Patent Application
20210407990
Aspects of the present disclosure relate generally to electrostatic discharge (ESD) protection, and more particularly, to on-chip ESD protection circuits.
Electronic components on a chip are susceptible to damage from an electrostatic discharge (ESD) event. For example, an ESD event may damage or destroy the gate oxide, metallization, and/or PN junction of an electronic component on the chip. Damage caused by ESD events may reduce manufacturing yields and/or lead to operational failures of electronic components. Accordingly, a chip typically includes one or more ESD protection circuits to protect electronic components on the chip against ESD events.
The following presents a simplified summary of one or more implementations in order to provide a basic understanding of such implementations. This summary is not an extensive overview of all contemplated implementations and is intended to neither identify key or critical elements of all implementations nor delineate the scope of any or all implementations. Its sole purpose is to present some concepts of one or more implementations in a simplified form as a prelude to the more detailed description that is presented later.
A first aspect relates to a chip. The chip includes a pad and a driver having an output coupled to the pad. The chip also includes one or more diodes coupled between the pad and a ground bus, wherein the one or more diodes are in a forward direction from the pad to the ground bus.
A second aspect relates to a method of electrostatic discharge (ESD) protection for a driver having an output coupled to a pad. The method includes, during an ESD event, turning on one or more diodes coupled between the pad and a ground bus, wherein the one or more diodes are in a forward direction from the pad to the ground bus.
A third aspect relates to a method of programming electrostatic discharge (ESD) protection on a chip. The chip includes diodes. The method includes determining a number of the diodes to be used for ESD protection, and programming metal routing on the chip to couple one or more of the diodes between a pad and a ground bus based on the determined number of diodes.
The detailed description set forth below, in connection with the appended drawings, is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of the various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts.
A chip typically includes one or more ESD protection circuits to protect electronic components on the chip against ESD events. An ESD event may occur, for example, when a charged object makes contact with an input/output (I/O) pad of the chip (e.g., during handling of the chip). An ESD event may also occur, for example, when the chip acquires charge and then discharges to an object making contact with an I/O pad of the chip. An ESD protection circuit may include one or more clamp devices, one or more diodes, or a combination thereof.
A chip may undergo one or more ESD qualification tests based on a human body model (HBM) and/or a charged device model (CDM) to evaluate the ESD robustness of the chip. During an HBM test, a capacitor (e.g., 100 pF capacitor) is charged to a high voltage (e.g., one or more kilovolts). Once the capacitor is fully charged, the capacitor is coupled to an I/O pad of the chip through a series resistor to simulate an ESD event caused by the transfer of charge from a human to the chip. In this example, the chip fails the HBM test if one or more electronic components on the chip suffers an ESD failure.
During a CDM test, the chip is positively or negatively charged. The chip is then discharged through a grounded pin that makes contact with an I/O pad of the chip. In this example, the chip fails the CDM test if one or more electronic components on the chip suffers an ESD failure.
Integrated circuit (IC) chips in advanced technology nodes may be required to pass ESD qualification tests (e.g., HBM+/−1 kV and CDM+/−250V). As technology continues to scale down and data rates continue to increase, CDM ESD has become a major challenge for high speed I/O pads (i.e., interface pins), especially for FinFet process nodes. To achieve high data speeds and low power, thin oxide transistors are being used in interface circuits (e.g. drivers). The ESD failure voltage of thin oxide transistors has been going down with advances in technology, making these transistors more vulnerable to ESD.
The ESD protection circuit includes a first diode 116 coupled between the I/O pad 110 and a VDD bus 112, and a second diode 118 coupled between the I/O pad 110 and a VSS bus 114. As discussed further below, the first diode 116 provides a current path from the I/O pad 110 to the VDD bus 112 during a negative CDM ESD event, and the second diode 118 provides a current path from the VSS bus 114 to the I/O pad 110 during a positive CDM ESD event. The diodes 116 and 118 may also provide current paths for other types of ESD events.
The ESD protection circuit also includes one or more clamp devices 120 coupled between the VDD bus 112 and the VSS bus 114. The clamp device 120 may include a clamp transistor and a trigger device (e.g., resistor-capacitor (RC) trigger device), in which the trigger device is configured to turn on the clamp transistor during an ESD event.
The ESD protection circuit can provide the chip 100 with ESD protection during handling and packaging before the VDD bus 112 is coupled to a power source via the VDD pad 162, the VSS bus 114 is coupled to a ground via the VSS pad 164, and/or the I/O pad 110 is coupled to a transmission line. The ESD protection circuit can also provide the chip 100 with ESD protection after packaging.
During an ESD event, the ESD protection circuit needs to clamp the I/O pad voltage (“Vpad”) to a safe voltage level to prevent damage to transistors (e.g., transistors and 132 and 134) coupled to the I/O pad 110. This is becoming more challenging as thin oxide transistors are being used to achieve higher data speeds. The ESD failure voltage of these thin oxide transistors has been going down with advances in technology, making these transistors more vulnerable to ESD. For example, in current advanced technology nodes, the ESD failure voltage of thin oxide transistors may be approximately 3V for 1 ns transmission line pulse (TLP) widths, which is commonly used to represent the pulse width of CDM ESD discharge current waveform. Thus, the ESD protection circuit needs to clamp the pad voltage Vpad to lower voltage levels during ESD events to prevent damaging these transistors.
In this example, the pad voltage Vpad includes the turn-on offset voltage of the diode 116 and the turn-on offset voltage of the clamp device 120. The pad voltage Vpad also includes the IR voltage drop across the resistance of the diode 116, the resistance of the VDD bus 112, the resistance of the clamp device 120, and the resistance of the VSS bus 114. In
As shown in
During the negative CDM ESD event, the pad voltage Vpad is seen by the driver transistor 134 (e.g., NMOS transistor). As a result, the driver transistor 134 is more vulnerable to ESD failure. Negative CDM is typically more challenging to pass. Therefore, exemplary circuit techniques for enhancing ESD protection are discussed below according to aspects of the present disclosure for the example of negative CDM. However, it is to be appreciated that the exemplary circuit techniques are also applicable to positive CDM and other types of ESD events, as discussed further below.
The sum of the turn-on offset voltage of the diode 116 and the turn-on offset voltage of the clamp device 120 can easily reach close to 2V, which may not scale down rapidly with technology node. For a protected transistor (e.g., transistor 134) that fails at 3V, this leaves a very small voltage overhead for the IR voltage drop of only 1V. If the peak CDM current is 5 A, then the maximum total resistance for this case is 0.2Ω. Thus, in this example, the sum of the diode-on resistance, the bus resistance, and the clamp resistance needs to be less than 0.2Ω, which is difficult to achieve in practice. Accordingly, circuit techniques for enhancing the CDM robustness of a protected circuit while maintaining high data rates and performance are desirable.
In certain aspects, ESD protection is enhanced by adding a secondary ESD circuit configured to provide a secondary current path for the resistor R2. During a negative CDM event, current flowing through the secondary current path flows through resistor R2 producing a voltage drop Vr2 across the resistor R2. This voltage drop Vr2 reduces the voltage seen at the driver transistor 134 during a negative CDM ESD event, and therefore reduces the voltage stress on the driver transistor 134. Exemplary implementations of the secondary ESD circuit are discussed below according to various aspects of the present disclosure.
During a negative CDM ESD event, the first diode 320 turns on and provides a secondary current path 322 from node 315 to the VDD bus 112. Because the first diode 320 is coupled in series with the resistor R2, the current flowing through the secondary current path 322 flows through the resistor R2, producing a voltage drop Vr2 across the resistor R2. The voltage drop Vr2 across the resistor R2 lowers the voltage seen at the drain of the driver transistor 134 to Vpad minus Vr2, thereby enhancing the ESD protection of the driver transistor 134.
The secondary ESD circuit 310 may also include a second diode 325, in which the anode of the second diode 325 is coupled to the VSS bus 114 and the cathode of the second diode 325 is coupled to the node 315. In this example, the second diode 325 is configured to provide a secondary current path from the VSS bus 114 to the resistor R2 (e.g., during a positive CDM ESD event).
It is to be appreciated that the first diode 320 and the second diode 325 can exist independently. For example, the secondary ESD circuit 310 may include the first diode 320, but not the second diode 325. In another example, the secondary ESD circuit 310 may include the second diode 325, but not the first diode 320. In another example, the secondary ESD circuit 310 may include both diodes 320 and 325.
In some implementations, the chip 100 may also include another secondary ESD circuit 350 coupled to a node 355 between the resistor R1 and the driver transistor 132. The secondary ESD circuit 350 includes a first diode 360, in which the anode of the first diode 360 is coupled to the node 355 and the cathode of the first diode 360 is coupled to the VDD bus 112. The first diode 360 is coupled in series with the resistor R1.
During a negative CDM ESD event, the first diode 360 turns on and provides a secondary current path from node 355 to the VDD bus 112. Because the first diode 360 is coupled in series with the resistor R1, the current flowing through the secondary current path flows through the resistor R1. This current may be in addition to the current flowing through the resistor R1 to the drain-body diode 215. In this example, the additional secondary current flow provided by the first diode 360 increases the voltage drop Vr1 across the resistor R1, which further lowers the voltage seen at the drain of the driver transistor 132. It is to be appreciated that the first diode 360 may also be used in cases where the drain-body diode 215 is not present.
The secondary ESD circuit 350 may also include a second diode 365, in which the anode of the second diode 365 is coupled to the VSS bus 114 and the cathode of the second diode 365 is coupled to the node 355. In this example, the second diode 365 is configured to provide a secondary current path from the VSS bus 114 to the resistor R1 (e.g., during a positive CDM ESD event).
It is to be appreciated that the secondary ESD circuits 310 and 350 can exist independently. For example, the chip 100 may include one of the secondary ESD circuits 310 and 350 or the chip 100 may include both of the secondary ESD circuits 310 and 350.
During a negative CDM ESD event, the first diode 420 turns on and provides a secondary current path 422 from node 415 to the VSS bus 114. Since the first diode 420 is coupled in series with the resistor R2, the current flowing through the secondary current path 422 flows through the resistor R2, producing a voltage drop Vr2 across the resistor R2. The voltage drop Vr2 across the resistor R2 lowers the voltage seen at the drain of the driver transistor 134 to Vpad minus Vr2, thereby enhancing the ESD protection of the driver transistor 134.
The dotted line between the first diode 420 and the VSS bus 114 indicates that one or more additional diodes may be stacked with the first diode 420. Thus, in some implementations, the secondary ESD circuit 410 may include two or more stacked diodes coupled between the node 415 and the VSS bus 114. Two or more stacked diodes may be used to increase the voltage needed to turn on the secondary current path. This may be done, for example, to prevent the secondary current path from unintentionally turning on during normal operation of the driver 130 in cases where the turn-on voltage of a single diode is lower than the voltage swing at the drain of the driver transistor 134 during normal operation.
In this regard,
The secondary ESD circuit 410 may also include a third diode 430, in which the anode of the third diode 430 is coupled to the VSS bus 114 and the cathode of the third diode 430 is coupled to the node 415. In this example, the third diode 430 is configured to provide a secondary current path from the VSS bus 114 to the resistor R2 (e.g., during a positive CDM ESD event). It is to be appreciated that the third diode 430 may be omitted in some implementations.
Referring back to
During a negative CDM ESD event, the first diode 460 turns on and provides a secondary current path from node 455 to the VSS bus 114. Because the first diode 460 is coupled in series with the resistor R1, the current flowing through the secondary current path flows through the resistor R1. This current may be in addition to the current flowing through the resistor R1 to the drain-body diode 215. In this example, the additional secondary current flow provided by the first diode 460 increases the voltage drop Vr1 across the resistor R1, which further lowers the voltage seen at the drain of the driver transistor 132. It is to be appreciated that the first diode 460 may also be used in cases where the drain-body diode 215 is not present.
The dotted line between the first diode 460 and the VSS bus 114 indicates that one or more additional diodes may be stacked with the first diode 460. In this regard,
The secondary ESD circuit 450 may also include a third diode 470, in which the anode of the third diode 470 is coupled to the VSS bus 114 and the cathode of the third diode 470 is coupled to the node 455. In this example, the third diode 470 is configured to provide a secondary current path from the VSS bus 114 to the resistor R1 (e.g., during a positive CDM ESD event). It is to be appreciated that the third diode 470 may be omitted in some implementations.
It is to be appreciated that the secondary ESD circuits 410 and 450 can exist independently. For example, the chip 100 may include one of the secondary ESD circuits 410 and 450 or the chip 100 may include both of the secondary ESD circuits 410 and 450.
During a negative CDM ESD event, the pad voltage Vpad rises above the voltage of the VDD bus 112. Since the drain of the PMOS transistor 520 is coupled to the I/O pad 110 via resistor R2 and the gate of the PMOS transistor 520 is coupled to the VDD bus 112, the drain is at a higher potential than the gate. When the potential difference between the drain and gate exceeds the threshold voltage of the PMOS transistor 520, the PMOS transistor 520 turns on and provides a secondary current path 522 from node 515 to the VDD bus 112. The current flowing through the secondary current path 522 flows through the resistor R2, producing a voltage drop Vr2 across the resistor R2. The voltage drop Vr2 across the resistor R2 lowers the voltage seen at the drain of the driver transistor 134 to Vpad minus Vr2, thereby enhancing the ESD protection of the driver transistor 134.
The secondary ESD circuit 510 may also include a dummy NMOS transistor 530, in which the source and gate of the NMOS transistor 530 are coupled to the VSS bus 114 and the drain of the NMOS transistor 530 is coupled to the node 515. In this example, the NMOS transistor 530 functions as a diode coupled in series with the resistor R2. In this example, the NMOS transistor 530 is configured to provide a secondary current path from the VSS bus 114 to the resistor R2 (e.g., during a positive CDM ESD event).
It is to be appreciated that the dummy PMOS transistor 520 and the dummy NMOS transistor 530 can exist independently. For example, the secondary ESD circuit 510 may include the dummy PMOS transistor 520, but not the dummy NMOS transistor 530. In another example, the secondary ESD circuit 510 may include the dummy NMOS transistor 530, but not the dummy PMOS transistor 520. In another example, the secondary ESD circuit 510 may include both the dummy PMOS transistor 520 and the dummy NMOS transistor 530.
In some implementations, the chip 100 may also include another secondary ESD circuit 550 coupled to a node 555 between the resistor R1 and the driver transistor 132. The secondary ESD circuit 550 includes a dummy PMOS transistor 560, in which the source and gate of the PMOS transistor 560 are coupled to the VDD bus 112 and the drain of the PMOS transistor 560 is coupled to the node 555. In this example, the PMOS transistor 560 functions as a diode coupled in series with the resistor R1.
During a negative CDM ESD event, the pad voltage Vpad rises above the voltage of the VDD bus 112. Since the drain of the PMOS transistor 560 is coupled to the I/O pad 110 via resistor R1 and the gate of the PMOS transistor 560 is coupled to the VDD bus 112, the drain is at a higher potential than the gate. When the potential difference between the drain and gate exceeds the threshold voltage of the PMOS transistor 560, the PMOS transistor 560 turns on and provides a secondary current path from node 555 to the VDD bus 112. Because the PMOS transistor 560 is coupled in series with the resistor R1, the current flowing through the secondary current path flows through the resistor R1. This current may be in addition to the current flowing through the resistor R1 to the drain-body diode 215. In this example, the additional secondary current flow provided by the PMOS transistor 560 increases the voltage drop Vr1 across the resistor R1, which further lowers the voltage seen at the drain of the driver transistor 132. It is to be appreciated that the dummy PMOS transistor 560 may also be used in cases where the drain-body diode 215 is not present.
The secondary ESD circuit 550 may also include a dummy NMOS transistor 570, in which the source and gate of the NMOS transistor 570 are coupled to the VSS bus 114 and the drain of the NMOS transistor 570 is coupled to the node 555. In this example, the NMOS transistor 570 functions as a diode coupled in series with the resistor R1. In this example, the NMOS transistor 570 is configured to provide a secondary current path from the VSS bus 114 to the resistor R1 (e.g., during a positive CDM ESD event).
It is to be appreciated that the dummy PMOS transistor 560 and the dummy NMOS transistor 570 can exist independently. For example, the secondary ESD circuit 550 may include the dummy PMOS transistor 560, but not the dummy NMOS transistor 570. In another example, the secondary ESD circuit 550 may include the dummy NMOS transistor 570, but not the dummy PMOS transistor 560. In another example, the secondary ESD circuit 550 may include both the dummy PMOS transistor 560 and the dummy NMOS transistor 570.
It is also to be appreciated that the secondary ESD circuits 510 and 550 can exist independently. For example, the chip 100 may include one of the secondary ESD circuits 510 and 550 or the chip may include both of the secondary ESD circuits 510 and 550.
In the example in
During a negative CDM ESD event, the trigger device 620 turns on the clamp transistor 630 providing the secondary current path 624 from node 615 to the VSS bus 114. The current flowing through the secondary current path flows through the resistor R2, producing a voltage drop Vr2 across the resistor R2. The voltage drop Vr2 across the resistor R2 lowers the voltage seen at the drain of the driver transistor 134 to Vpad minus Vr2, thereby enhancing the ESD protection of the driver transistor 134.
In some implementations, the chip 100 may also include another secondary ESD circuit 650 coupled to a node 655 between the resistor R1 and the driver transistor 132. The secondary ESD circuit 650 includes a clamp device including a clamp transistor 670 and a trigger device 660 (e.g., RC trigger device). The clamp transistor 670 is coupled between the node 655 and the VSS bus 114. The trigger device 660 is configured to turn off the clamp transistor 670 during normal operation. The trigger device 660 is configured to turn on the clamp transistor 670 during an ESD event (e.g., negative CDM ESD event) to provide a secondary current path.
In the example in
During a negative CDM ESD event, the trigger device 660 turns on the clamp transistor 670 providing a secondary current path from node 655 to the VSS bus 114. Because the clamp transistor 670 is coupled in series with the resistor R1, the current flowing through the secondary current path flows through the resistor R1. This current may be in addition to the current flowing through the resistor R1 to the drain-body diode 215. In this example, the additional secondary current flow provided by the clamp transistor 670 increases the voltage drop Vr1 across the resistor R1, which further lowers the voltage seen at the drain of the driver transistor 132. It is to be appreciated that the clamp transistor 670 may also be used in cases where the drain-body diode 215 is not present.
It is also to be appreciated that the secondary ESD circuits 610 and 650 can exist independently. For example, the chip 100 may include one of the secondary ESD circuits 610 and 650 or the chip 100 may include both of the secondary ESD circuits 610 and 650.
In some implementations, the clamp transistors 630 and 670 may share a trigger device. In this regard,
During normal operation, the trigger device 720 turns off the clamp transistors 630 and 670. Thus, the clamp transistors 630 and 670 are off during normal operation.
During an ESD event, the trigger device 720 turns on the clamp transistor 630, which provides a secondary current path that allows current to flow through the resistor R2. The current flow produces a voltage drop Vr2 across the resistor R2, which lowers the voltage on the drain of the driver transistor 134, as discussed above. During the ESD event, the trigger device 720 also turns on the clamp transistor 670, which provides a secondary current path that allows current to flow through the resistor R1.
During normal operation, the capacitor 834 charges to a supply voltage on the VDD bus 112. As a result, the voltage at the input 842 of the inverter 840 is high during normal operation. This causes the output 844 of the inverter 840 to be low, and thus the output 822 of the trigger device 820 to be low. For the example of one or more clamp transistors implemented with one or more NMOS transistors, the low voltage turns off the one or more clamp transistors.
During a negative CDM ESD event, the capacitor 834 does not have time to charge up. This is because the ESD event is a transient event having a shorter time duration than the RC time constant of the RC transient detector 838. Thus, the input 842 of the inverter 840 is low. This causes the output 844 of the inverter 840 to be high, and thus the output 822 of the trigger device 820 to be high during the ESD event. For the example of one or more clamp transistors implemented with one or more NMOS transistors, the high voltage turns on the one or more clamp transistors during the ESD event.
The trigger device 720 may also be used for the clamp device 120 in the primary current path. In this regard,
During normal operation, the trigger device 720 turns off the clamp transistor 910. During an ESD event, the trigger device 720 turns on the clamp transistor 910, which provides a current path between the VDD bus 112 and the VSS bus 114.
In certain aspects, ESD protection may be incorporated into the driver 130 in which one or more driver transistors (e.g., transistor 132) are turned on during an ESD event. In this regard,
The pass circuit 1040 has a first input 1042, a second input 1044, and an output 1046. In the example in
During normal operation, the second input 1044 of the pass circuit 1040 is configured to receive a drive signal for driving the gate of the transistor 134. The drive signal may carry high-speed data to be transmitted by the driver 130 during normal operation. In some implementations, the driver signal may be provided by a predriver circuit 1030 coupled to the second input 1044. The pass circuit 1040 passes the drive signal to the gate of the transistor 134 during normal operation. During an ESD event, the pass circuit 1040 passes the trigger signal from the trigger device 1020 to the gate of the transistor 134 where the trigger signal is a signal that turns on the transistor 134. Thus, the pass circuit 1040 allows the transistor 134 in the driver 130 to be used for ESD protection while preserving the normal functionality of the transistor 134.
In the example in
During a negative CDM ESD event, the trigger device 1020 turns on the transistor 134 providing a secondary current path 1052 from the resistor R2 to the VSS bus 114. The current flowing through the secondary current path 1052 flows through the resistor R2, producing a voltage drop Vr2 across the resistor R2. The voltage drop Vr2 across the resistor R2 lowers the voltage seen at the drain of transistor 134 to Vpad minus Vr2, thereby enhancing the ESD protection of transistor 134.
The ESD protection circuit also includes the pass circuit 1040 discussed above. In the example in
The ESD protection circuit also includes a second pass circuit 1140 having a first input 1142, a second input 1144, and an output 1148. The first input 1142 of the pass circuit 1140 is coupled to the second output 1124 of the trigger device 1120, the second input 1144 of the pass circuit 1140 is configured to receive the drive signal during normal operation, and the output 1148 of the pass circuit 1140 is coupled to the gate of transistor 132. In the example in
During normal operation, the second inputs 1044 and 1144 of the pass circuits 1040 and 1140 receive a drive signal. The drive signal may carry high-speed data to be transmitted by the driver 130 during normal operation. In some implementations, the driver signal may be provided by the predriver circuit 1030, which may be coupled to the second inputs 1044 and 1144. The pass circuits 1040 and 1140 couple the drive signal to the gates of transistors 134 and 132, respectively, during normal operation. Thus, the pass circuits 1040 and 1140 allow the transistors 132 and 134 in the driver 130 to be used for ESD protection while preserving the normal functionalities of these transistors 132 and 134.
In the example in
In the example in
Thus, during a negative CDM ESD event, the trigger device 1120 turns on the transistors 132 and 134. The turning on of transistor 132 provides a secondary current path 1152. The current flowing through the secondary current path 1152 passes through resistor R1, producing a voltage drop Vr1 across the resistor R1, which lowers the voltage seen at transistor 132 and hence lowers the voltage stress on transistor 132. The turning on of transistor 134 provides a secondary current path 1052. The current flowing through the secondary current path 1052 passes through resistor R2, producing a voltage drop Vr2 across the resistor R2, which lowers the voltage seen at transistor 134 and hence lowers the voltage stress on transistor 134.
It is to be appreciated that the pass circuit 1140 is not limited to the exemplary implementation in
In certain aspects, ESD protection may be incorporated into impedance matching networks. The impedance matching networks may be on the driver side and/or receiver side. In this regard,
The first impedance matching network 1230 includes multiple slices 1232-1 to 1232-3 where each slice includes a respective resistor 1234-1 to 1234-3 and a respective transistor 1236-1 to 1236-3 (e.g., NMOS transistor) coupled in series. Although three slices are shown in the example in
The second impedance matching network 1240 includes multiple slices 1242-1 to 1242-3 where each slice includes a respective resistor 1244-1 to 1244-3 and a respective transistor 1246-1 to 1246-3 (e.g., NMOS transistor) coupled in series. During normal operation, the impedance of the impedance matching network 1240 is controlled by controlling the number of slices that are on and off.
The transistor 1260 is used to switch the impedance matching networks to ground or another polarity directly. In some implementations, the transistor 1260 may be omitted with the sources of the transistors 1236-1 to 1236-3 and 1246-1 to 1246-3 going directly to the vssa bus.
The ESD protection circuit includes ESD diodes 1212 and 1217, a trigger device 1220 and a clamp transistor 1222. The clamp transistor 1222 (e.g., NMOS) is coupled between vcca bus and vssa bus. The clamp transistor 1222 is triggered (i.e., turned on) by the trigger device 1220 during an ESD event to provide a discharge current path between vcca and vssa. In the example shown in
The output 1227 of the trigger device 1220 is coupled to the gates of the transistors 1236-1 to 1236-3 in the first impedance matching network 1230 via pass circuit 1252 (e.g., NAND gate), the gates of the transistors 1246-1 to 1246-3 in the second impedance matching network 1240 via pass circuit 1256 (NAND gate), and the gate of transistor 1260 via pass circuit 1254 (e.g., NAND gate). The pass circuits 1252, 1254 and 1256 are configured to pass control signals to the transistors during normal operation. In this example, during an ESD event, the trigger signal for the transistors in the impedance matching networks 1230 and 1240 and transistor 1260 are taken before the inverter 1224. In this example, the pass circuits 1252, 1254 and 1256 invert the trigger signal from the trigger device 1220, thereby performing the inverting function of the inverter 1224. In other implementations, the trigger signal for the pass circuits 1252, 1254 and 1256 may be taken after the inverter 1224 (e.g., in implementations where the pass circuits 1252, 1254 and 1256 are non-inverting). Thus, whether the trigger signal is taken before or after the inverter 1224 is implementation dependent.
During an ESD event, the trigger device 1220 turns on the transistors in the impedance matching networks 1230 and 1240 and transistor 1260. This creates secondary current paths from the pad 1210 to vssa through the resistors 1234-1 to 1234-3 in the first impedance matching network 1230, and creates secondary current paths from the pad 1215 to vssa through the resistors 1244-1 to 1244-3 in the second impedance matching network 1240. The currents flowing through the resistors 1234-1 to 1234-3 produce IR voltage drops that lower the voltages seen at the transistors 1236-1 to 1236-3 during the ESD event. The currents flowing through the resistors 1244-1 to 1244-3 produce IR voltage drops that lower the voltages seen at the transistors 1246-1 to 1246-3 during the ESD event. Hence, the voltage stress on these transistors is reduced.
Thus, examples have been presented in which ESD protection can be incorporated into drivers and impedance matching networks to take advantage of existing circuits. However, it is to be appreciated that this technique is not limited to drivers and impedance matching networks and that ESD protection may be incorporated into other types of existing interface circuits that are coupled to an I/O pad to take advantage of existing circuits.
For example, a secondary current path may be created by a secondary ESD circuit (e.g., any one or more of the exemplary secondary ESD circuits discussed above). In this regard,
A secondary current path may also be created by turning on an existing transistor (e.g., transistor 132 or 134) in an interface circuit (e.g., driver 130) during an ESD event (e.g., using trigger device 1020 or 1120). A secondary path can also coin from a parasitic element (e.g., drain-body diode 215) of a driver device (e.g., driver transistor 132). By taking advantage of one or more pre-existing resistors (e.g., resistor R1 and/or resistor R2) and creating one or more secondary current paths through the one or more pre-existing resistors, ESD protection schemes according to various aspects provide enhanced ESD robustness with impact on the performance of the I/O.
Exemplary ESD circuit schemes according to aspects of the present disclosure are also applicable to cases where one or more protected transistors (e.g., transistor 132 and 134) are coupled to the pad through a parasitic resistor (e.g., due to parasitic routing resistance).
Exemplary ESD circuit schemes according to aspects of the present disclosure are also applicable to cases where the resistors R1 and R2 are not present. In these cases, a secondary current path that is created by a secondary ESD circuit or by turning on an existing transistor (e.g., transistor 132 or 134) reduces the voltage on the pad Vpad. This is because the current flowing the secondary current path reduces the amount of current flowing though the primary current path 210, which reduces the voltage drops (e.g., IR voltage drops) in the primary current path 210 and hence reduces the pad voltage Vpad. In these cases, enhanced ESD protection is provided by splitting the current between the primary current path and the secondary current path and the resulting total voltage reduction on the pad 110.
It is to be appreciated that the exemplary ESD protection schemes discussed above may also apply to cases where transistors (e.g., driver transistors 132 and 134) share a common resistor. In this regard,
In this example, a secondary current path created by any of the exemplary ESD protection schemes discussed above causes current to flow through the common resistor R creating a voltage drop Vr across the common resistor R. The voltage drop Vr lowers the voltage seen at the transistors 132 and 134, thereby enhancing ESD protection for these transistors 132 and 134.
The secondary current path may be created by a secondary ESD circuit (e.g., any one or more of the exemplary secondary ESD circuits discussed above). In this case, the secondary ESD circuit may be coupled to node 1405 so that the current flowing through the secondary ESD circuit flows through the resistor R. In this regard,
The secondary current path may also be created by turning on an existing transistor (e.g., transistor 132 and/or transistor 134) during an ESD event. For example, the secondary current path may be created by turning on transistor 134 with a trigger device 1420 coupled to the gate of transistor 134. The trigger device 1420 may be implemented with any of the exemplary trigger devices 820, 1020, and 1120 discussed above, but is not limited to these examples. The trigger device 1420 may be coupled to the gate of transistor 134 via a pass circuit (not shown in
In some cases, the normal operating voltage on the pad 110 can be low and below the turn-on voltage of a diode. For example, in some cases, a low voltage interface (e.g., driver) may have a low voltage swing (e.g., <0.4V). In these cases, ESD protection can be enhanced using a structure with a forward diode from the pad 110 to the VSS bus as opposed to the conventional ESD protection scheme where an up diode 116 is coupled from the pad 110 to the VDD bus. In this structure, the voltage on the pad 110 during an ESD may be much lower than the conventional scheme since the ESD current flows directly from the pad 110 to the VSS bus through the forward diode and has less dependency on bus resistance.
During a negative CDM ESD event, the first diode 1510 turns on and provides a current path 1530 from the pad 110 to the VSS bus. The current flowing through the first diode 1510 lowers the pad voltage Vpad due to reduced elements in the current path 1530 compared with the current path 210 in
In the example in
It is to be appreciated that, in other implementations, more than two diodes may be coupled in series between the pad 110 and the VSS bus in the forward direction from pad 110 to the VSS bus, and more than two diodes may be coupled in series between the pad 110 and the VSS bus in the forward direction from VSS bus to the pad 110.
In certain aspects, diodes may be laid out on a chip to provide the option of coupling a single forward diode 1510 from the pad 110 to the VSS bus (e.g., illustrated in
At block 1710, during an ESD event, on one or more diodes coupled between the pad and a ground bus are turned on, wherein the one or more diodes are in a forward direction from the pad to the ground bus. For example, the one or more diodes (e.g., diodes 1510 and 1515) may turn on when a voltage on the pad (e.g., pad 110) exceeds a turn-on voltage of the one or more diodes during the ESD event. The ESD event may include a charged device model (CDM) event or another type of ESD event.
In certain aspects, the one or more diodes includes a single diode (e.g., diode 1510). In these aspects, the method 1700 may also include, during a normal operation, driving the driver with a drive signal, wherein the drive signal causes the driver to produce a voltage swing at the output of the driver that is less than a turn-on voltage of the single diode. The drive signal may include a data signal or a control signal.
In certain aspects, the one or more diodes includes a stack of two or more diodes (e.g., diodes 510 and 515). In these aspects, the method 1700 may also include, during a normal operation, driving the driver with a drive signal, wherein the drive signal causes the driver to produce a voltage swing at the output of the driver that is less than a turn-on voltage of the stack of two or more diodes. The drive signal may include a data signal or a control signal. The turn-on voltage of the stack of two or more diodes is equal to the sum of the individual turn-on voltages of the two or more diodes.
In certain aspects, the method 1700 may also include, during a normal operation, driving the driver with a drive signal, wherein the drive signal causes the driver to produce a voltage swing at the output of the driver of 0.4 V or less.
At block 1810, a number of the diodes to be used for ESD protection is determined. For example, the number of diodes to be used for ESD protection may be determined based on a use case of the chip, a process corner of the chip, etc.
At block 1820, metal routing on the chip is programmed to couple one or more of the diodes between a pad and a ground bus based on the determined number of diodes. For example, programming the metal routing may include programming the pattern of one or more masks (e.g., one or more photomasks) defining a pattern of the metal routing. In this example, the one or more masks may be used in a photolithographic process that forms the metal routing by etching a metal layer on the chip.
In certain aspects, the method 1800 may include determining a turn-on voltage of one of the diodes on the chip, wherein determining the number of diodes to be used for ESD protection includes determining the number of diodes based on the determined turn-on voltage. The turn-on voltage may be process and/or temperature dependent, and therefore, the number of diodes to be used for ESD protection for the chip may be process and/or temperature dependent. The turn-on voltage may be determined, for example, by characterizing the diode though measurements and/or computer simulation.
For example, if the determined turn-on voltage of the one of the diodes is greater than an output voltage swing of a driver on the chip then the determined number of diodes may be one. In this example, the metal routing may be programmed to couple the one of the diodes between the pad and the ground while the metal routing bypasses the other one or more of the diodes. In this example, the other one or more of the diodes are not used.
In another example, if the determined turn-on voltage of the one of the diodes is less than the output voltage swing of the driver (e.g., for a high temperature use case), then the determined number of diodes may be two or more. In this example, the metal routing may be programmed to couple two or more of the diodes in series between the pad and the ground. This may be done, for example, to prevent the output voltage swing of the driver from unintentionally turning on the ESD protection during normal operation.
The processor 1920 may include, for example, one or more central processing units, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), discrete gate or transistor logic, discrete hardware components, or any combination thereof. The memory 1910 may include, for example, RAM (Random Access Memory), flash memory, ROM (Read Only Memory), PROM (Programmable Read-Only Memory), EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), registers, magnetic disks, optical disks, hard drives, or any other suitable storage medium, or any combination thereof.
The network interface 1930 may be configured to receive data from a network (e.g., a local area network, a wide area network, etc.) and provide the data to the processor 1920. The network interface 1930 may also be configured to output data from the processor 1920 to the network.
The user interface 1940 may be configured to receive data from a user (e.g., via keypad, mouse, etc.) and provide the data to the processor 1920. The user interface 1940 may also be configured to output data from the processor 1920 to the user (e.g., via a display).
It is to be appreciated that the present disclosure is not limited to the exemplary terminology used above to describe aspects of the present disclosure. For example, an I/O pad may also be referred to as an interface pad, an integrated circuit (IC) pad, a pin, or another term. A VDD bus may also be referred to as a voltage supply bus, a voltage supply rail, or another term. A VSS bus may also be referred to as a ground bus or a ground rail.
Any reference to an element herein using a designation such as “first,” “second,” and so forth does not generally limit the quantity or order of those elements. Rather, these designations are used herein as a convenient way of distinguishing between two or more elements or instances of an element. Thus, a reference to first and second elements does not mean that only two elements can be employed, or that the first element must precede the second element.
Within the present disclosure, the word “exemplary” is used to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term “aspects” does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation. The term “approximately”, as used herein with respect to a stated value or a property, is intended to indicate being within 10% of the stated value or property.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
This application claims priority under 35 U.S.C. § 119(e) to U.S. Provisional Application No. 63/046,331 filed on Jun. 30, 2020, the entire specification of which is incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 63046331 | Jun 2020 | US |
