Patent Application
20240106404
This description relates generally to circuits for integrating currents from sensors.
Image sensors are used for the conversion of optical image information to electrical signals. Image sensors generate electrical currents according to an amount of light incident on the sensors. Image sensors are used in, for example, electronic imaging devices, medical imaging devices and thermal imaging devices.
Optical nanopore sensors are used in the detection and characterization of clinical biomarkers and for DNA/RNA sequencing. Optical nanopore sensors generally operate by detecting changes in the ionic current through a nanopore.
A sensor system may include hundreds or even thousands of individual sensors (e.g., sensor elements). The individual sensors may be arranged, for example, in a two-dimensional array. Each sensor is typically coupled to an electronic processing circuit via a conductor (e.g., signal trace, channel, wire). The electronic processing circuit converts the electrical current produced by the sensor into a voltage. The electronic processing circuit may include an amplifier which integrates the current and provides an output voltage representing the current. A drawback of many amplifiers is that noise signals (e.g., flicker noise signals or thermal noise signals) that may be present at an input of an amplifier may be amplified and produced at an output of the amplifier. Also, parasitic capacitances of the sensor and the signal trace increase the noise signals.
As noise signals increase, a signal-to-noise ratio (SNR) of an amplifier degrades. To reduce noise signals and increase the SNR, a precision amplifier may be used to convert an electrical current into a voltage. A precision amplifier typically has a large bandwidth, a high gain and a low noise and is typically implemented with multiple gain stages each having several transistors. Thus, a precision amplifier requires a relatively large area to implement in an integrated circuit or a semiconductor die and draws higher current. Because a sensor system may include several thousand sensors which are densely fabricated in an integrated circuit or a semiconductor die and the individual sensors may be coupled to respective precision amplifiers, a high-density sensor system can take a relatively large area in an integrated circuit or in a semiconductor die and can draw higher current which increases power consumption.
In one aspect, a circuit includes a plurality of circuit inputs. At least one of the plurality of circuit inputs is adapted to receive an input current. The circuit includes a first reference input adapted to receive a first reference voltage and includes a second reference input adapted to receive a second reference voltage. The circuit includes a plurality of first stage integrators. Each of the plurality of first stage integrators includes a first input, a second input, a third input and an output. The first input of each of the plurality of first stage integrators is coupled to a different one of the circuit inputs, the second input is coupled to the first reference input, the third input is coupled to the second reference input and the output of each of the plurality of first stage integrators is coupled to the first input of such first stage integrator by a first feedback path for such first stage integrator. The circuit includes a second stage integrator which includes a first input, a second input and an output. The first input of the second stage integrator is coupled to each of the first inputs of the plurality of first stage integrators, the second input of the second stage integrator is coupled to the first reference input, and the output of the second stage integrator is coupled to the first input of the second stage integrator by a second feedback path.
In an additional aspect, the circuit includes a plurality of transfer switches. Each of the plurality of transfer switches includes a first terminal and a second terminal. The first terminal of each of the plurality of transfer switches is coupled to a different one of the first inputs of the plurality of first stage integrators and the second terminal of each of the plurality of transfer switches is coupled to the first input of the second stage integrator.
In an additional aspect, the first feedback path of each of the plurality of first stage integrators includes a first switch which includes a first terminal coupled to the output of such first stage integrator and includes a second terminal. The first feedback path of each of the plurality of first stage integrators includes a first feedback capacitor which includes a first terminal coupled to the first input of such first stage integrator and a second terminal coupled to the second terminal of the first switch.
In an additional aspect, each of the plurality of first stage integrators further includes a second switch which includes a first terminal coupled to the second terminal of the first feedback capacitor of such first stage integrator and a second terminal adapted to receive the second reference voltage.
In an additional aspect, a circuit includes a circuit input adapted to receive an input current, a first reference input adapted to receive a first reference voltage and a second reference input adapted to receive a second reference voltage. The circuit includes a first stage integrator which includes a first input coupled to the circuit input, a second input coupled to the first reference input, a third input coupled to the second reference input and an output coupled to the first input of the first stage integrator by a first feedback path. The circuit includes a transfer switch which includes a first terminal coupled to the first input of the first stage integrator and includes a second terminal. The circuit includes a second stage integrator which includes a first input coupled to the second terminal of the transfer switch, a second input coupled to the first reference input, and an output coupled to the first input of the second stage integrator by a third feedback path.
In an additional aspect, a circuit includes a circuit input adapted to receive an input current, a first reference input adapted to receive a first reference voltage and a second reference input adapted to receive a second reference voltage. The circuit includes a first amplifier which includes a first input coupled to the circuit input, a second input coupled to the first reference input and includes an output. The circuit includes a first switch which includes a first terminal coupled to the output of the first amplifier and includes a second terminal. The circuit includes a first feedback capacitor which includes a first terminal coupled to the first input of the first amplifier and a second terminal coupled to the second terminal of the first switch. The circuit includes a second switch which includes a first terminal coupled to the second terminal of the first feedback capacitor and a second terminal coupled to the second reference input. The circuit includes a transfer switch which includes a first terminal coupled to the first input of the first amplifier and includes a second terminal. The circuit includes a second amplifier which includes a first input coupled to the second terminal of the transfer switch, a second input coupled to the first reference input and includes an output. The circuit includes a second feedback capacitor which includes a first terminal coupled to the first input of the second amplifier and a second terminal coupled to the output of the second amplifier.
The same reference numerals or other reference designators are used in the drawings to designate the same or similar (functionally and/or structurally) features.
When energy (e.g., light) is incident on sensors 104 (1,1)-104 (M,N), they generate electrical charge according to the amount of incident energy. In some example embodiments, sensors 104 (1,1)-104 (M,N) are coupled to respective first stage integrators 106 (1,1)-106 (M,N), which may be incorporated with the corresponding sensor (as shown in
System 100 includes second stage integrators 108 (1)-108 (N). Each second stage integrator may be coupled to a corresponding group (such as a column, as illustrated in
In some example embodiments, the output voltages provided by second stage integrators 108 (1)-108 (N) are multiplexed by multiplexer (MUX) 110, and the multiplexed output voltages are provided to analog-to-digital converter (ADC) 112. ADC 112 digitizes the output voltages and provides digital information (e.g., digital codes) representing the output voltages to circuitry (such as a processor, state machine, logic circuitry, memory and or a combination thereof) which may include software. Switching of MUX 110 may be controlled by a processor, logic circuitry and/or control circuitry that may be on the same integrated circuit as MUX 110 or may be external to the integrated circuit.
In some example embodiments, first stage integrators 106 (1,1)-106 (M,1) integrate charges over respective integration periods and output the resulting integrated charges to second stage integrator 108 (1) over respective transfer periods. The integration periods may be different, or they may overlap in time. The transfer periods may be different, or they may overlap in time. A transfer period may be time delayed from a corresponding integration period to allow adequate time for the integration of charges by a first stage integrator. As described below in more details, the number of transfer periods (may also be referred to as a “transfer phase”) may be any integer value (e.g., 2), and the number of integration periods (may also be referred to as an “integration phase”) may be any integer value (e.g., 2).
Circuit 300 includes first stage integrator 106 (1,1) coupled to sensor 104 (1,1) and includes first stage integrator 106 (2,1) coupled to sensor 104 (2,1). Circuit 300 includes second stage integrator 108 (1) coupled to first stage integrators 106 (1,1) and 106 (2,1). Circuit 300 includes first circuit input 304 adapted to be coupled to sensor 104 (1,1) and includes second circuit input 306 adapted to be coupled to sensor 104 (2,1).
Sensor 104 (1,1) is modeled by a current source IS1 and a parallel resistor RS1, where the current is generated by the charge collected by the energy incident to the sensor. The current source IS1 (e.g., between around a few nano-amperes to around a few pico-amperes) includes first terminal 310 coupled to first circuit input 304 and includes second terminal 312 coupled to common potential 314 (e.g., ground). Sensor resistor RS1 (e.g., between around 1M ohms to around 1G ohms) includes first terminal 316 coupled to first terminal 310 of IS1 and includes second terminal 318 coupled to common potential 314. Sensor 104 (1,1) is coupled to first circuit input 304 via signal trace T1 (e.g., conductor, wire, channel and/or circuit board trace). Parasitic capacitance CPAR_1 may be present between signal trace T1 and common potential 314. Parasitic capacitance CPAR_1 may represent the sum of a sensor parasitic capacitance, a signal trace parasitic capacitance, and any other parasitic capacitance.
Circuit 300 includes first reference input 320 which is adapted to receive first reference voltage VREF1 (e.g., around 0V to around 1V) and includes second reference input 322 which is adapted to receive second reference voltage VREF2 (e.g., around 0V to around 1.5V).
First stage integrator 106 (1,1) includes first operational amplifier A1 which includes first input 324 (e.g., inverting input), second input 326 (e.g., non-inverting input) and output 328. First input 324 of A1 is coupled to first circuit input 304 and second input 326 of A1 is coupled to first reference input 320.
First stage integrator 106 (1,1) includes switch S11 (also referred to as first switch) which includes first terminal 330 coupled to output 328 of first operational amplifier A1 and includes second terminal 332. Feedback capacitor C1 is coupled via switch Sui between output 328 of A1 and first input 324 of A1. Feedback capacitor C1 includes first terminal 334 coupled to first terminal 324 of A1 and includes second terminal 336 coupled to second terminal 332 of switch S11.
First stage integrator 106 (1,1) includes switch S12 (also referred to as second switch) which includes first terminal 340 coupled to second terminal 336 of feedback capacitor C1 and includes second terminal 342 coupled to second reference input 322 which is adapted to receive second reference voltage VREF2. First stage integrator 106 (1,1) includes transfer switch ST1 which includes first terminal 344 coupled to first input 324 of first operational amplifier A1 and includes second terminal 346.
The model of sensor 104 (2,1) includes current source IS2 which includes first terminal 350 and includes second terminal 352 coupled to common potential 314. In addition, the model of sensor 104 (2,1) includes sensor resistor RS2 (e.g., between around 1M ohms to around 1G ohms) which includes first terminal 354 coupled to first terminal 350 of IS2 and includes second terminal 356 coupled to common potential 314. Sensor 104 (2,1) is coupled to second circuit input 306 via signal trace T2 (e.g., conductor, wire, channel and/or printed circuit board trace). Parasitic capacitance CPAR_2 may be present between signal trace T2 and common potential 314. Parasitic capacitance CPAR_2 may represent the sum of a sensor parasitic capacitance, a signal trace parasitic capacitance and any other parasitic capacitance.
First stage integrator 106 (2,1) includes second operational amplifier A2 which includes first input 360 (e.g., inverting input) coupled to second circuit input 306, second input 362 (e.g., non-inverting input) coupled to third reference input 364 and includes output 366. Third reference input 364 is adapted to receive first reference voltage VREF1. First stage integrator 106 (2,1) includes switch S21 (also referred to as third switch) which includes first terminal 368 coupled to output 366 of second operational amplifier A2 and includes second terminal 370. Feedback capacitor C2 is coupled between output 366 of A2 and first input 360 of A2. Feedback capacitor C2 includes first terminal 372 coupled to first terminal 360 of A2 and includes second terminal 374 coupled to second terminal 370 of switch S21.
First stage integrator 106 (2,1) includes switch S22 (also referred to as fourth switch) which includes first terminal 376 coupled to second terminal 374 of feedback capacitor C2 and includes second terminal 378 coupled to second reference input 380 which is adapted to receive second reference voltage VREF2. First stage integrator 106 (2,1) includes transfer switch ST2 which includes first terminal 382 coupled to first input 360 of second operational amplifier A2 and includes second terminal 384.
Circuit 300 includes second stage integrator 108 (1) which includes third operational amplifier A3 coupled to first and second operational amplifiers A1 and A2 via first and second transfer switches ST1 and ST2, respectively. Third operational amplifier A3 includes first input 386 (e.g., inverting input) coupled to second terminals 346 and 384 of respective transfer switches ST1 and ST2. Third operational amplifier A3 includes second input 388 (e.g., non-inverting input) coupled to fifth reference input 390 which is adapted to receive first reference voltage VREF1. Third operational amplifier A3 includes output 392, which may be coupled to ADC 112 via multiplexer 110. Feedback capacitor C3 is coupled between output 392 of A3 and first input 386 of A3. Feedback capacitor C3 includes first terminal 393 coupled to first input 386 of A3 and includes second terminal 394 coupled to output 392 of A3. Second stage integrator 108 (1) includes reset switch SRST coupled between first and second terminals 393 and 394 of C3.
In some example embodiments, circuit 300 includes timing control circuit CTRL (e.g., a processor, logic circuitry, memory, state machine and/or software) configured to provide timing signals to switches S11, S12, ST1, S21, S22 and ST2. Timing control circuit CTRL may include a clock (not shown in
In some example embodiments, circuit 300 is operated in two phases: (1) an integration phase; and (2) a transfer phase. In an integration phase, input current from a sensor (e.g., sensor 104 (1,1)) is received by its corresponding first stage integrator (e.g., first stage integrator 106 (1,1)) and sensor charges that form the input current are integrated over an integration period. In a transfer phase, the first stage integrator (e.g., first stage integrator 106 (1,1)) transfers the resulting integrated charges to a second stage integrator (e.g., second stage integrator 108 (1)) over a transfer period. The second stage integrator (e.g., second stage integrator 108 (1)) provides an output voltage representing the transferred charges.
Similarly, in an integration phase, input current from sensor 104 (2,1) is received by first stage integrator 106 (2,1) which integrates charges that form the input current over an integration period. In a transfer phase, first stage integrator 106 (2,1) transfers the resulting integrated charges to second stage integrator 108 (1) over a transfer period. Second stage integrator 108 (1) provides an output voltage representing the transferred charges.
During the first integration phase, first timing signal ø1 is asserted LOW (e.g., a logic “0”, a low voltage, such as around ground). In response, switch S11 is closed (e.g., conducting) but switches S12 and ST1 are opened (e.g., non-conducting). Thus, output 328 of first operational amplifier A1 is coupled to first input 324 of A1 via feedback capacitor C1, thereby forming a feedback path. Due to the feedback path, first input 324 of A1 is held at a virtual ground with respect to second input 326 of A1. Input current IS1 from sensor 104 (1,1) flows into feedback capacitor C1, and charges of IS1 are integrated into feedback capacitor C1 over a first integration period. Because switch ST1 remains open during the first integration phase, first stage integrator 106 (1,1) is disconnected from second stage integrator 108 (1).
Similarly, during a second integration phase, second timing ø2 is asserted LOW. In response, switch S21 is closed but switches S22 and ST2 are opened. Thus, output 366 of second operational amplifier A2 is coupled to first input 360 of A2 via feedback capacitor C2, thus forming a feedback path. Due to the feedback path, first input 360 of A2 is held at a virtual ground with respect to second input 362 of A2. Input current IS2 from sensor 104 (2,1) flows into feedback capacitor C2, and charges of IS2 are integrated into feedback capacitor C2 over a second integration period. Because switch ST2 remains open during the second integration phase, first stage integrator 106 (2,1) is disconnected from second stage integrator 108 (1).
In some example embodiments, first and second integration periods may be different in duration and/or starting time. In other example embodiments, first and second integration periods may overlap (at least partially) in time.
Similarly, during the second transfer phase, second timing signal ø2 is asserted HIGH. In response, switch S21 is opened but switches S22 and ST2 are closed. Because S21 is opened, output 366 of second operational amplifier A2 is disconnected from first input 360 of A2, thus disconnecting the feedback path. Also, because S22 and ST2 are both closed, feedback capacitor C2 is coupled to second reference voltage VREF2 and first input 360 of A2 is coupled to first input 386 of third operational amplifier A3. Thus, charges integrated into feedback capacitor C2 are transferred to feedback capacitor C3 over a second transfer period.
During the first transfer period, the feedback path formed by feedback capacitor C1 is disconnected. Thus, during the first transfer period a virtual ground does not exist at first input 324 of first operational amplifier A1 with respect to second input 326 of A1, and output voltage VO1 is no longer capacitively coupled to first input 324 of A1. Thus, any noise that may be present at second input 326 of A1 is not present at first input 324 of A1 due to the absence of a virtual ground, and any noise that may be present at output 328 of A1 is not capacitively coupled to first input 324 of A1. Thus, during the first transfer phase any noise from first input 324 of A1 or any noise from output 328 of A1 are not transferred to third operational amplifier A3. Similarly, during the second transfer phase any noise from first input 360 of A2 or any noise from output 366 of A2 are not transferred to third operational amplifier A3.
In some example embodiments, first and second transfer periods may be different in duration and/or starting time. In other example embodiments, first and second transfer periods may overlap (at least partially) in time.
During the integration phase, first stage integrator 106 (1,1) temporarily stores charges from input current IS1 and during the transfer phase, first stage integrator 106 (1,1) transfers the charges to second stage integrator 108 (1). Also, during the transfer phase, first stage integrator 106 (1,1) transfers charges from parasitic capacitor CPAR_1 to second stage integrator 108 (1). However, first stage integrator 106 (1,1) does not transfer output voltage VO1 to second stage integrator 108 (1). Thus, any noise that may be present at output 328 of A1 (e.g., noise signals in output voltage V01) is not transferred to second stage integrator 108 (1) and does not degrade the performance of second stage integrator 108 (1). Thus, first operational amplifier A1 may be implemented as a low-gain, low-bandwidth amplifier which requires fewer gain stages and fewer transistors than required by a high-gain, large-bandwidth amplifier. Similarly, first stage integrator 106 (2,1) may be implemented as a low-gain, low-bandwidth amplifier. Thus, the disclosed embodiments allow implementing A1 and A2 as low-gain, low-bandwidth amplifiers, yet not lessening the precision of data acquisition. There are several benefits of using low-gain, low-bandwidth amplifiers instead of using high-gain, large-bandwidth amplifiers. A low-gain, low-bandwidth amplifier consumes considerably less power than a high-gain, large-bandwidth amplifier due to its relaxed noise specifications. Also, because a low-gain, low-bandwidth amplifier has fewer number of transistors, it is less expensive and requires less area to implement in an integrated circuit or a semiconductor die. If a system requires a very large number (e.g., 10K or 100K) of sensors or pixels, thus increasing the number of first stage integrators, these advantages may become considerable.
In some example embodiment, third operational amplifier A3 may be implemented as a high-gain, large-bandwidth amplifier which has a low noise (also referred to as a precision amplifier). Because A3 provides output voltage VOF responsive to charges transferred from A1 and A2, any noise generated by A3 may also be transferred to output voltage VOF. Thus, it is beneficial to implement A3 as a high-gain, large-bandwidth amplifier which has a low noise.
To ensure that output voltage VOF of A3 is a measure of charges transferred by first stage integrators (e.g., 106 (1,1) and 106 (2,1) of
In some example embodiments, after a predetermined duration that is necessary for charges to be transferred from first operational amplifier A1 to third operational amplifier A3 or from second operational amplifier A2 to A3 and for output voltage VOF to settle, output voltage VOF may be sampled and digitized by an analog-to-digital converter (not illustrated in
In some example embodiments, charges from sensors 104 (1,1)-104 (M,N) may be transferred sequentially in a frame. Thus, for example, charges may be transferred sequentially from the sensors of column number 1, beginning with sensor 104 (1,1). After charges from the last sensor of column number 1 (e.g., sensor 104 (M,1) is transferred, the next frame (e.g., column number 2) may be initiated and the process is repeated.
In some example embodiments, sensors 104 (1,1)-104 (M,N), first stage integrators 106 (1,1)-106 (M,N) and second stage integrators 108 (1)-108 (N) may be implemented in an integrated circuit or a semiconductor die. In some example embodiments, first stage integrators 106 (1,1)-106 (M,N) and second stage integrators 108 (1)-108(N) may be implemented in an integrated circuit which may be coupled to sensors 104 (1,1)-104 (M,N) via an external connection, signal trace, wire, or a conductor. Other variations are possible within the scope of the disclosure.
At time T1, ø1 is asserted HIGH. Thus, switch S11 is opened and switches S21 and ST1 are closed. As such, C1 is coupled to second reference voltage VREF2, and first input 324 of first operational amplifier A1 is coupled to first input 386 of third operational amplifier A3. Thus, at time T1, charges from C1 are transferred to C3 and output VOF begins to drop. At time T2, VOF settles and it is sampled (indicated by reference numeral 428) and digitized by an ADC.
At time T3, transfer of charges from C1 to C3 is completed, ø1 is asserted LOW and ø3 is asserted HIGH. Thus, C3 is reset to VR and switch S11 is closed. As such, output voltage VOF rises back to VR.
At time T4, 2 is asserted HIGH. Thus, switches S22 and ST2 are closed but switch S21 is opened. Thus, at time T4 transfer of charges from C2 to C3 starts. At time T5, output VOF settles and the ADC samples and digitizes VOF. At time T6, transfer of charges from C2 to C3 is completed and ø2 is asserted LOW. Thus, VOF rises back to VR.
The circuits described herein may include one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors and/or inductors), and/or one or more sources (such as voltage and/or current sources). The circuits may include only semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, such as by an end-user and/or a third party. While some example embodiments may include certain elements implemented in an integrated circuit and other elements are external to the integrated circuit, in other example embodiments, additional or fewer features may be incorporated into the integrated circuit. In addition, some or all the features illustrated as being external to the integrated circuit may be included in the integrated circuit and/or some features illustrated as being internal to the integrated circuit may be incorporated outside of the integrated. As used herein, the term “integrated circuit” means one or more circuits that are: (i) incorporated in/over a semiconductor substrate; (ii) incorporated in a single semiconductor package; (iii) incorporated into the same module; and/or (iv) incorporated in/on the same printed circuit board.
In this description, the term “couple” may cover connections, communications, or signal paths that enable a functional relationship consistent with this description. For example, if device A provides a signal to control device B to perform an action, then: (a) in a first example, device A is coupled to device B; or (b) in a second example, device A is coupled to device B through intervening component C if intervening component C does not substantially alter the functional relationship between device A and device B, such that device B is controlled by device A via the control signal provided by device A. Also, in this description, a device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or reconfigurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof. Furthermore, in this description, a circuit or device that includes certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, such as by an end-user and/or a third party.
As used herein, the terms “terminal”, “node”, “interconnection” and “pin” are used interchangeably. Unless specifically stated to the contrary, these terms are generally used to mean an interconnection between or a terminus of a device element, a circuit element, an integrated circuit, device or other electronics or semiconductor component.
While some example embodiments suggest that certain elements are included in an integrated circuit while other elements are external to the integrated circuit, in other example embodiments, additional or fewer features may be incorporated into the integrated circuit. In addition, some or all of the features illustrated as being external to the integrated circuit may be included in the integrated circuit and/or some features illustrated as being internal to the integrated circuit may be incorporated outside of the integrated. As used herein, the term “integrated circuit” means one or more circuits that are: (i) incorporated in/over a semiconductor substrate; (ii) incorporated in a single semiconductor package; (iii) incorporated into the same module; and/or (iv) incorporated in/on the same printed circuit board.
While the use of particular transistors are described herein, other transistors (or equivalent devices) may be used instead with little or no change to the remaining circuitry. For example, a metal-oxide-silicon FET (“MOSFET”) (such as an n-channel MOSFET, nMOSFET, or a p-channel MOSFET, pMOSFET), a bipolar junction transistor (BJT—e.g., NPN or PNP), insulated gate bipolar transistors (IGBTs), and/or junction field effect transistor (JFET) may be used in place of or in conjunction with the devices disclosed herein. The transistors may be depletion mode devices, drain-extended devices, enhancement mode devices, natural transistors or other type of device structure transistors. Furthermore, the devices may be implemented in/over a silicon substrate (Si), a silicon carbide substrate (SiC), a gallium nitride substrate (GaN) or a gallium arsenide substrate (GaAs).
While certain elements of the described examples are included in an integrated circuit and other elements are external to the integrated circuit, in other example embodiments, additional or fewer features may be incorporated into the integrated circuit. In addition, some or all of the features illustrated as being external to the integrated circuit may be included in the integrated circuit and/or some features illustrated as being internal to the integrated circuit may be incorporated outside of the integrated. As used herein, the term “integrated circuit” means one or more circuits that are: (i) incorporated in/over a semiconductor substrate; (ii) incorporated in a single semiconductor package; (iii) incorporated into the same module; and/or (iv) incorporated in/on the same printed circuit board.
While certain components may be described herein as being of a particular process technology, these components may be exchanged for components of other process technologies. Circuits described herein are reconfigurable to include the replaced components to provide functionality at least partially similar to functionality available before the component replacement. Components shown as resistors, unless otherwise stated, are generally representative of any one or more elements coupled in series and/or parallel to provide an amount of impedance represented by the shown resistor. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in series or in parallel between the same two nodes as the single resistor or capacitor. Also, uses of the phrase “ground terminal” in this description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. Unless otherwise stated, “about”, “approximately”, or “substantially” preceding a value means +/−10 percent of the stated value, or, if the value is zero, a reasonable range of values around zero.
