Claims
- 1. A cleaning wipe which comprises approximately by weight:(a) 20% to 95% of a water insoluble substrate; and (b) 5% to 80% of a cleaning composition which comprises approximately by weight: (i) 0.5% to 12% of a water soluble cellulosic polymer selected from the group consisting of methyl cellulose and hydroxypropyl methyl cellulose and mixtures thereof; and (ii) 15% to 50% of at least one surfactant selected from the group consisting of alkali metal salts of a fatty acid, amine oxide surfactants, alkyl polyglucoside surfactants, zwitterionic surfactants, anionic surfactants and C12-C14 fatty acid monoalkanol amides and mixtures thereof; (iii) 5% to 50% of at least one solubilizing agent; (iv) 0.005% to 3% of a preservative selected from the group consisting of benzalkonium chloride and bezethonium chloride; and the balance being water, wherein said water insoluble substrate is impregnated with said cleaning compositions and wherein said cleaning composition is not an emulsion and does not contain potassium sorbate, a polycarboxylate polymer, polyvinyl alcohol polymer, polyvinylpyrrolidone polymer or methyl vinyl ether polymer.
- 2. A wipe according to claim 1 wherein said cleaning composition further includes 0.1 wt. % to 1.5 wt. % of a perfume.
- 3. A wipe according to claim 1, wherein said water insoluble substrates comprises a top layer bonded to a bottom layer.
- 4. A wipe according to claim 3, wherein said top layer comprises a coarse fiber polypropylene needlepunched and said bottom layer comprises a fine fiber polyester needlepunched.
- 5. A wipe according to claim 1, wherein said water insoluble substrate comprises a top layer, a center layer and a bottom layer, wherein said bottom layer, said center layer and said top layer are bonded together.
- 6. A wipe according to claim 5, wherein said top layer is a coarse fiber polypropylene, said center layer is an absorbent cellulose core and said bottom layer is a fine fiber polyester needlepunched.
- 7. A wipe according to claim 6, wherein said center layer contains at least 50 wt. % said cleaning solution.
RELATED APPLICATION
This application is a continuation in part application of U.S. Ser. No. 10/086,165 filed Feb. 27, 2002 now U.S. Pat. No. 6,432,904 which in turn is a continuation in part application of U.S. Ser. No. 10/008,715 filed Nov. 13, 2001 now U.S. Pat. No. 6,440,925.
US Referenced Citations (4)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
10/086165 |
Feb 2002 |
US |
Child |
10/283496 |
|
US |
Parent |
10/008715 |
Nov 2001 |
US |
Child |
10/086165 |
|
US |