BRIEF DESCRIPTION OF THE DRAWINGS
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
FIG. 1 is an exploded view of a clip assembly in accordance with a preferred embodiment of the present invention, together with a heat sink, a printed circuit board and an electronic package mounted on the printed circuited board;
FIG. 2 is an enlarged exploded view of the clip assembly in FIG. 1;
FIG. 3 is a schematic cutaway view showing the heat sink placed onto the electronic package in position for its subsequent mounting on the printed circuited board by the clip assembly;
FIG. 4 is a schematic cutaway view showing that the heat sink mounted to the printed circuited board by the clip assembly; and
FIG. 5 is an assembled view of FIG. 1.