit body, a connection structure of a board and a circuit body, and a busbar module.
Conventionally, flexible circuit boards (FPCs; FPC stands for flexible printed circuits) are provided with wiring patterns are used as interconnections for connecting various kinds of electronic devices (refer to Patent document 1, for example). In general, flexible circuit boards have a structure that a thin-film conductor layer having prescribed wiring patterns (i.e., circuits) is sandwiched between insulating films and have, in particular, a feature that they can be deformed (e.g., curved) flexibly while their electric characteristics are maintained.
As for details of the above connector, refer to JP 2002-093995 A.
Incidentally, one method for attaching terminals for connection to an external device or the like to an end portion of a flexible circuit board is to form openings by removing portions of a protective layer of the flexible circuit board and connecting the terminals to portions of conductor layers (wiring patterns) exposed in the openings, respectively, by soldering or the like. However, in this case, if a strong force acts on a terminal unintentionally, a strong force is also exerted on the wiring pattern (conductive layer) via the terminal, possibly causing trouble that, for example, the wiring pattern is peeled off the protective layer.
An object of the invention is therefore to provide a circuit body capable of suppressing peeling between a conductor layer of a wiring pattern and a protective layer, a connection structure of such a circuit body and a board, and a busbar module using such a circuit body.
Embodiments of the present invention provide the following items [1] to [3]:
[1] A circuit body comprising a flexible circuit board including: a conductor wiring pattern for electrical connection; and a pair of protective layers sandwiching the wiring pattern to isolate the wiring pattern from outside, the wiring pattern having a conduction portion exposed to the outside through an opening located on at least one of the pair of the protective layers and to be electrically connected to an external terminal, the conduction portion having at least two overlap portions located around the opening and sandwiched between the pair of the protective layers in a thickness direction of the flexible circuit board.
[2] A connection structure of a board and a circuit body, the connection structure comprising: a board; the circuit body according to the item [1]; and a terminal electrically connecting the board and the circuit body, the terminal passing through the opening of the circuit body and being soldered to the conduction portion exposed in the opening to be connected to the wiring pattern and being electrically connected to a circuit wiring on the board.
[3] A busbar module to be attached to a battery assembly having a stack of a plurality of cells, the busbar module comprising:
According to first aspect of the invention, relating to the item [1], the conduction portion of each wiring pattern is exposed through the corresponding opening of the protective later and has, around the opening, at least two overlap portions which are located at such positions as to be sandwiched between the pair of protective layers in the thickness direction of the flexible circuit board. With this structure, even if external force acts on a wiring pattern (in particular, conduction portion) via, for example, the terminal connected to the conduction portion, the overlap portions sandwiched between the pair of protective layers can receive the external force sustainably. As a result, peeling of each wiring pattern from the protective layer can be suppressed more successfully than in a case that there is only one overlap portion (e.g., a conduction portion is a portion including the end of each wiring pattern that is only one wiring pattern extending from the conduction portion).
According to second aspect of the invention, relating to the item [2], each wiring pattern whose peeling from the protective layer is suppressed as described above is connected to the board using the associated terminal. As a result, in this connection structure, proper electrical connection between the board and the circuit body can be maintained even if unintended external force acts on the connection structure.
According to third aspect of the invention, relating to the item [3], the conduction portion of each wiring pattern is exposed through the corresponding opening of the protective later and has, around the opening, at least two overlap portions which are located at such positions as to be sandwiched between the pair of protective layers in the thickness direction of the flexible circuit board. With this structure, even if external force acts on a wiring pattern (in particular, conduction portion) via, for example, the terminal connected to the conduction portion, the overlap portions sandwiched between the pair of protective layers can receive the external force sustainably. As a result, peeling of each wiring pattern from the protective layer in the connection portion of the circuit body and the connector can be suppressed more successfully than in a case that there is only one overlap portion (e.g., a conduction portion is a portion including the end of each wiring pattern that is only one wiring pattern extending from the conduction portion). Thus, peeling or the like at the contact between each terminal and the corresponding wiring pattern due to, for example, curving of the circuit body can be suppressed.
The invention can provide a circuit body capable of suppressing peeling between a conductor layer of a wiring pattern and a protective layer, a connection structure of such a circuit body and a board, and a busbar module using such a circuit body.
The invention has been described above concisely. The details of the invention will become more apparent when the modes for carrying out the invention (hereinafter referred to as an embodiment) described below are read through with reference to the accompanying drawings.
A busbar module 10 according to an embodiment of the present invention will be hereinafter described with reference to the drawings. The busbar module 10 according to the embodiment is used being attached to a battery assembly (i.e., a battery module in which plural cells are laid on each other) that is a drive power source installed in an electric vehicle, a hybrid vehicle, or the like.
First, a battery assembly 1 to which the busbar module 10 according to the embodiment is to be attached will be described. As shown in
The battery assembly 1 is configured by laying the cells 2 on each other in a prescribed direction (stacking direction) in such a manner that the positive electrodes 4 and the negative electrodes 5 of the cells 2 are arranged alternately. The positive electrode 4 of one of end cells 2 located at the two respective ends of the series connection of the cells 2 of the battery assembly 1 serves as an assembly positive electrode and the negative electrode 5 of the other end cell 2 serves as an assembly negative electrode.
Next, the busbar module 10 according to the embodiment will be described. As shown in
As shown in
Band-shaped first branch portions 22 extending in the direction that crosses the longitudinal direction and the thickness direction of the main strip 21 (i.e., outward in the width direction of the main strip 21) are connected to the side edges, extending parallel with the longitudinal direction (in this example, substantially coincident with the stacking direction of the battery assembly 1) of the main strip 21. Band-shaped second branch portions 23 extend from the tips of the first branch portions 22, respectively, in parallel with the stacking direction of the battery main bodies 3. The main strip 21, the first branch portions 22, and the second branch portions 23 are an FPC and hence can be deformed flexibly particularly in the direction that is perpendicular to their planes.
As shown in
The first branch portions 22 are located outside the main strip 21 in the same plane as the main strip 21, and the second branch portions 23 are connected to the respective first branch portions 22. Thus, the second branch portions 23 are located outside the main strip 21 in its width direction and extend generally downward so as to assume an S shape in a state that there is no deviation between the battery assembly 1 and the circuit body 20 (see
An end portion, opposite to the first branch portion 22, of each second branch portion 23 is a tip portion 232 having a plane that is approximately parallel with the main strip 21, and a connection portion 24 is attached to the top surface of the tip portion 232. The bottom surface of the connection portion 24 is parallel with and at a different height as the bottom surface of the main strip 21, and hence these bottom surfaces are spaced from each other. The top surface of the connection portion 24 is connected to a busbar 25 that connects a positive electrode 4 and a negative electrode 5 of adjacent cells 2 of the battery assembly 1. Since the second branch portion 23 is thus connected to the electrodes 4 and 5 of those cells 2 via the connection portion 24 and the busbar 25, the associated voltage detection line 211 is connected to the electrodes 4 and 5.
As shown in
Busbars 25A that are located at the two respective ends of the main strip 21 in its longitudinal direction are connected to the assembly positive electrode or the assembly negative electrode and are each formed with one electrode hole 253 through which the assembly positive electrode or the assembly negative electrode is to be inserted. Power cables (not shown) for extracting power from the battery assembly 1 are connected to the respective busbars 25A. The internal structures of the main strip 21, the first branch portion 22, and the second branch portion 23 which constitute the circuit body 20 will be described later.
As shown in
Two busbar housing portions 32 for housing the busbars 25 are provided outside the main strip housing portion 31 in the width direction. Each busbar housing portion 32 is provided with plural housing spaces 33 which are to house respective busbars 25 and are arranged in the stacking direction of the cells 2. As also shown in
As shown in
Bottom end portions of the outer wall 331 and the inner wall 332 are connected to each other by a connection plate 333. The bottom end portions of the outer wall 331 and the inner wall 332 are formed with lock nails 334 inside, whereby a busbar 25 can be held between the connection plate 333 and the lock nails 334. Projections 338 project inward from the inner side surfaces of the outer wall 331 and the inner wall 332 at the centers in the stacking direction, respectively. The projections 338 serve to position the associated busbar 25 by fitting into the respective positioning recesses 254 (see
The inner wall 332 is formed with a cut 336 and a support plate 337 projects inward at a position corresponding to the cut 336. As a result, the connection piece 252 of the busbar 25 housed in the housing space 33 is supported by the support plate 337.
The connection plate 333 is formed with spaces 335 on the two respective sides of the center in the stacking direction. Thus, the positive electrode 4 and the negative electrode 5 of the cells 2 can be exposed in the housing space 33 through the respective spaces 335 and can be connected to the electrode holes 253 of the busbar 25 housed in the housing space 33. A bottom plate may be provided in place of the connection plate 333 so as to be formed with cuts or holes corresponding to the positive electrode 4 and the negative electrode 5 of the cells 2, respectively.
As shown in
Next, a description will be made of how the busbar module 10 operates.
As described above, the main strip 21 is put on the main strip support members 311 of the holder 30 and hence can move upward and in the longitudinal direction. Although the busbars 25 are housed in the respective housing spaces 33, the housing spaces 33 can move in the longitudinal direction of the main strip 21. The main strip 21 is connected to the busbars 25 via the respective second branch portion 23 which are bent in an S shape (see
Even if, for example, the battery assembly 1 is deformed in this state and the relative positional relationship between the battery assembly 1 and the circuit body 20 is changed and the relative positional relationships between the main strip 21 and the busbars 25 are thereby changed, the changes (deviations) in the relative positional relationships can be absorbed by bending or stretching of the second branch portions 23. Likewise, even if the size of the battery assembly 1 in its stacking direction varies from one battery assembly 1 manufactured to another due to an assembling allowance of the plural cells 2, that manufacture dispersion can be absorbed by bending or stretching of the second branch portions 23.
This will be described below more specifically.
In the above-described embodiment, the bent portion 231 of each second branch portion 23 is bent so as to assume an S shape (or inverted S shape) as a whole. Alternatively, as shown in
Although in the above embodiment each first branch portion 22 is in the same plane as the main strip 21, as shown in
Next, the internal structures of the main strip 21, the first branch portions 22, and the second branch portions 23 which constitute the circuit body 20 will be described with reference to
As described above, the main strip 21, the first branch portions 22, and the second branch portions 23 which constitute the circuit body 20 are an FPC. As shown in
The top metal layer 203a which is located above (located on the front side of) the center plane, in the thickness direction, of the resin layer 201 and the bottom metal layer 203b which is located below (located on the back side of) the center plane, in the thickness direction, of the resin layer 201 are buried in the resin layer 201. The top metal layer 203a and the bottom metal layer 203b are spaced from each other in the thickness direction of the resin layer 201 and the resin layer 201b of the resin layer 201 is interposed between them. That is, the top metal layer 203a and the bottom metal layer 203b are insulated from each other.
The top metal layer 203a consists of top wiring patterns 204a which are part of the above-mentioned plural wiring patterns, top dummy patterns 205a which are independent of the top wiring patterns 204a, and the above-mentioned connection portions 24 which are independent of the top wiring patterns 204a.
The bottom metal layer 203b consists of bottom wiring patterns 204b which are the remaining part of the above-mentioned plural wiring patterns and bottom dummy patterns 205b which are independent of the bottom wiring patterns 204b. Corresponding ones of the top wiring patterns 204a and the bottom wiring patterns 204b are electrically connected to each other in the thickness direction of the circuit body 20 through a corresponding via hole 206.
Among the first branch portions 22 and the second branch portions 23 provided on the two sides in the width direction of the main strip 21, each set of a first branch portion 22 and a second branch portion 23 located on one side in the width direction (right side in each of
On the other hand, among the first branch portions 22 and the second branch portions 23, first, as shown in
Since the top wiring patterns 204a and the bottom wiring patterns 204b are collected before being connected to the connector 212 using both of the top metal layer 203a and the bottom metal layer 203b, the plural interconnections extending from the plural busbars 25 can be connected to the connector 212 after their arrangement order is changed to an order that corresponds to the arrangement order of the cells 2 (see
The top dummy patterns 205a and the bottom dummy patterns 205b are formed in most of the area of the portion, housed in the holder 30, of the main strip 21 (i.e., the portion excluding the exposed portion 213) excluding the areas occupied by the top wiring patterns 204a and the bottom wiring patterns 204b. The top dummy patterns 205a and the top wiring patterns 204a and the bottom dummy patterns 205b and the bottom wiring patterns 204b are spaced from each other so as not to be electrically connected to each other. The top dummy patterns 205a and the bottom dummy patterns 205b are provided mainly for the purpose of making the stiffness of the portion, housed in the holder 30, of the main strip 21 (i.e., the portion excluding the exposed portion 213) higher than that of the first branch portions 22 and the second branch portions 23.
As shown in
Two portions of each conduction portion 214a, that is, a portion 214c that is closer to the end of the circuit body 20 than the opening 301 is and a portion 214d that is closer to the main strip 21 than the opening 301 is, are sandwiched between the protective layers 201a and 201b so as to overlap with them.
Likewise, openings 302 are formed in the bottom resin layer 201c. The terminals 212a are fixed, with solder H, to portions, exposed in the respective openings 302, of a bottom dummy pattern 205b. This fixing is not for electrical connection but for more reliable holding of the terminals 212a.
In this example, each conduction portion 214a is formed in such a manner that the portion 214c closer to the end of the circuit body 20 and the portion 214d that is closer to the main strip 21 are approximately on a straight line. However, if necessary, the two portions 214c and 214d may be inclined with respect to each other.
As described above, in the circuit body 20 according to the embodiment, the conduction portion 214a of each wiring pattern 204a is exposed through the corresponding opening 301 of the protective later 201a and has, around the opening 302, at least two overlap portions 214c and 214d which are located at such positions as to be sandwiched between the pair of protective layers 201a and 201b in the thickness direction of the flexible circuit board. With this structure, even if external force acts on a wiring pattern 204a (in particular, conduction portion 214a) via, for example, the terminal 212a connected to the conduction portion 214a, the overlap portions 214c and 214d sandwiched between the pair of protective layers 201a and 201b can receive the external force sustainably. As a result, peeling of each wiring pattern 204a from the protective layer 201a can be suppressed more successfully than in a case that there is only one overlap portion 214a or 214d (e.g., a conduction portion 214a is a portion including the end of each wiring pattern 204a that is only one wiring pattern extending from the conduction portion 214a).
Furthermore, each wiring pattern 204a whose peeling from the protective layer 201a is suppressed as described above is connected to the board B using the associated terminal 212a. As a result, in this connection structure, proper electrical connection between the board B and the circuit body 20 can be maintained even if unintended external force acts on the connection structure.
Still further, peeling of each wiring pattern 204a from the protective layer 201a in the portions 214c and 214d where the circuit body 20 is connected to the connector 212 can be suppressed. As a result, peeling or the like at the contact between each terminal 212a and the corresponding wiring pattern 204a due to, for example, curving of the circuit body 20 can be suppressed.
The invention is not limited to the above embodiment and various modifications, improvements, etc. can be made as appropriate within the scope of the invention. The materials, shapes, sets of dimensions, numbers, locations, etc. of the respective constituent elements of the above embodiment are not limited to those disclosed but can be determined in desired manners as long as the invention can be implemented.
Features of the above-described busbar module 10 etc. according to the embodiment of the invention will be summarized below concisely in the form of items [1] to [3]:
[1] A circuit body (20) comprising a flexible circuit board including: a conductor wiring pattern (204a) for electrical connection; and a pair of protective layers (201a, 201b) sandwiching the wiring pattern (204a) to isolate the wiring pattern (204a) from outside,
Number | Date | Country | Kind |
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2019-112233 | Jun 2019 | JP | national |