Claims
- 1. A microelectronic die comprising:a differential clock distribution medium having first and second differential signal lines, said first differential signal line to carry a first differential signal component and said second differential signal line to carry a second differential signal component; a first clock receiver circuit to generate a true clock signal, said first clock receiver circuit having a positive differential clock input and a negative differential clock input, said positive differential clock input coupled to said first differential signal line and said negative differential clock input coupled to said second differential signal line; and a second clock receiver circuit to generate a complement clock signal, said second clock receiver circuit having a positive differential clock input and a negative differential clock input, said positive differential clock input coupled to said second differential signal line and said negative differential clock input coupled to said first differential signal line.
- 2. The microelectronic die of claim 1 wherein:said first and second clock receiver circuits have substantially the same circuit architecture.
- 3. The microelectronic die of claim 1 wherein:said first clock receiver circuit includes a folded cascode differential amplifier.
- 4. The microelectronic die of claim 2 wherein:said second clock receiver circuit includes a folded cascode differential amplifier.
- 5. The microelectronic die of claim 1 wherein:said first and second differential signal components are sinusoidal and said true and complement clock signals are square waves.
- 6. The microelectronic die of claim 2 wherein:said differential clock distribution medium is part of a salphasic clock distribution network.
- 7. The microelectronic die of claim 1 wherein:said microelectronic die is part of a microprocessor unit.
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 09/941,457, filed Aug. 29, 2001, now issued as U.S. Pat. No. 6,614,279, which is incorporated herein by reference.
US Referenced Citations (6)