The technology disclosed in this specification relates to a circuit device.
A structure in which an entire circuit board and a portion fixed to the circuit board through a connector are covered with a mold resin is known as a waterproof structure for a circuit device including a circuit board and a connector fixed to the circuit board (see Japanese Unexamined Patent Application Publication No. 2010-40992). The mold resin is formed by setting the circuit board in a forming mold, filling the mold with a melted resin, and curing the resin. The connector includes a connector housing having a partition wall and a cylindrical hood portion continuous from the partition wall and a terminal fitting having a tab portion disposed inside the hood portion so as to extend through the partition wall.
According to the above configuration, at the time of mold forming, the melted resin may enter the hood portion through the penetration portion of the tab portion.
A circuit device disclosed in this specification is a circuit device including a circuit board, a connector fixed to the circuit board, and a resin portion covering the circuit board and the connector. The connector includes a connector housing having a partition wall separating an internal space from an external space, and a terminal fitting extending through the partition wall, and the connector housing includes a surrounding wall portion disposed on a lateral surface of the partition wall and surrounding the terminal fitting, with a potting material being disposed inside the surrounding wall portion.
According to the above configuration, the portion of the partition wall through which the terminal fitting extends is separated from the resin portion with a potting material. This makes it possible to prevent the melted resin from entering the hood portion through the penetration portion of the terminal fitting on the partition wall when a resin portion is formed by mold forming.
In the above configuration, the resin portion may be formed from a hotmelt adhesive.
Using a hotmelt adhesive as a material for the resin portion makes it possible to mold the resin portion at a low pressure. Combining with sealing with a potting material can reliably prevent the melted resin from entering the hood portion through the penetration portion of the terminal fitting on the partition wall at the time of molding.
A circuit device disclosed in this specification can prevent a melted resin from entering a hood portion through the penetration portion of a terminal fitting on a partition wall when a resin portion is formed by mold forming.
An embodiment will be described with reference to
The circuit board 10 is a member having a known configuration, which has electrically conducting paths (not shown) formed by a printed wiring technique on one or both surfaces of an insulating plate made of an insulating material and on which electronic components (not shown) are mounted.
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Each of the two fixing fittings 31 is a member formed by pressing a metal plate and has an L shape as a whole, including a substantially rectangular main body portion 32 and a mounting portion 33 in the form of a plate piece extending vertically from one side of the main body portion 32, as shown in
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For example, the following is a procedure for manufacturing the ECU 1 having the above configuration.
First of all, the terminal fittings 41 and the fixing fittings 31 are fixed to the connector housing 21. The inside of the surrounding wall portion 27 is then filled with the liquid potting material 28. The potting material 28 is cured.
The connector 20 is then fixed to the circuit board 10 by reflow soldering. First of all, solder is applied to each soldering target region on one surface of the circuit board 10. Subsequently, the connector 20 is mounted on one surface of the circuit board 10 such that a portion of the hood portion 24 which is adjacent to the opening portion 26 protrudes from an end edge of the circuit board 10 by a predetermined dimension (see FIGS. 8 and 9). At this time, the board connecting portion 44 of each terminal fitting 41 is mounted on the solder, and the mounting portion 33 of each fixing fitting 31 is also mounted on the solder. The circuit board 10 on which the connector 20 is mounted is transported in a reflow furnace (not shown) to melt the solder. When the solder is cooled and solidified, the board connecting portion 44 of each terminal fitting 41 is fixed and rendered conductive to the corresponding electrically conducting path, and the mounting portion 33 of each fixing fitting 31 is fixed to the circuit board 10. This fixes the connector housing 21 to the circuit board 10.
The resin portion 50 is then formed by mold forming. The circuit board 10 to which the connector 20 is fixed is set in a mold (not shown), and the mold is filled with a melted resin. In this case, the potting material 28 disposed inside the surrounding wall portion 27 separates a portion around the portion of the terminal holding wall 22 through which each terminal fitting 41 extends from the melted resin injected in the hold. This prevents the melted resin from flowing into the hood portion 24 through the press fitting holes 23.
Subsequently, the filled resin is cooled and solidified. The ECU 1 is completed in this manner.
As described above, according to this embodiment, the ECU 1 includes the circuit board 10, the connector 20 fixed to the circuit board 10, and the resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes the connector housing 21 having the terminal holding wall 22 that separates the internal space from the external space, and the terminal fittings 41 extending through the terminal holding wall 22. The connector housing 21 includes the surrounding wall portion 27 that is disposed on the lateral surface of the terminal holding wall 22 and surrounds the terminal fittings 41. The potting material 28 is disposed inside the surrounding wall portion 27.
According to the above configuration, a portion around the portion of the terminal holding wall 22 through which each terminal fitting 41 extends is separated from the resin portion 50 by the potting material 28. This can prevent the melted resin from entering the hood portion 24 through the press fitting holes 23 at the time of formation of the resin portion 50 by mold forming.
The resin portion 50 is formed from a hotmelt adhesive. Using a hotmelt adhesive as a material for the resin portion 50 makes it possible to mold the resin portion 50 at a low pressure. Combining with sealing with the potting material 28 can reliably prevent the melted resin from entering the hood portion 24 through the press fitting holes 23 at the time of molding.
The technology disclosed in this specification is not limited to the embodiment described with reference to the above description and drawings, and includes, for example, the following aspects.
(1) Although the surrounding wall portion 27 is a cylindrical wall portion erected on the lateral surface of the terminal holding wall 22 in the above embodiment, the terminal holding wall may have a concave portion concaved from the lateral surface and the inner wall of the concave portion may be used as a surrounding wall portion.
(2) Although the terminal holding wall 22 has the press fitting holes 23 and the tab portions 42 of the terminal fittings 41 are press-fitted into the press fitting holes 23 in the above embodiment, the terminal fittings and the connector housing may be integrally formed by insert molding.
Number | Date | Country | Kind |
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2017-131185 | Jul 2017 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2018/024275 | 6/27/2018 | WO | 00 |