Claims
- 1. A graphics pipeline system with an integrated clipping operation, comprising:
a transform module positioned on a single semiconductor platform for transforming graphics data; a lighting module positioned on the same single semiconductor platform as the transform module, the lighting module being for performing lighting operations on the graphics data; a set-up module positioned on the same single semiconductor platform as the transform module and the lighting module, the set-up module being for setting up the graphics data; and a rendering module positioned on the same single semiconductor platform as the transform module, the lighting module, and the set-up module, the rendering module being for rendering the graphics data; wherein a clipping operation is performed utilizing the single semiconductor platform.
- 2. The system as recited in claim 1, wherein the clipping operation is performed by a screen edge.
- 3. The system as recited in claim 1, wherein the clipping operation is performed by a near plane.
- 4. The system as recited in claim 1, wherein the clipping operation is performed by a far plane.
- 5. The system as recited in claim 1, wherein the clipping operation includes scissor rectangle-edge clipping.
- 6. The system as recited in claim 1, wherein the rendering module performs the clipping operation.
- 7. The system as recited in claim 1, wherein the rendering includes 3-D rendering.
- 8. The system as recited in claim 1, wherein the single semiconductor platform operates with a Direct3D application program interface.
- 9. The system as recited in claim 1, wherein the single semiconductor platform operates with an OpenGL application program interface.
- 10. The system as recited in claim 1, wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom.
- 11. A method for graphics processing, comprising:
transforming graphics data from a first space to a second space; lighting the graphics data; performing a clipping operation on the graphics data; setting up the graphics data; and rendering the graphics data; wherein the graphics data is set up, transformed, lighted, and rendered, and the clipping operation is performed, on a single semiconductor platform.
- 12. The method as recited in claim 11, wherein the clipping operation is performed by a screen edge.
- 13. The method as recited in claim 11, wherein the clipping operation is performed by a near plane.
- 14. The method as recited in claim 11, wherein the clipping operation is performed by a far plane.
- 15. The method as recited in claim 11, wherein the clipping operation includes scissor rectangle-edge clipping.
- 16. The method as recited in claim 11, wherein the rendering module performs the clipping operation.
- 17. The method as recited in claim 11, wherein the rendering includes 3-D rendering.
- 18. The method as recited in claim 11, wherein the single semiconductor platform operates with a Direct3D application program interface.
- 19. The method as recited in claim 11, wherein the single semiconductor platform operates with an OpenGL application program interface.
- 20. A single-platform graphics pipeline system with an integrated clipping operation, comprising:
a transform module positioned on a single semiconductor platform for transforming graphics data; a lighting module positioned on the same single semiconductor platform as the transform module, the lighting module being for performing lighting operations on the graphics data; a set-up module positioned on the same single semiconductor platform as the transform module and the lighting module, the set-up module being for setting up the graphics data; and a rendering module positioned on the same single semiconductor platform as the transform module, the lighting module, and the set-up module, the rendering module being for 3-D rendering of the graphics data; wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom; wherein a clipping operation is performed utilizing the single semiconductor platform; wherein the single semiconductor platform also operates with an open application program interface.
- 21. The system as recited in claim 20, wherein the clipping operation is performed by a screen edge.
- 22. The system as recited in claim 20, wherein the clipping operation is performed by a near plane.
- 23. The system as recited in claim 20, wherein the clipping operation is performed by a far plane.
- 24. The system as recited in claim 20, wherein the clipping operation includes scissor rectangle-edge clipping.
- 25. A method for graphics processing, comprising:
transforming graphics data from a first space to a second space; lighting the graphics data; performing a clipping operation on the graphics data; setting up the graphics data; and 3-D rendering the graphics data; wherein the graphics data is set up, transformed, lighted, and rendered, and the clipping operation is performed, on a single semiconductor platform; wherein the single semiconductor platform also operates with an open application program interface.
- 26. The method as recited in claim 25, wherein the clipping operation is performed by a screen edge.
- 27. The method as recited in claim 25, wherein the clipping operation is performed by a near plane.
- 28. The method as recited in claim 25, wherein the clipping operation is performed by a far plane.
- 29. The method as recited in claim 25, wherein the clipping operation includes scissor rectangle-edge clipping.
- 30. The method as recited in claim 25, wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom.
- 31. A single-platform graphics pipeline system with an integrated clipping operation, comprising:
a transform module positioned on a single semiconductor platform for transforming graphics data; a lighting module positioned on the same single semiconductor platform as the transform module, the lighting module being for performing lighting operations on the graphics data; a set-up module positioned on the same single semiconductor platform as the transform module and the lighting module, the set-up module being for setting up the graphics data; a rendering module positioned on the same single semiconductor platform as the transform module, the lighting module, and the set-up module, the rendering module being for 3-D rendering of the graphics data; and memory positioned on the same single semiconductor platform as the transform module, the lighting module, the set-up module, and the render module for storing the graphics data; wherein a clipping operation is performed utilizing the single semiconductor platform; wherein the graphics data is blended utilizing the single semiconductor platform for blending triangles represented by vertex data associated with the graphics data; wherein a vertex fog operation is performed on the graphics data utilizing the single semiconductor platform; wherein the single semiconductor platform operates with a Direct3D application program interface; wherein the single semiconductor platform also operates with an OpenGL application program interface; wherein the single semiconductor platform is adapted for coupling to a central processing unit for receiving instructions therefrom.
RELATED APPLICATIONS
[0001] The present application is a continuation of an application filed Sep. 20, 2001 under Ser. No. 09/960,004; which, in turn, is a continuation of an application filed Dec. 5, 2000 under Ser. No. 09/730,652 and issued under U.S. Pat No. 6,342,888; which, in turn, is a continuation of an application filed on Dec. 06, 1999 under Ser. No. 09/454,516 and issued under U.S. Pat. No. 6,198,488. The present application is related to applications filed Sep. 20, 2001 under Ser. Nos. 09/961,228, 09/961,219, and 09/957,746. The present application is further related to applications entitled “Method, Apparatus and Article of Manufacture for Area Rasterization using Sense Points” which was filed on Dec. 06, 1999 under Ser. No. 09/455,305, and attorney docket number NVIDP005, “Method, Apparatus and Article of Manufacture for Boustrophedonic Rasterization” which was filed on Dec. 06, 1999 under Ser. No. 09/454,505, and attorney docket number NVIDP006, “Method, Apparatus and Article of Manufacture for Clip-less Rasterization using Line Equation-based Traversal” which was filed on Dec. 06, 1999 under Ser. No. 09/455,728, and attorney docket number NVIDP007, “Method, Apparatus and Article of Manufacture for a Vertex Attribute Buffer in a Graphics Processor” which was filed on Dec. 06, 1999 under Ser. No. 09/454,525, and attorney docket number NVIDP009, “Method, Apparatus and Article of Manufacture for a Transform Module in a Graphics Processor” which was filed on Dec. 06, 1999 under Ser. No. 09/456,102, and attorney docket number NVIDP010, “Method and Apparatus for a Lighting Module in a Graphics Processor” which was filed on Dec. 06, 1999 under Ser. No. 09/454,524, and attorney docket number NVIDP011, and “Method, Apparatus and Article of Manufacture for a Sequencer in a Transform/Lighting Module Capable of Processing Multiple Independent Execution Threads” which was filed on Dec. 06, 1999 under Ser. No. 09/456,104, and attorney docket number NVIDP012 which were filed concurrently herewith, and which are all incorporated herein by reference in their entirety.
Continuations (3)
|
Number |
Date |
Country |
Parent |
09960004 |
Sep 2001 |
US |
Child |
10186558 |
Jun 2002 |
US |
Parent |
09730652 |
Dec 2000 |
US |
Child |
09960004 |
Sep 2001 |
US |
Parent |
09454516 |
Dec 1999 |
US |
Child |
09730652 |
Dec 2000 |
US |