The disclosed subject matter generally relates to circuit card assemblies, and more particularly, to stacked circuit card assemblies using conductive stand-offs.
Many electronic systems include stacked circuit card assemblies. Providing a high current power bus to these assemblies and fitting the bus within the circuit card diameter on a small size, weight, and power (SWAP) package can be a challenge because most circuit card surface area is occupied by electrical components. Typically, high current connections require relatively large conductive paths, in comparison to signal connections. One space-saving approach includes sending power through connectors designed for signals. In such cases, the power must be distributed through multiple pins on the connector and the device must be derated (by limiting the number of adjacent pins supplying power or the current through each pin) to stay below the maximum current rating for the connector to avoid damage or failure from overheating. The recruitment of pins for power also reduces the number of pins available for transferring signals between circuit boards. Additionally, power components and signal components are preferably spaced apart to reduce noise coupling. Thus, a need exists for a compact and robust power transmission solution.
A stacked circuit card assembly includes a power supply having a positive terminal and a negative terminal, a first circuit card having a first via electrically connected to the positive terminal and a second via electrically connected to the negative terminal, and a second circuit card having a third via aligned with the first via and a fourth via aligned with the second via. The assembly further includes a first conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card, and a second conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card. The first conductive stand-off provides a conductive pathway between the first via and the third via, and the second conductive stand-off provides a conductive pathway between the second via and the fourth via.
While the above-identified figures set forth one or more embodiments of the present disclosure, other embodiments are also contemplated, as noted in the discussion. In all cases, this disclosure presents the invention by way of representation and not limitation. It should be understood that numerous other modifications and embodiments can be devised by those skilled in the art, which fall within the scope and spirit of the principles of the invention. The figures may not be drawn to scale, and applications and embodiments of the present invention may include features and components not specifically shown in the drawings.
A circuit card assembly (CCA) includes a plurality of printed circuit cards in a stacked configuration. A pair of conductive stand-offs is disposed between adjacent circuit cards and extend into through hole vias in the circuit cards such that each circuit card in the stack is electrically connected to the others. A power connector supplies external power to the stack and can be positioned on one of the first or last (terminal) circuit cards in the stack. The conductive stand-offs are robust and can accommodate higher amperage than other designs as well as mechanically support the CCA. Further, the design positions the power connections near the periphery of the circuit cards keeping power components separate from other card components.
Circuit cards 12-20 include respective circuit components 22, 24, 26, 28, and 30 (hereinafter components 22-30). Although represented schematically as being substantially similar, components 22-30 can either be uniform or differ from card to card and/or on the same card. Any of components 22-30 can be two or three dimensional and have various geometries. Components 22-30 can be connected to one another and/or elements of the power supply pathway with conductive trace or other conductive pathways. Components 22-30 can occupy a respective circuit card to various extents, for example, occupying greater than 50% of a circuit card's surface area.
Circuit cards 12-20 also include respective first vias 32, 34, 36, 38, and 40 (hereinafter first vias 32-40, or as sequential ordinal odd numbers first, third, etc.), and adjacent second vias 42, 44, 46, 48, and 50 (hereinafter second vias 42-50, or as sequential ordinal even numbers second, fourth, etc.). As shown, first vias 32-40 and second vias 42-50 are positioned near a periphery of their respective circuit card 12-20, and first vias 32-40 are generally vertically aligned with one another, as are second vias 42-50.
CCA 10 further includes conductive stand-offs positioned between adjacent circuit cards, all shown in an exploded configuration in
CCA 10 includes power connector 72 which, as shown in
A circuit card gap G2 is shown between inner surface 86 of circuit card 12 and outer surface 84 of circuit card 14. Gap G2 can be uniform throughout CCA 10 such that it is the same between neighboring circuit cards (e.g., 14 and 16, 18 and 20, etc.), or it can vary, depending, for example, on a need to provide suitable clearance for three dimensional components on a particular circuit card. The size of gap G2 will depend, in part, on the dimensions of the first and second stand-offs (e.g., 52 and 60). Gap G2 is additionally sized to prevent signal and/or electrical interference between components on adjacent circuit cards.
First stand-off 52 and second stand-off 60 each include a female end 90 and a male end 92. As shown in
Circuit cards 12-20 are electrically connected by conductive first stand-offs 52-58 and conductive second stand-offs 60-66 in communication with plated first vias 32-40 and plated second vias 42-50, respectively. In the embodiment of
The disclosed circuit card assembly has many advantages over existing designs. First, the design confines the via and stand-off pairs to a periphery of each circuit card and away from other circuit components (e.g., components 22-30) to minimize electrical interference. The conductive stand-offs are a larger gauge than individual pins of signal connectors, thus, they can be supplied with a higher current than individual or groups of pins without requiring power derating. Conductive stand-offs further provide rigid support to the circuit card assembly and provide adequate inter-card spacing to accommodate components and reduce electrical interference. The multi-purpose stand-offs obviate the need for separate structural and power bus componentry creating a smaller power supply footprint. This is advantageous over existing designs having distinct power connectors, as well as those supplying power through signal connectors. The disclosed assemblies can be used in various applications, including aviation and other transportation industries.
The following are non-exclusive descriptions of possible embodiments of the present invention.
A stacked circuit card assembly includes a power supply having a positive terminal and a negative terminal, a first circuit card having a first via electrically connected to the positive terminal and a second via electrically connected to the negative terminal, and a second circuit card having a third via aligned with the first via and a fourth via aligned with the second via. The assembly further includes a first conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card, and a second conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card. The first conductive stand-off provides a conductive pathway between the first via and the third via, and the second conductive stand-off provides a conductive pathway between the second via and the fourth via.
The assembly of the preceding paragraph can optionally include, additionally and/or alternatively, any one or more of the following features, configurations and/or additional components:
In the above assembly, the first conductive stand-off and second conductive stand-off each can each include a male end and a female end, and the male end of the first conductive stand-off can extend through the third via, and the male end of the second conductive stand-off can extend through the fourth via.
Any of the above assemblies can further include a first via gap separating and electrically isolating the first via from the second via, and a second via gap separating and electrically isolating the third via from the fourth via.
Any of the above assemblies can further include a first fastener extending through the first via of the first circuit card and threaded into the female end of the first conductive stand-off, and a second fastener extending through the second via of the first circuit card and threaded into the female end of the second conductive stand-off.
In any of the above assemblies, each of the first, second, third, and fourth vias are through-hole vias plated with a conductive material.
Any of the above assemblies can further include an electrical pathway within the first circuit card electrically connecting the power supply to each of the first and second through-hole vias.
In any of the above assemblies, the electrical pathway can include conductive trace.
In any of the above assemblies, the power supply can include a power connector connected to an external power source, or an external power source in direct contact with the conductive pathway.
Any of the above assemblies can further include a third circuit card having a fifth via aligned with the first and third vias, and a sixth via aligned with the second and fourth vias. The assembly can further include a third conductive stand-off disposed between the second circuit card and the third circuit card and structurally supporting the second circuit card with respect to the third circuit card, and a fourth conductive stand-off disposed between the second circuit card and the third circuit card and structurally supporting the second circuit card with respect to the third circuit card. The third conductive stand-off can provide a conductive pathway between the third via and the fifth via, and the fourth conductive stand-off can provide a conductive pathway between the fourth via and the sixth via.
In any of the above assemblies, the third conductive stand-off and fourth conductive stand-off can each include a male end and a female end, and the male end of the third conductive stand-off can extend through the fifth via, and the male end of the fourth conductive stand-off can extend through the sixth via.
Any of the above assemblies can further include a first nut threaded onto the male end of the third conductive stand-off, and a second nut threaded onto the male end of the fourth conductive stand-off.
In any of the above assemblies, the male end of the first conductive stand-off can be threaded into the female end of the third conductive stand-off, and the male end of the second conductive stand-off can be threaded into the female end of the fourth conductive stand-off.
In any of the above assemblies, the first, second, third, and fourth conductive stand-offs can be made of brass.
In any of the above assemblies, a geometry of the first, second, and third circuit cards can be uniform.
In any of the above assemblies, the geometry of the first, second, and third circuit cards can be one of a disc and a quadrilateral shape.
Any of the above assemblies can further include a first gap between a bottom surface of the first circuit card and a top surface of the second circuit card, and a second gap between the bottom surface of the second circuit card and a top surface of the third circuit card.
In any of the above assemblies, the first gap and the second gap can be uniform.
In any of the above assemblies, the first gap and the second gap can be different.
In any of the above assemblies, the first, third, and fifth vias can be configured as power contacts, and the second, fourth, and sixth vias can be configured as power return contacts.
Any of the above assemblies can further include a fourth circuit card and a fifth circuit card disposed between the first and third circuit cards.
While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment(s) disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
This invention was made with government support under Contract No. 2019-535 awarded by The United States Army. The government has certain rights in the invention.