Not applicable.
Not applicable.
Not applicable.
1. Field of the Invention
Embodiments of the invention are directed to a plasma spray gun, and in particular to water cooling of the plasma spray gun.
2. Discussion of Background Information
It is understood in the art that conventional plasma guns used for thermal spraying suffer from voltage decay over time. As a result of this decay in voltage, gun power levels are reduced, which eventually requires gun hardware, e.g., cathode and anode elements, to be replaced. The voltage decay can be attributed to changes within the bore of the anode as the plasma arc eventually creates discontinuities that serve as charge concentrations for arc attachment. As they develop, the discontinuities attract the arc to attach further upstream in the gun bore, thereby reducing the length of the plasma arc, resulting in a voltage drop.
Thus, designers and engineers seek structural arrangements and/or operational processes in plasma guns that would delay or correct for the aforementioned voltage drop in order to achieve longer hardware life, better coating consistency, and cheaper operating costs.
A known process utilized in conventional plasma guns is the use of guiding cooling water through the plasma gun to prevent the material and mechanical breakdowns that can occur through the exceeding high temperatures created by the plasma gun's operation. Cooling water systems in conventional plasma guns utilize a closed loop heat exchanging system in which a cooling water circuit is formed to guide cooling water to portions of the gun requiring cooling and then to channel the water away from those portions of the gun. In these known implementations, the cooling circuit is set to maintain a constant level of cooling to the gun only, i.e., by presetting the water temperature within a range of 15°-18° C. and a specified flow of the cooling circuit.
Embodiments of the invention are directed to heat exchanging water cooling circuit in a plasma gun that increases hardware and service life of the plasma gun over that attainable through the above-described known cooling water heat exchanger in conventional plasma guns.
Embodiments of the invention are directed to a water cooling system for a plasma gun. The system includes a water cooler structured and arranged to remove heat from cooling water to be supplied to the plasma gun, a controller structured and arranged to monitor a gun voltage of the plasma gun, and at least one flow valve coupled to and under control of the controller to adjust a flow of the cooling water. When the gun voltage drops below a predetermined value, the controller controls the at least one flow valve to increase the gun temperature and the gun voltage.
According to embodiments, the water cooler can include a heat exchanger and the at least one flow valve can be arranged to adjust the cooling water supplied into the heat exchanger. The controller may control the at least one flow valve to increase the temperature of the cooling water.
In accordance with further embodiments of the present invention, a jam box can supply power to the plasma gun via at least two gun cables, so that the jam box is arranged to receive the cooling water from the water cooler and the gun voltage is determined from the voltage between the gun cables.
Moreover, the water cooler can include at least one of a heat exchanger or a refrigerated cooling circuit and the at least one flow valve can be arranged to adjust the cooling water supplied out of the cooler. The controller may control the at least one flow valve to adjust the flow of cooling water from the cooler.
According to still other embodiments, the water cooler may include a heat exchanger and the at least one flow valve can include a first valve arranged to adjust the cooling water supplied to the heat exchanger and a second valve arranged to adjust the cooling water supplied out of the heat exchanger. The controller can control the first valve to increase the temperature of the cooling water and controls the second valve to decrease the flow of cooling water from the cooler.
In accordance with still other embodiments, the controller can control the flow valve to at least one of increase the temperature of the cooling water and to decrease the flow of cooling water.
Embodiments of the instant invention are directed to a method for cooling a plasma gun. The method includes monitoring a gun voltage of the plasma gun and when the gun voltage decreases to a predetermined value, adjusting a cooling water flow to increase a gun temperature.
According to embodiments, a heat exchanger can be arranged to remove heat from the cooling water, and the method may further include adjusting the cooling water flow supplied into the heat exchanger. Because of the reduced cooling water flow, the heat exchanger increases the temperature of the cooling water.
In accordance with other embodiments of the invention, a jam box can be arranged to supply power to the plasma gun via at least two gun cables, and the method may further include determining the gun voltage from a voltage between the gun cables.
According to still other embodiments, a water cooler can include at least one of a heat exchanger and a refrigerated cooling circuit arranged to remove heat from the cooling water, and the method can further include adjusting the flow of the cooling water supplied out of the cooler.
Moreover, a heat exchanger can be arranged to remove heat from the cooling water, the method can further include adjusting the cooling water supplied to the heat exchanger and adjusting the cooling water supplied out of the heat exchanger. The adjusting of the cooling water supplied to the heat exchanger may increase the temperature of the cooling water and the adjusting of the cooling water supplied out of the heat exchanger may decrease the flow of cooling water from the cooler.
In accordance with other embodiments, the adjusting of the cooling water flow can result in at least one of increasing the temperature of the cooling water and decreasing the flow of cooling water.
According to still other embodiments of invention, the increased gun temperature may increase a gun voltage.
Embodiments of the invention include a method for increasing service life of a plasma gun. The method includes monitoring a gun voltage of the plasma gun, and adjusting a cooling water flow to increase a gun voltage of the plasma gun.
In accordance with still yet other embodiments of the present invention, the adjusting of the cooling water can increase a gun temperature.
Other exemplary embodiments and advantages of the present invention may be ascertained by reviewing the present disclosure and the accompanying drawing.
The present invention is further described in the detailed description which follows, in reference to the noted plurality of drawings by way of non-limiting examples of exemplary embodiments of the present invention, in which like reference numerals represent similar parts throughout the several views of the drawings, and wherein:
The particulars shown herein are by way of example and for purposes of illustrative discussion of the embodiments of the present invention only and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the present invention. In this regard, no attempt is made to show structural details of the present invention in more detail than is necessary for the fundamental understanding of the present invention, the description taken with the drawings making apparent to those skilled in the art how the several forms of the present invention may be embodied in practice.
The inventors observed that the apparent temperature of the anode bore surface affects the attachment of the plasma arc to the bore. In particular, the inventors found that, as the temperature of the gun bore surface of a conventional plasma gun increases, the plasma arc tends to attach further downstream in the gun bore as there is less of an energy barrier at the boundary layer at the bore walls. Thus, as they discovered that the arc length increases with increasing temperature, the inventors found that the operational voltage of the plasma gun is related to the anode temperature.
In view of the foregoing findings, embodiments of the invention include adding a control loop to the cold water circuit to control the gun temperature in order to effect a regulation of the gun voltage. As shown in
In embodiments, as the gun voltage drops during normal use, the control loop can adjust the inlet water temperature to increase the gun temperature. In particular, proportional valve 8 can be closed to increase the water temperature. Thus, when controller 7 determines that the gun voltage (across gun cables 4 and 6) is decreasing, controller 7 controls proportional valve 8 to reduce the flow of cooling water into heat exchanger 9, thereby increasing the water temperature of the cooling water. This increased temperature cooling water is then supplied to jam box 3, which serves as a point where electrical and water are joined to the gun and monitored. The cooling water is then supplied to plasma gun 2, whereby the temperature of plasma gun 2 increases to correspondingly increase the plasma gun voltage (see
While the manner in which cooling water flows through the plasma gun differs depending upon the specific plasma gun design, the embodiments of the invention are applicable to all water cooled plasma guns. By way of non-limiting example,
In further embodiments, the inlet and water temperature to/from the plasma gun may also be monitored to ensure that allowable limits for the gun cooling are maintained to prevent the control loop from reaching thermal conditions that could result in gun damage.
In an alternate embodiment illustrated in
While this alternate embodiment reducing the water flow also reduces the water pressure inside the gun, the boiling point of the water inside the plasma gun is also reduced. However, this embodiment has the advantage that the motor for the water pump driving the gun cooling circuit can be directly closed loop and as such the method is easily implemented for existing systems.
In still another embodiment, the above-noted embodiments can be combined so as to adjust the cooling water flow and to adjust the cooling water temperature to the gun. In this embodiment, a variable restriction is added to the outlet of the gun water circuit to maintain gun water pressure to avoid the issue of water boiling temperature. This pressure control would operate as a separate closed loop. By adjusting both the flow and temperature the maximum affect on gun voltage can be realized.
Other variations are possible to control the amount of gun cooling including but not limited to bypass circuits, resetting thermal controls on chillers to higher temperatures, etc.
It is noted that the foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present invention. While the present invention has been described with reference to an exemplary embodiment, it is understood that the words which have been used herein are words of description and illustration, rather than words of limitation. Changes may be made, within the purview of the appended claims, as presently stated and as amended, without departing from the scope and spirit of the present invention in its aspects. Although the present invention has been described herein with reference to particular means, materials and embodiments, the present invention is not intended to be limited to the particulars disclosed herein; rather, the present invention extends to all functionally equivalent structures, methods and uses, such as are within the scope of the appended claims.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2012/022897 | 1/27/2012 | WO | 00 | 5/30/2014 |
Publishing Document | Publishing Date | Country | Kind |
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WO2013/112177 | 8/1/2013 | WO | A |
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English translation of Japan Office Action conducted in counterpart Japan Appln. No. 2014-554701 (Jun. 10, 2016). |
First Japan Office Action conducted in counterpart Japan Appln. No. 2014-554701 (Oct. 28, 2015) (w/ English language translation). |
Number | Date | Country | |
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20140332177 A1 | Nov 2014 | US |