As is known in the art, phased array systems may include a beamformer for directional signal transmission and reception. Existing beamformers are provided as high density printed wiring board (PWB) circuits. The proximity of circuits on the PWB can give rise to unwanted coupling effects. For example, the electric field modes found in a typical stripline circuit include the intended, often dominant transverse electromagnetic (TEM) mode, along with both evanescent and propagating transverse magnetic (TM) and transverse electric (TE) modes. These non-TEM modes are considered as a reactive set, in that they form an unintended coupling path between circuit elements.
In some existing phased array systems, coupling effects between PWB circuit elements may be reduced using additional structural components to prevent undesirable coupling between circuit components. For example, conventional phased arrays systems may include a series (or “fence”) of conductive vias to suppress propagation of higher-order (i.e., unwanted) modes between PWB circuit elements.
It is appreciated herein that the use of conductive vias add several steps to the printed wiring board (PWB) manufacturing process and are a significant cost driver. In addition, conductive vias add complexity to the design, since often these vias interfere with routing desired signal paths on various layers in a multi-layer PWB. Moreover, conductive vias typically require using a subtractive manufacturing technique.
Described herein are circuits for via-less beamformers (i.e., beamformers that do not rely on conductive vias for mode suppression). Embodiments of a via-less beamformer may include high electrical performance relative to existing beamformer circuits, may facilitate low-cost additive manufacturing (AM) of phased arrays, and may have broad applicability to a wide variety of phased array applications. Also described herein are circuit design techniques based on reactive field theory and modal expansion that can be used to select acceptable beamformer circuit layouts in the absence of conductive vias.
In one aspect, a via-less beamformer is provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements.
In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
By providing circuits which do not require vias for suppression of undesirable signals (e.g. mode suppression), it is possible to combine such via-less circuits to provide via-less beamformer circuits as well as other circuits suitable for use in a phased array radar, for example. Thus, coupling effects between PWB circuit elements may be reduced without using additional structural components to prevent undesirable coupling between circuit components. For example, it is not necessary to include a series (or “fence”) of conductive vias to suppress propagation of higher-order (i.e., unwanted) modes between PWB circuit elements in a beamformer circuit. Hence a via-less beamformer circuit may be provided. Since conductive vias are not needed to suppress propagation of RF signals, such via-less beamformer circuits are less expensive to manufacture than conventional beamformer circuits which utilize conductive vias for suppression of undesirable RF signals.
The foregoing features may be more fully understood from the following description of the drawings in which:
The drawings are not necessarily to scale, or inclusive of all elements of a system, emphasis instead generally being placed upon illustrating the concepts, structures, and techniques sought to be protected herein.
In certain embodiments, the transmit and receive sides may be integrated in full or in part (e.g., the transmit beamformer 112 and the receive beamformer 126 may be provided from common hardware). As used herein, the term “transmit-receive system” generally refers to a system having both transmit and receive capabilities.
In various embodiments, transmit beamformer 112 and/or the receive beamformer 126 may be provided as via-less beamformers (i.e., beamformers that do not rely on conductive vias for mode suppression). In certain embodiments, the via-less beamformers may be fabricated using additive manufacturing (AM) techniques. In many embodiments, a beamformer 112, 126 may include one or more circuits that similar to those described below in conjunction with
Referring to
The input port 202 is coupled to a first pair of quarter wave transformers 210a, 210b via a signal path 208. In turn, the quarter wave transformers 210a, 210b are coupled to respective ones of a second pair of quarter wave transformers 212a, 212b. A first resistor 214 is coupled between the first pair of quarter wave transformers 210a, 210b and a second resistor 216 is coupled between the second pair of quarter wave transformers 212a, 212b, as shown. The quarter wave transformers 212a, 212b are coupled to respective output ports 204, 206 via signal paths 218, 220. The transformers 210, 210b, 212a, 212b and/or the signal paths 208, 218, 220 may be provided as transmission lines printed onto a substrate using an AM technique. The values of resistors 214, 216 may be selected such that the two outputs 204, 206 are matched while also providing sufficient isolation therebetween. In certain embodiments, resistor 214 may have a value of about 1.5Z0 ohms and resistor 216 may have a value of about 5.6Z0 ohms.
It will be appreciated that the circuit 200 may be classified as a double-tuned Wilkinson divider.
In certain embodiments, the circuit 200 may include edge-launch connectors for coupling one or more of the ports 202, 204, 206 to other layers of a printed wiring board (PWB).
The layout of the circuit 200 may be selected to achieve desired electrical performance characteristics—e.g., bandwidth and/or scattering parameter (S-parameter) performance—without having to provide a series (or “fence”) of conductive vias to suppress coupling of higher-order modes between the conductors/signal paths which make up circuit 200.
It is recognized herein that bends and other circuit features can cause energy to split out into other modes of propagation besides the dominant mode (i.e., the mode where current follows the signal paths 208, 218, 220 and transformers 210, 210b, 212a, 212b). If two components of the circuit 200 are located sufficiently close together, then these other modes can cause unwanted coupling effects (or “proximity effects”) that degrade performance (e.g., introduce unwanted coupling between ports). Likewise, unwanted coupling can occur if components of the circuit 200 are located sufficiently close to components of a nearby circuit on the same circuit board.
Accordingly, in many embodiments, the layout of the circuit 200 may be selected to reduce higher-order modes such that the divider 200 acts as a single-mode device (e.g., a single TEM or quasi-TEM device). As used herein, the term “layout” refers to the geometric configuration of the circuit components (including the shape, length, and widths of signal paths), along with the type of components used (e.g., stripline, coaxial, or co-planar waveguide). In many embodiments, reactive field theory is used to determine the proximity effect of various circuit features. This information can be used to select the circuit layout to avoid (or mitigate the effects of) reactive field expansion.
In some embodiments, modal expansion (or “the modal method”) can be used to select the layout and configuration of one or more circuits within a via-less beamformer. The purpose of modal expansion is to provide a set of orthogonal basis functions, the sum of which completely characterize the total electric field distribution at any location within a PWB circuit.
In various embodiments, the following process may be used to select the circuit layout: (1) determine which circuit features can produce reactive fields; (2) separate the total field into a modal set; (3) determine the modal weighting coefficients based on geometrical and/or design features of the circuit.
When using modal expansion, the following principles may be applied.
The form taken by the modal expansion must meet the above conditions. Since PWB circuits in general rely on dominant TEM propagation, the associated boundary conditions often exclude or cutoff entire mode sets. A stripline geometry, for example cannot propagate the TM modes, since they are cutoff. As a result, the modal expansion may take the following form,
The total field distribution is determined at frequency (f), and repeated for all frequencies under consideration.
The number of modes included in the modal summation is bounded by (N), and is subject to the accuracy needed and the geometrical purity. The lowest order mode under consideration is ETA
It is appreciated herein that modal expansion provides a means to interpret total electric field distributions produced in a beamformer or other device. Modal expansion can be used to isolate regions of a microwave circuit where proximity effects may occur, and to expand the modes in that region in order to determine whether reactive fields are present. When such a condition exists, there are a number of design techniques that can be employed to reduce the reactive field content down to acceptable levels. Examples of such techniques include increasing the separation between circuit elements, reducing the length of transmission lines where reactive fields are present, and rounding or mitering the corners of transmission line bends.
Using the above-described technique, a stripline divider/combiner circuit suitable for operation in the 2.0 to 4.0 GHz frequency range includes a pair of substrates each having a thickness of about 20 mils and a relative permittivity (ϵr) of about 3.5. Signal path 202 may have a width (W1) of about 25 mils corresponding to a characteristic impedance of about 50 ohms and signal paths 210a, 210b may have a width (W2) of about 7 mils corresponding to a characteristic impedance of about 80 ohms. Signal paths 212a, 212b may have width (W3) of about 15 mils corresponding to a characteristic line impedance of about 60 ohms and signal paths 218, 220 may have a width (W4) of about 25 mils corresponding to a characteristic line impedance of about 50 ohms. The radius (R1) of signal paths 210a, 210b may be about 0.183 inches, the radius (R2) of signal paths 212a, 212b may be about 0.183 inches, and the radius (R3) of signal paths 218, 220 may be about 0.06 inches.
It should be appreciated that the above dimensions may be scaled to suit the needs of a particular application. For example, if the circuit is intended to operate in a system having a 75 ohm characteristic impedance, then the width of lines 208, 218, 220 would be adjusted accordingly. As another example, the radii R1, R2, R2, may change with frequency.
In some embodiments, a via-less beamformer based on the divider circuit 200 may reduce manufacturing costs by at least 20% compared to existing systems. In many embodiments, S-parameter performance is as good as convention PWB-based circuits using conductive vias to suppress higher-order modes.
Referring to
In some embodiments, the layout of divider circuit 300 may be selected using techniques described above in conjunction with
In many embodiments, one or more of the dividers 312, 314, 316 may be provided as a double-tuned Wilkinson divider similar to the divider shown in
It will be appreciated that the illustrative circuit 300 uses a 2-level arrangement of 2:1 dividers to provide an overall 4:1 divider. This approach can be extended to provide arbitrary binomial power divisions, such as 2:1, 4:1, 8:1, 16:1, etc. It should be appreciated that the structures and techniques described herein can also be applied to non-binomial power divider circuits, for example, 3:1, 5:1, 7:1, etc. power divider circuits. In general, structures and techniques described herein can be used to realize a N:1 power divider/combiner for use in a via-less beamformer.
Referring to
It is appreciated herein that the 90-degree intersections of the transmission lines and the branches will generate reactive fields, causing energy to split out into other modes of propagation besides the dominant mode. Accordingly, in many embodiments, reactive field theory may be used to determine how far, and in which directions, the branch-induced reactive fields will propagate. In turn, this information can be used to select an appropriate circuit layout.
In some embodiments, the layout of a branch hybrid coupler circuit 400 may be selected using techniques described above in conjunction with
For example, using the aforementioned techniques, a branch hybrid coupler circuit suitable for operation in the 2.0 to 4.0 GHz frequency range includes a pair of substrates each having a thickness of about 20 mils and a relative permittivity (ϵr) of about 3.5. The transmission lines 410, 412 may include multiple segments with different impedances. For example, each transmission line may include a first section having a width (W1) of about 24 mils corresponding to a characteristic impedance of about 44 ohms, a second section having a width (W2) of about 30 mils corresponding to a characteristic impedance of about 38 ohms, and a first section having a width (W3) of about 24 mils corresponding to a characteristic impedance of about 44 ohms. A first branch 414 may have a width of about 3 mils corresponding to a characteristic impedance of about 100 ohms, a second branch 416 may have a width of about 12 mils corresponding to a characteristic impedance of about 64 ohms, and a third branch 418 may have a width of about 3 mils corresponding to a characteristic impedance of about 100 ohms.
It should be appreciated that the above dimensions may be scaled to suit the needs of a particular application.
All references cited herein are hereby incorporated herein by reference in their entirety.
Having described certain embodiments, which serve to illustrate various concepts, structures, and techniques sought to be protected herein, it will be apparent to those of ordinary skill in the art that other embodiments incorporating these concepts, structures, and techniques may be used. Elements of different embodiments described hereinabove may be combined to form other embodiments not specifically set forth above and, further, elements described in the context of a single embodiment may be provided separately or in any suitable sub-combination. Accordingly, it is submitted that the scope of protection sought herein should not be limited to the described embodiments but rather should be limited only by the spirit and scope of the following claims.