Circuit breaker provided with parallel resistor

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to circuit breakers provided with main contacts and, in parallel therewith, resistance contacts, and in particular relates to circuit breakers fitted with a parallel resistor having improved resistance contacts.
2. Description of the Prior Art
Use is made, for example, in switchgears of power circuit breakers, or systems in which, as shown in FIG. 1, there are provided main contacts 1 and, electrically in parallel therewith, resistance contacts 2, the resistance being inserted in the circuit when the main contacts 1 are closed or when they are opened. This is for various reasons, which include the need to restrict abnormal voltages which are produced during switching, or to raise the switching capability of the contacts by limiting the rate of rise and the peak value of the voltage which is generated between the contacts after circuit-breaking. By the use of such a system not only can the abnormal overvoltages be suppressed, but also the life of the main contacts 1 can be increased and the reliability of the device can be improved.
A resistor material which was previously used to meet this objective used Al.sub.2 O.sub.3 replaced by SiO.sub.2 or the like. However, with the trend to larger capacity switchgear units, the parallel resistor also becomes larger, which militates against the trend to improved compactness of the device.
The resistance of the resistor is determined by the circuit to which it is applied and the overall application, but to suppress overvoltages generated when the main contacts are closed, it is necessary to make the resistance comparatively low (on the order of several hundred ohms). The heat which is generated by the resistor is proportional to the square of the applied voltage and inversely proportional to the resistance. Thus, if the voltage is high, an enormous amount of heat is generated by the resistor when the current is passed. Since this heat is generated instantaneously, it cannot be expected that it will be radiated from the resistor, and so it accumulates in the resistor material. In general the permissable rise in temperature of the switchgear has a limit, and if the temperature rises beyond this, the material swells up or becomes weakened, causing a deterioration in its electrical and mechanical properties and a decline in insulation strength. To control the rise in temperature of the switchgear, therefore, conventional resistors were of large volume, resulting in a large device being necessary.
SUMMARY OF THE INVENTION
Accordingly, one object of this invention is to provide a novel circuit breaker provided with main contacts and in parallel therewith resistance contacts defining an improved resistance structure and composition.
Another object of the present invention is to improve the main constituents of the resistive material of which the resistance contacts are composed.
These and other objects are achieved according to the invention by providing a resistor of chromium-containing ceramics material, this ceramics containing at least 30 wt % of at least one compound selected from Cr.sub.2 N, Cr.sub.3 C.sub.2, CrB.sub.2, Cr.sub.2 O.sub.3, NiO, and MgO. The resistor further contains a resistance adjusting material which is C, Si, B or the like semi-metal added to the main constituent, for example Cr.sub.2 N, Cr.sub.3 C.sub.2, and the like.
The resistor of the invention includes a power regulating element made of a material of which the product of its specific heat, expressed in Cal/g. .degree.C. and its density, expressed in g/cm.sup.3, is at least 0.7.

BRIEF DESCRIPTION OF THE DRAWINGS
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1 is a circuit drawing explaining the electrical circuit;
FIG. 2 is a schematic diagram, partly in cross-section, showing an embodiment of this invention;
FIG. 3 is a cross-sectional view of a resistor element having doughnut-shaped elements; and
FIG. 4 is a cross-sectional view of a resistor element having disc-shaped elements.

DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more particularly of FIG. 2 thereof, FIG. 2 shows an example of a circuit breaker fitted with a parallel resistance according to this invention. The main contacts 1, forming a puffer-type arc extinguisher, consist of a movable contact 3 and fixed contact 4. The movable contact 2 is driven by a drive device, not shown, through a like mechanism 5.
Resistance contacts 2 are connected electrically in parallel with the main contacts 1. The resistance contacts 2 consist of a movable contact 7 that is supported inside an insolating tube 6, and a fixed contact 10 electrically connected with a resistor 9 at the tip of an insulating support rod 8. The movable contact 7 is electrically connected to the resistor 9 that is supported by a hollow insulating support rod 11, and is driven by an operating rod 13 formed of an insulator and link mechanism 12 which is linked for joint movement with the link mechanism 5 of the main contacts 1. The resistor 9 is formed by placing a plurality of plate resistance elements face-to-face. The flat surfaces of these resistance elements are covered with metal to confer contact stability. They may be arranged in series in view of the resistance and withstand-voltage requirements of the circuit to which they are applied, or in parallel for withstand-energy requirements. The temperature rise .DELTA.T of the resistor 9 is dependent on the amount of head generated Q, and is inversely proportional to the resistance volume V. If we let the heat capacity be a, we have the following relationship:
.DELTA.T.varies.Q/aV
wherein a.ident.c.multidot..rho., c being the specific heat, and .rho. being the density. That is, if Q is kept constant by making the resistance and applied voltage constant, making the volume V smaller causes an increase in .DELTA.T , but the increase in .DELTA.T can be suppressed by increasing the value of a. The temperature rise (.DELTA.T) of the elements is dependent on the amount of heat (Q) which is generated and is inversely proportional to the total number of elements and their volume, so if the heat capacity per unit resistor element is multiplied by a factor b, the amount of energy that can be absorbed, Q, for the same rise in temperature .DELTA.T is also multiplied by b. For the same Q and .DELTA.T, the volume of the element can be reduced by 1/b, and the object of this invention, namely, increased heat capacity of the elements and compactness, can be achieved.
A resistor element according to this invention is explained in detail with reference to the accompanying drawings. The elements 1, which may be of doughnut shape as shown in FIG. 3, or disc-shaped as shown in FIG. 4, are held by a supporting pillar 21 of insulating material and subjected to suitable pressure through an elastic body 22. The elements 22 may be arranged in series to satisfy the resistance and withstand-voltage requirements of the circuit to which they are applied, or may be arranged in parallel to satisfy withstand-energy requirements. The surfaces of the elements have a metal covering to provide contact stability between the elements.
The invention is explained below with reference to Examples.
The producing process of Cr.sub.2 O.sub.3 (remainder)+MgO (10 wt %)+NiO (20 wt %) as shown in No. 2 in Table 1 is explained as follows. The producing method of the other embodiments shown in Tables 1 and 2 is same as that No. 2 in Table 1.
In a ball mil., 7000 g of chromium oxide (Cr.sub.2 O.sub.3), 100 g of magnesium oxide (MgO), and 2000 g nickel oxide (NiO) were well-blended for 12 hours. The lack grain of above-described constitutent is 325 mesh. Some paraffin was added to the mixture which result in containing 1% paraffin by weight. The mixture forms moldings having a diameter of 15 cm and a thickness of 2.2 cm by a pressure of 1 ton per square cm. The moldings were sintered at 1350.degree. C. in air for 2 hours. Both end faces of the disc-shaped element have argentum coating and are sintered at 700.degree. C. in air for 15 minutes, and the electrodes are attached on both sides of the resistor element. The 100 resistor elements produced as above described are connected in series. This was employed in a circuit at 550 V, for an insertion time of 10 ms. The test was carried out at room temperature in all cases.
TABLE 1__________________________________________________________________________ Temperature rise .increment.T (.degree.C.) of the Heat element after Capacity passage ofNo. Material (cal/cm.sup.3 .degree.C.) current__________________________________________________________________________1 Cr.sub.2 O.sub.3 0.83 632 Cr.sub.2 O.sub.3 + 10 w % MgO + 20 w % NiO 1.0 633 Cr.sub.2 O.sub.3 + 40 w % MgO + 20 w % NiO 0.91 694 Cr.sub.2 O.sub.3 + 69 w % ZrO.sub.2 + 0.8 w % C 0.87 735 Cr.sub.2 O.sub.3 + 25 w % Al.sub.2 O.sub.3 + 1 w % C 0.76 836 Cr.sub.2 O.sub.3 + 2 w % TnO.sub.2 + 1 w % boron 1.18 557 Cr.sub.2 O.sub.3 + 5 w % Si 1.3 498 Cr.sub.2 O.sub.3 + 15 w % FeO 0.70 719 Cr.sub.2 O.sub.3 + 5 w % NiO 0.84 6110 Cr.sub.3 C.sub.2 0.79 5611 Cr.sub.3 C.sub.2 + 2 w % Si 0.83 7712 Cr.sub.3 C.sub.2 + 20 w % SiO.sub.2 0.80 8013 Cr.sub.3 C.sub.2 + 70 w % (2MgO--SiO.sub.2) 0.70 9114 Cr.sub.2 N + 20 w % Al.sub.2 O.sub.3 0.90 7115 Cr.sub.2 N + 1 w % C 0.91 5916 CrB.sub.2 + 20 w % MgO 0.93 6817 MgO + 2 w % C 0.70 9218 MgO + 20 w % SiO.sub.2 + 2 w % C 0.67 9419 NiO + 1 w % C 0.95 5120 NiO + 20 w % SiO.sub.2 + 2 w % C 0.74 8521 NiO + 60 w % MgO + 2 w % C 0.73 8722 Fe.sub.2 O.sub.3 + 1 w % C 0.73 6823 MnO + 2 w % C 0.76 67__________________________________________________________________________
TABLE 2__________________________________________________________________________ Temperature rise .increment.T (.degree.C.) of the Heat element after Capacity: a passage ofNo. Material (cal/cm.sup.3 :c) current__________________________________________________________________________24 Cr.sub.2 O.sub.3 + 80 w % Al.sub.2 O.sub.3 + 2 w % C 0.58 11125 Cr.sub.2 O.sub.3 + 80 w % SiO.sub.2 0.60 10626 Al.sub.2 O.sub.3 + 2 w % C 0.53 12027 Al.sub.2 O.sub.3 + 2 w % SiO.sub.2 + 2 w % C 0.59 10828 AlN + 20 w % Al.sub.2 O.sub.3 + 2 w % C 0.56 11429 AlN + 2 w % C 0.51 11130 MgO + 80 w % SiO.sub.2 + 2 w % C 0.53 11931 NiO + 80 w % SiO.sub.2 + 2 w % C 0.48 13332 SnO.sub.2 + 2 w % C 0.56 11833 SiC + 2 w % C 0.51 11434 ZrB.sub.2 + 20 w % CaO 0.61 104__________________________________________________________________________
Examples 1 to 23 as shown in Table 1 belong to the scope of this invention and the examples 24-34 as shown in Table 2 do not belong to the scope of this invention. The resistor element as shown Example 1 which consists of pure chromium oxide (Cr.sub.2 O.sub.3) shows the temperature rise .DELTA.T of 63.degree. C. The resistor elements as shown Example 2-9 contain 3 to 70 wt % of at least MgO, ZrO.sub.2 and the like in addition to the major constituent Cr.sub.2 O.sub.3. The temperature rise .DELTA.T of these Examples are more than that of the Example 1 with the exception of examples 6, 7 and 9. The resistor of Example 24 which is out of scope of this invention contains more than 80 by weight of Al.sub.2 O.sub.3 and 2% by weight of C and the like in addition to major constitutent Cr.sub.2 O.sub.3 . The temperature rise .DELTA.T of the Example 24 is 111.degree. C. Accordingly, it is desirable that the resistor element contains more than 30% by weight of chromium oxide (Cr.sub.2 O.sub.3).
The resistor element as shown Example 10 consists of pure chromium carbon (Cr.sub.3 C.sub.2). The temperature rise .DELTA.T of this Example is 56.degree. C. The resistor elements as shown in Examples 11-13 contains 20 to 70% by weight of Si, SiO.sub.2 in addition to the major constitutent Cr.sub.3 C.sub.2. The temperature rise of these Examples is higher than that of Example 10.
The Example 25 which is out of scope of this invention contains 80% by weight of silicon oxide (SiO.sub.2) in addition to Cr.sub.3 C.sub.2. The temperature rise of this Example is 106.degree. C. Accordingly, it is necessary that resistor element contains more than 30% by weight chromium carbon (Cr.sub.3 C.sub.2). As is shown by Examples 10 to 13, 25 there is a clear difference beween these, which contain at least 30 wt % of Cr.sub.3 C.sub.2, and reference resistor element, which contains 20 wt %. As described above, there is also a clear difference between the examples containing at least 30 wt % of Cr.sub.3 O.sub.2 and reference resistor element which contains 20 wt %. The resistor element which contains more than 30% by weight of Cr.sub.2 N as shown by Examples 14 and 15, and CrB.sub.2 as shown by Example 16 as a major constituent have a low temperature rise. The resistor elements which contain 30% by weight of Cr.sub.3 Zr, CrSi.sub.2, Cr.sub.3 Si.sub.2, Cr.sub.2 S.sub.3, Cr.sub.3 P as major constituents have a same effect as described above.
With regards MgO, as can be seen by comparing the Examples 17 and 18 which are within the scope of the this invention and Example 30 which is out of the scope of this invention, the temperature rise of the resistor element which contains less than 30% by weight of MgO is higher than that of the resistor element which contains more than 30% by weight of MgO.
With regards to NiO, as can be seen by comparing the Example 19 which is within the scope of this invention and Example 31 which is out of the scope of this invention, the temperature rise of the resistor element which contains less than 30% by weight of NiO is higher than that of the resistor element which contains more than 30% by weight of NiO.
With regards to N, B the same effect as described above are expected.
As can be seen by comparing the above comparative Tables 1 and 2, the type of material used for the elements appears as a difference in the temperature rises. This shows that the selection of the material to achieve the object of this invention is a very important factor. The specific heat of the Al.sub.2 O.sub.3 which was the main material used previously is 0.14 Cal/g. .degree.C., and its density is 3.8 g/cm.sup.3, giving a product a of 0.53. In constrast, the specific heat of Cr.sub.2 O.sub.3 is 0.16 Cal/g. .degree.C., and its density is 5.2, giving a product a of 0.83. It can be seen that in the latter case, that of Cr.sub.2 O.sub.3, the product a is about 60% larger. This shows that Cr.sub.2 O.sub.3, of which the heat capacity, i.e., the product of the specific heat and the density, is the larger, per unit, is better than Al.sub.2 O.sub.3 for the object of this invention, namely, of realizing an element of large heat capacity but small volume.
The results obtained for several materials are shown in Table 1. It can be seen that those materials whose heat capacity is greater than 0.7 show temperature characteristics which are referable in practical use. In general, with materials which have a heat capacity of at least 0.7, a satisfactory temperature characteristic for practical use is obtained. The object of this invention can therefore be achieved by the use of materials containing Cr, such as Cr.sub.3 C.sub.2, Cr.sub.2 N, or CrB.sub.2 to obtain resistance elements of large heat capacity but small volume. Concerning the lower limit of the content thereof, as can be seen from reference examples 24 and 25 at 20 wt % the effect is low, so at least 30 wt %, as in examples 1 to 16 is necessary. For the purposes of adjustment of the sintering conditions, mechanical properties or electrical resistance, other Cr compounds, e.g. Cr.sub.2 Zr, CrSi.sub.2, Cr.sub.3 Si.sub.2 or Cr.sub.2 S.sub.3, Cr.sub.2 O.sub.3, Cr.sub.3 P, etc may be admixed to obtain a similar effect.
Many insulating materials are used in the interior of switchgears, but epoxy resins or glass fibers impregnated with epoxy resin are often used where mechanical strength is required. The allowed temperatures for satisfactory electrical strength and mechanical strength are generally about 120.degree. C. in the case of the former and 200.degree. C. in the case of the latter. Assuming that the temperature rise for one duty is about 80.degree.-100.degree. C. and the temperature in the neighborhood of the element due to passage of current before this element was inserted is about 40.degree. C. (typical measured values), the after-duty temperature will be 120.degree. C.-140.degree. C. The present situation is therefore that the only insulating material that can be used is epoxy-impregnated glass fiber. However, this is inferior in electrical properties to epoxy resin, and, since it is a composite material, there are problems in respect of product stability such as the presence of voids, and its reliability is inferior to epoxy resin. Thus as shown in Table 1 if an element whose heat capacity is at least 0.7 is used, the temperature rise .DELTA.T can be 50.degree. C.-70.degree. C., so the temperature in the neighborhood of the element is 90.degree. C.-110.degree. C. Thus not only can the element be made compact, but in addition there is the further advantage that epoxy resin can be used.
The total resistance of all the elements varies depending on the relevant circuit conditions. However, even in the case of Al.sub.2 O.sub.3, whose resistivity is 10.sup.13-15 .OMEGA. cm, the required resistance can easiliy be obtained by admixture of several % of carbon. The resistance of the element material of this invention can likewise be adjusted by adding semi-metals such as silicon or boron, apart from carbon as mentioned above. Apart from addition of semi-metals, the resitivity may be freely adjusted by combination with oxides, borides, silicides, or nitrides, etc. As shown in example 9, a resistivity of 1.about.2 .OMEGA.cm can be obtained by the addition of 1% NiO to Cr.sub.2 O.sub.3, which has a resistivity of about 15 .OMEGA.cm , or a resistivity of 0.7 .OMEGA.cm by 5% NiO addition. Apart from this, the resistance can of course be adjusted by means of grain size, forming pressure, sintering temperature, time residual porosity, and particle shape.
As explained in detail above, by means of this invention a heat absorbing element can be provided which has the same volume as was previously used but which can absorb a large amount of heat, so making it possible to make the device more compact.
Obviously, numerous additional modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.

Number	Date	Country
56-160954	Oct 1981	JPX
56-210039	Dec 1981	JPX
57-42974	Mar 1982	JPX

Number	Name	Date
3763340	Noack	Oct 1973
3766510	Quinn	Oct 1973
3811103	Matsuoka et al.	May 1974
4213113	Brandt et al.	Jul 1980
4265844	Yokomizo et al.	May 1981

Circuit breaker provided with parallel resistor

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