A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights whatsoever.
The present disclosure relates generally to circular patch antennas, and more particularly in one exemplary aspect to circular patch antennas for use with global navigation satellite system (GNSS) frequency bands.
Traditionally, antenna designs for use with GNSS frequency bands often utilize ceramic based materials to meet the performance-based requirements for these operating bands. However, these ceramic based materials are relatively heavy making there use less than desirable in applications in which mass is a design constraint. Additionally, ceramic based materials are relatively brittle which makes there use with, for example, unmanned aerial vehicles (UAVs) less than desirable. Accordingly, ongoing trends in the development of antennas for use with, for example, UAVs has required the use of non-traditional materials that: (1) are lighter in weight to, inter alia, maximize the battery life for these UAVs; and (2) have increased impact-resistance, to improve the reliability of the antenna design. As a result, new technologies that address the deficiencies of prior ceramic-based antenna designs are now needed.
The present disclosure satisfies the foregoing needs by providing, inter alia, methods, apparatus and systems for the implementation of circular patch antennas that address some or all of the deficiencies recognized above.
In one aspect, a circular patch antenna is disclosed. In one embodiment, the circular patch antenna includes a first dielectric patch having a first plurality of apertures; a second dielectric patch having a second plurality of apertures, at least a portion of the first plurality of apertures and the second plurality of apertures being aligned with one another when the first dielectric patch is positioned with the second dielectric patch; and a metallization that is positioned between the first dielectric patch and the second dielectric patch, the metallization including a plurality of arc slots, each of the plurality of arc slots being positioned between the first and second plurality of apertures and an external periphery of the metallization.
In one variant, the metallization includes two distinct flexible printed circuit boards.
In another variant, the second dielectric patch includes a plurality of slots organized into a plurality of groupings of slots.
In yet another variant, a portion of the plurality of slots are positioned between one of the first plurality of apertures and one of the second plurality of apertures.
In yet another variant, the plurality of groupings of slots includes a first grouping of slots and a second grouping of slots that is disposed adjacent the first grouping of slots, wherein a first arc slot of the plurality of arc slots covers a portion of the first grouping of slots and a portion of the second grouping of slots.
In yet another variant, the first dielectric patch further includes an inner ring that is positioned about the first plurality of apertures.
In yet another variant, the first dielectric patch further includes an intermediate ring that is positioned between the first plurality of apertures and the second plurality of apertures.
In yet another variant, the first dielectric patch further includes one or more outer rings, the one or more outer rings being positioned between the second plurality of apertures and an outer periphery of the first dielectric patch.
In yet another variant, the first dielectric patch and the second dielectric patch include disk-like profiles for an external periphery of the first dielectric patch and the second dielectric patch.
In yet another variant, the first dielectric patch and the second dielectric patch each include one or more alignment features that provide alignment between the first dielectric patch and the second dielectric patch when mounted with one another.
In yet another variant, the circular patch antenna further includes a top metallization that is disposed atop the first dielectric patch, the top metallization including a plurality of arc slots.
In yet another variant, the circular patch antenna further includes a first plurality of solder pins and a second plurality of solder pins, the first plurality of solder pins being received through both the first dielectric patch and the second dielectric patch, while the second plurality of solder pins is received within the second dielectric patch, but not the first dielectric patch.
In yet another variant, the circular patch antenna further includes a bottom metallization that is disposed below the second dielectric patch.
In yet another variant, the two distinct flexible printed circuit boards positioned between the first dielectric patch and the second dielectric patch, the top metallization that is disposed atop the first dielectric patch and the bottom metallization that is disposed below the second dielectric patch each comprise a circular outer profile.
In another embodiment, the circular patch antenna includes a first dielectric patch having a first plurality of apertures and a second plurality of apertures that are disposed between the first plurality of apertures and an external periphery for the first dielectric patch; a second dielectric patch having a third plurality of apertures and a fourth plurality of apertures, the first plurality of apertures being aligned with the third plurality of apertures and the second plurality of apertures being aligned with the fourth plurality of apertures when the first dielectric patch is mounted on the second dielectric patch; and a metallization that is positioned between the first dielectric patch and the second dielectric patch, the metallization including a plurality of arc slots, each of the plurality of arc slots being positioned between the first and second plurality of apertures and an external periphery of the metallization.
In one variant, the second dielectric patch includes a plurality of slots organized into a plurality of groupings of slots.
In another variant, a portion of the plurality of slots are positioned between one of the first plurality of apertures and one of the second plurality of apertures.
In yet another variant, the plurality of groupings of slots includes a first grouping of slots and a second grouping of slots that is disposed adjacent the first grouping of slots, wherein a first arc slot of the plurality of arc slots covers a portion of the first grouping of slots and a portion of the second grouping of slots.
In yet another variant, the metallization comprises two distinct metallizations.
In yet another variant, the circular patch antenna further includes a top metallization that is positioned atop the first dielectric patch, the top metallization including a plurality of arc slots that are aligned with the plurality of arc slots located on the two distinct metallizations positioned between the first dielectric patch and the second dielectric patch.
In another aspect, systems that incorporate the aforementioned circular patch antennas are disclosed.
In yet another aspect, methods of manufacturing the aforementioned circular patch antennas are disclosed.
Other features and advantages of the present disclosure will immediately be recognized by persons of ordinary skill in the art with reference to the attached drawings and detailed description of exemplary implementations as given below.
The features, objectives, and advantages of the present disclosure will become more apparent from the detailed description set forth below when taken in conjunction with the drawings, wherein:
Detailed descriptions of the various embodiments and variants of the apparatus and methods of the present disclosure are now provided. It is noted that wherever practicable similar or like reference numbers may be used in the figures and may indicate similar or like functionality. The figures depict embodiments of systems, circular patch antennas, or methods for purposes of illustration only. One skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods illustrated herein may be employed without necessarily departing from the principles described herein.
Exemplary Circular Patch Antenna—
Ongoing trends in the development of antennas for use with, for example, unmanned aerial vehicles (UAVs) has resulted in the development of non-traditional materials that: (1) are lighter in weight, to maximize the battery life for these UAVs; and (2) have increased impact-resistance, to improve the reliability of the antenna design. More recently, the assignee of the present disclosure has implemented a polymer dielectric substance fortified with ceramic particles that is utilized as an alternative to heavier and more brittle ceramics that have traditionally been used in these antenna designs. These polymer dielectric materials have been marketed under the name TERRABLAST® and are more than 30% lighter than traditional ceramic antenna technologies and are impact resistant to withstand drops, falls and impacts making it ideal for applications such as, for example, UAVs, where the antenna's mechanical robustness following potential impacts is critical. This polymer dielectric material also has broader utility outside of antenna designs for use with UAV applications.
Referring now to
The circular patch antenna 100 may also include one or more solder pins 106, 108. As shown in
As a brief aside, and referring to
Referring now to
The middle flex PCB(s) 112, 134 may also include a set of arc-slots 125 that may be positioned between the outer perimeter of the respective middle flex PCB 112, 134 and the apertures 120, 122. Each arc-slot 125 is defined by an arc angle ø and by increasing the arc angle ø, the resonant frequency of the circular patch antenna 100 decreases. Conversely, by decreasing the arc angle ø, the resonant frequency of the circular patch antenna 100 increases. Accordingly, the circular patch antenna 100 may be tuned to a designated frequency without necessarily requiring that the outer diameter of the circular patch antenna 100 be increased (or decreased). The sets of arc-slots 125 may be symmetrical with respect to the centerline 132 of the circular patch antenna 100 to minimize phase variations across frequency and space when the circular patch antenna 100 is driven for circular polarization. Each of the arc-slots 125 may be positioned such that the apertures 120, 122 bisect each of the arc-slots 125. As shown in
As a brief aside, prior patch antennas typically have been manufactured to include a solid top surface to support a metallization process (typically, a sintered silver paste). However, by removing the requirement that the patch antenna have a solid top surface, as shown for the bottom dielectric patch 104, and using regularly spaced vertical walls without a solid top or bottom surface, a dielectric loading for the bottom dielectric patch 104 can be provided that roughly corresponds to the fill ratio of the dielectric to vacuum multiplied by the dielectric constant of the underlying dielectric material. Accordingly, by using these vertical walls, the effective dielectric constant of the bottom dielectric patch 104 is higher than it otherwise would be without these vertical walls. Additionally, by removing mass from the bottom dielectric patch 104, the dielectric loading to mass ratio is also improved. The use of these vertical walls also improves upon the manufacturability of these types of patch antennas when using composite (polymer) materials that are formed using an injection molding process. The reason for this is due to the difficulty of injection molding large flat surfaces, as the product will tend to cool unevenly after the injection molding process, resulting in random areas of sink and an uneven surface. However, by incorporating narrow even-thickness walls in the bottom dielectric patch 104, the potential for material sink due to uneven cooling is minimized, thereby improving product yield during the manufacturing process as compared with an injection molded dielectric with large solid flat surfaces.
Referring now to
As shown in
Referring now to
In some variations, the circular patch antenna 100 may include three (3) or more dielectric patches with an accompanying flex PCB for the circular patch antenna 100 to operate over a wider range of different frequency ranges. In some implementations, a single dielectric patch may be incorporated with an accompanying flex PCB to achieve a specific operating frequency. Such an implementation may be desirable when overall height constraints dictate a lower profile circular patch antenna 100 design. These and other variations would be readily apparent to one of ordinary skill given the contents of the present disclosure.
It will be recognized that while certain aspects of the present disclosure are described in terms of specific design examples, these descriptions are only illustrative of the broader methods of the disclosure and may be modified as required by the particular design. Certain steps may be rendered unnecessary or optional under certain circumstances. Additionally, certain steps or functionality may be added to the disclosed embodiments, or the order of performance of two or more steps permuted. All such variations are considered to be encompassed within the present disclosure described and claimed herein.
While the above detailed description has shown, described, and pointed out novel features of the present disclosure as applied to various embodiments, it will be understood that various omissions, substitutions, and changes in the form and details of the device or process illustrated may be made by those skilled in the art without departing from the principles of the present disclosure. The foregoing description is of the best mode presently contemplated of carrying out the present disclosure. This description is in no way meant to be limiting, but rather should be taken as illustrative of the general principles of the present disclosure. The scope of the present disclosure should be determined with reference to the claims.
This application claims the benefit of priority to U.S. Provisional Patent Application Ser. No. 63/246,663 filed Sep. 21, 2021, of the same title, the contents of which being incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
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7427957 | Zeinolabedin Rafi | Sep 2008 | B2 |
20170033461 | Mohajer Jasebi | Feb 2017 | A1 |
20220352636 | Yetisir | Nov 2022 | A1 |
Number | Date | Country | |
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20230093671 A1 | Mar 2023 | US |
Number | Date | Country | |
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63246663 | Sep 2021 | US |