Patent Application
20100295653
1. Technical Field
This disclosure generally relates to thermal fuses, relays, and other electrical components (collectively referred to herein as “circuit” or “electronic” implements) adapted for use in and modifying at least one characteristic of a circuit; and more particularly, to a circuit implement that utilizes shape memory material actuation to effect functionality.
2. Background Art
Fuses, relays, and variable resistors, as well as other components have long been implemented in electronics to improve the safety and capabilities of circuits. For example, thermal fuses are often used to protect vital or expensive components, people, and environments from current and thermal overloading; and relays are often used to enable a low-energy input device such as the ignition in a vehicle to actuate a high-energy device such as a starter motor.
With respect to fuses, it is appreciated that traditional fuses offer permanent interruptions to devices that may otherwise require only temporary protection. Moreover, these fuses are increasingly difficult to replace as devices become increasingly complex and congested. As a result, manually and autonomously resettable fuses have been developed, including, for example, polymeric positive temperature coefficient (PTC) These fuses re-orient the polymer chains from crystalline to amorphous, reducing current flow to a nearly “open state,” when subjected to excessive current. Concernedly, however, PTC fuses never actually open the circuit, and because they create resistance on a molecular level, their reset functionality may be difficult to control.
With respect to relays and variable resistors, a simple, inexpensive, and reliable construction is often desirous and/or beneficial. However, most relays known in the art are electromechanical, and often constructed with a complex metal coil and armature that is susceptible to getting stuck after repetitive use. In addition, the application and removal of the induction current to the coil often requires the use of additional electrical components to dissipate unwanted or damaging energy influx. Other relays known in the art eliminate the need for electromechanical devices, but incorporate numerous electrical components, increasing cost. They are also prone to false firing and shorting out.
In response to the afore-mentioned concerns, the invention presents a shape memory material based thermal implement. As such, the invention is useful for completely opening or otherwise modifying a circuit and enabling precise control of the reset functionality. Thus, the invention more accurately protects the circuit and its environment without reducing circuit functionality, and simultaneously reduces or eliminates fuse replacement costs. The invention may also be used in low-temperature applications for which current thermal fuse technology is not suitable. The invention can be adapted for applications that require different current, voltage, or temperature rating simply by varying the composition, diameter, or length of the shape memory material, or by altering the operating stress.
Generally, the invention concerns an implement adapted to protect or modify a circuit, and including an active material element. The element is formed of a shape memory material operable to undergo a reversible change when exposed to an activation signal. The implement is configured such that the change is operable to move a first contact relative to a second such that the motion opens, closes or varies the output of at least a portion of the circuit. For example, in one embodiment, the invention uses the shape memory properties of shape memory alloy (SMA) or other shape memory material to create a relay or variable resistor that eliminates the need for electromagnetic control electronics.
Other aspects and advantages of the present invention will be apparent from the following detailed description of the preferred embodiment(s) and the accompanying drawing figures.
A preferred embodiment of the invention is described in detail below with references to the attached drawing figures, wherein:
a is a schematic of a circuit utilizing a resettable fuse wherein the fuse is connected in line with a power source and load, so as to protect the circuit from electrical and thermal damage, in accordance with a preferred embodiment of the invention;
b is a schematic of a circuit incorporating the use of a relay wherein the relay is connected in line with a power source and load, such that an activation signal opens or closes the circuit encompassing the load, in accordance with a preferred embodiment of the invention;
c is a schematic of a circuit incorporating the use of a variable output resistor wherein the resistor is connected in line with a power source and load, such that an activation signal varies the resistance in the circuit, in accordance with a preferred embodiment of the invention;
a is an elevation of a resettable fuse in a closed contact position, wherein a shape memory element is in an initial geometry, current is able to pass through the fuse, and a return spring is unloaded, in accordance with a preferred embodiment of the invention;
b is an elevation of the resettable fuse shown in
a is an elevation of a relay utilizing a shape memory element wherein the shape memory element is depicted in a non-activated geometry, such that the relative positions of the contacts causes the circuit to be open, and upon receiving an activation signal, the shape memory element closes the circuit along the dotted line, in accordance with a preferred embodiment of the invention; and
b is an elevation of a variable output resistor including a shape memory element drivenly coupled to a sliding contact, the element can slide the contact, in accordance with a preferred embodiment of the invention.
The following description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. The present invention may find utility in a wide range of applications; including, for example, in protection of circuits and electrical components (
In general, the invention concerns a shape memory element configured to move a contact in relation to another contact so as to open, close, or otherwise vary at least one characteristic of a circuit. The element employs active material actuation to facilitate application and/or improve function.
Suitable active materials for use with the present invention include but are not limited to shape memory alloys, ferromagnetic shape memory alloys, and other active materials, such as electroactive polymers (EAP), that can function as actuators under fibrous configurations and atmospheric conditions. These types of active materials have the ability to remember their original shape and/or elastic modulus, which can subsequently be recalled by applying an external stimulus. As such, deformation from the original shape is a temporary condition. In this manner, an element composed of these materials can change to the trained shape in response to either the application or removal (depending on the material and the form in which it is used) of an activation signal. Other active materials compatible with the present invention include shape memory polymer, piezoelectric composites, magnetorheological elastomers, and electrorheological elastomers.
More particularly, shape memory alloys (SMA's) generally refer to a group of metallic materials that demonstrate the ability to return to some previously defined shape or size when subjected to an appropriate thermal stimulus. Shape memory alloys are capable of undergoing phase transitions in which their yield strength, stiffness, dimension and/or shape are altered as a function of temperature. The term “yield strength” refers to the stress at which a material exhibits a specified deviation from proportionality of stress and strain. Generally, in the low temperature, or martensite phase, shape memory alloys can be pseudo-plastically deformed and upon exposure to some higher temperature will transform to an austenite phase, or parent phase, returning to their shape prior to the deformation. Materials that exhibit this shape memory effect only upon heating are referred to as having one-way shape memory. Those materials that also exhibit shape memory upon re-cooling are referred to as having two-way shape memory behavior.
Shape memory alloys exist in several different temperature-dependent phases. The most commonly utilized of these phases are the so-called Martensite and Austenite phases discussed above. In the following discussion, the martensite phase generally refers to the more deformable, lower temperature phase whereas the austenite phase generally refers to the more rigid, higher temperature phase. When the shape memory alloy is in the martensite phase and is heated, it begins to change into the austenite phase. The temperature at which this phenomenon starts is often referred to as austenite start temperature (As). The temperature at which this phenomenon is complete is called the austenite finish temperature (Af).
When the shape memory alloy is in the austenite phase and is cooled, it begins to change into the martensite phase, and the temperature at which this phenomenon starts is referred to as the martensite start temperature (MS). The temperature at which austenite finishes transforming to martensite is called the martensite finish temperature (Mf).
Shape memory alloys can exhibit a one-way shape memory effect, an intrinsic two-way effect, or an extrinsic two-way shape memory effect depending on the alloy composition and processing history. Annealed shape memory alloys typically only exhibit the one-way shape memory effect. Sufficient heating subsequent to low-temperature deformation of the shape memory material will induce the martensite to austenite type transition, and the material will recover the original, annealed shape. Hence, one-way shape memory effects are only observed upon heating. Active materials comprising shape memory alloy compositions that exhibit one-way memory effects do not automatically reform, and will likely require an external mechanical force to reform the shape.
Intrinsic and extrinsic two-way shape memory materials are characterized by a shape transition both upon heating from the martensite phase to the austenite phase, as well as an additional shape transition upon cooling from the austenite phase back to the martensite phase. Active materials that exhibit an intrinsic shape memory effect are fabricated from a shape memory alloy composition that will cause the active materials to automatically reform themselves as a result of the above noted phase transformations. Intrinsic two-way shape memory behavior must be induced in the shape memory material through processing. Such procedures include extreme deformation of the material while in the martensite phase, heating-cooling under constraint or load, or surface modification such as laser annealing, polishing, or shot-peening. Once the material has been trained to exhibit the two-way shape memory effect, the shape change between the low and high temperature states is generally reversible and persists through a high number of thermal cycles. In contrast, active materials that exhibit the extrinsic two-way shape memory effects are composite or multi-component materials that combine a shape memory alloy composition that exhibits a one-way effect with another element that provides a restoring force to reform the original shape.
The temperature at which the shape memory alloy remembers its high temperature form when heated can be adjusted by slight changes in the composition of the alloy and through heat treatment. In nickel-titanium shape memory alloys, for instance, it can be changed from above about 100° C. to below about −100° C. The shape recovery process occurs over a range of just a few degrees and the start or finish of the transformation can be controlled to within a degree or two depending on the desired application and alloy composition. The mechanical properties of the shape memory alloy vary greatly over the temperature range spanning their transformation, typically providing the system with shape memory effects, superelastic effects, and high damping capacity.
Suitable shape memory alloy materials include, without limitation, nickel-titanium based alloys, indium-titanium based alloys, nickel-aluminum based alloys, nickel-gallium based alloys, copper based alloys (e.g., copper-zinc alloys, copper-aluminum alloys, copper-gold, and copper-tin alloys), gold-cadmium based alloys, silver-cadmium based alloys, indium-cadmium based alloys, manganese-copper based alloys, iron-platinum based alloys, iron-platinum based alloys, iron-palladium based alloys, and the like. The alloys can be binary, ternary, or any higher order so long as the alloy composition exhibits a shape memory effect, e.g., change in shape orientation, damping capacity, and the like.
It is appreciated that thermally induced SMA phase changes are one-way so that a biasing force return mechanism (such as a spring) would be required to return the SMA to its starting configuration once the applied field is removed. Joule heating can be used to make the entire system electronically controllable.
It is appreciated that most nickel titanium based alloys transform over a relatively small temperature range. As the stress increases, so does the transformation temperature for many alloys. In order to increase the temperature sensitivity operational range, it may be desirable to influence the transformation temperature during the transformation, by preferably countering the transformation with a tuned spring load. As the alloy begins to transform, it would extend the spring, increasing the load and subsequent stress on the alloy. This different stress would cause the alloy to take on different transformation temperatures, thus causing the alloy to respond to a wider range of temperature fluctuations.
As previously mentioned, electroactive polymers may be used in lieu of SMA. This type of active material includes those polymeric materials that exhibit piezoelectric, pyroelectric, or electrostrictive properties in response to electrical or mechanical fields. An example is an electrostrictive-grafted elastomer with a piezoelectric poly(vinylidene fluoride-trifluoro-ethylene) copolymer. This combination has the ability to produce a varied amount of ferroelectric-electrostrictive, molecular composite systems. These may be operated as a piezoelectric sensor or even an electrostrictive actuator.
Materials suitable for use as an electroactive polymer may include any substantially insulating polymer or rubber (or combination thereof) that deforms in response to an electrostatic force or whose deformation results in a change in electric field. Exemplary materials suitable for use as a pre-strained polymer include silicone elastomers, acrylic elastomers, polyurethanes, thermoplastic elastomers, copolymers comprising PVDF, pressure-sensitive adhesives, fluoroelastomers, polymers comprising silicone and acrylic moieties, and the like. Polymers comprising silicone and acrylic moieties may include copolymers comprising silicone and acrylic moieties, polymer blends comprising a silicone elastomer and an acrylic elastomer, for example.
Turning to
As shown in the illustrated embodiments, each implement comprises a shape memory element 20 configured to modify (e.g., toggle, vary, etc.) the implement between a plurality of achievable configurations (e.g., positions, conditions, etc.). In
In a preferred embodiment, the shape memory element 20 is composed of an SMA wire, wherein the term “wire” is used in a non-limiting sense and incorporates other geometric forms, such as cables, braids, bundles, strips, etc. In this configuration, the signal 26 is a thermal activation signal that may be generated directly through Joule heating designed to be reached when the current being carried by the circuit 19 exceeds a threshold amperage, or indirectly by an external source (e.g., a vehicle engine, cooling system, etc.) 30 (
In
In
In the variable-output embodiment, the shape memory alloy is preferably connected through a crimp, solder, or bolt (not shown) to the end of a linear spring loaded potentiometer (also not shown). If a rotary potentiometer is used, a straight piece of toothed plastic, or other non-conductive material, can be attached to the alloy and a mating rotary gear attached to the shaft of the rotary potentiometer such that when the alloy actuates, the gear is turned, causing the sliding contact in the potentiometer to rotate, resulting in a change of current going to a load in the circuit, in a preferred embodiment. The shape memory alloy preferably has a spring return or switch to reset after an event.
This invention has been described with reference to exemplary embodiments; it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to a particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
The terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. The suffix “(s)” as used herein is intended to include both the singular and the plural of the term that it modifies, thereby including one or more of that term. Reference throughout the specification to “one embodiment”, “another embodiment”, “an embodiment”, and so forth, means that a particular element (e.g., feature, structure, and/or characteristic) described in connection with the embodiment is included in at least one embodiment described herein, and may or may not be present in other embodiments. In addition, it is to be understood that the described elements may be combined in any suitable manner in the various embodiments.
