CMP CONDITIONING DISK, AND METHOD AND DEVICE FOR MANUFACTURING CMP CONDITIONING DISK

TECHNICAL FIELD

The present disclosure relates to a CMP conditioning disk, and a device and method for manufacturing the CMP conditioning disk.

BACKGROUND ART

In general, the planarization process using chemical mechanical planarization (CMP) is a process in which a carrier holds a wafer to be polished, and a platen and the carrier are moved relative to each other to perform the polishing process while slurry is fed onto a polishing pad of the platen.

Numerous foam pores on the surface of the polishing pad serve to contain new polishing liquid, ensuring consistent polishing efficiency and polishing uniformity over the entire wafer. However, due to the applied pressure and relative speed during polishing, the surface of the polishing pad becomes unevenly deformed over time, and the pores on the polishing pad become clogged with polishing residues, making the polishing pad unable to function properly.

To address uneven deformation of the polishing pad and clogging of pores, a CMP pad conditioner is used. The CMP pad conditioner finely polishes the surface of the polishing pad, allowing new micro pores to form on the polishing pad. In a conventional diamond setting process for adjusting the diamond orientation of a CMP pad conditioner, a diamond is passed through a hole of a predetermined size (e.g., 250 μm) formed in an etched mask substrate, and the diamond is seated on a disk by an adhesive sprayed on a metal powder layer (MLP) on a shank.

However, since there is no control over the orientation of the diamond, there is a problem that the diamond is fixed to the surface of the final disk in a random orientation on the disk.

Prior Art Document

(Patent Document) Korean Patent Application Publication No. 10-2012-0058303

DETAILED DESCRIPTION OF INVENTION
Technical Problems

Embodiments of the present disclosure provide a CMP conditioning disk with improved wear resistance and high grinding performance, and a device and method for manufacturing the CMP conditioning disk.

Technical Solution

In accordance with an aspect of the present disclosure, there is provided a CMP conditioning disk manufacturing device including: a diamond jig providing a jig pocket in which a diamond is seated; a suction unit configured to selectively apply suction force to the jig pocket; and a moving unit that fixes the diamond seated in the jig pocket to a shank base.

Further, the CMP conditioning disk manufacturing device may further include a vibration unit that vibrates the diamond jig to guide the diamond to the jig pocket when the suction unit applies suction force to the jig pocket.

Further, the moving unit may include: a jig rotating unit that turns over the diamond jig so that the diamond faces downward; and a jig moving unit that moves the diamond jig away from or closer to the shank base.

Further, the jig pocket may include: a jig groove portion with an upper edge for supporting at least a lower portion of the diamond; and a jig channel formed on a lower side of the jig groove portion so that the suction force is transmitted to the jig groove portion.

Further, the jig pocket may be provided in plurality, and the jig groove portion may include: a first symmetrical inclined surface extending in one direction from a lowermost end toward a surface of the diamond jig; and a second symmetrical inclined surface extending in another direction from the lowermost end of the jig groove portion toward the surface of the diamond jig to be symmetrical to the first symmetrical inclined surface with respect to an imaginary line extending in a direction perpendicular to a surface of the jig pocket.

Further, the jig pocket may be provided in plurality, and the jig groove portion may include: a first asymmetrical inclined surface extending in one direction from a lowermost end toward a surface of the diamond jig; and a second asymmetrical inclined surface extending in another direction from the lowermost end of the jig groove portion toward the surface of the diamond jig to be asymmetrical with the first asymmetrical inclined surface with respect to an imaginary line extending in a direction perpendicular to the surface of the jig pocket.

Further, the plurality of the jig groove portions may be oriented along a predetermined pattern or a predetermined direction.

Further, the jig channel may be provided in plurality, and ends of the plurality of jig channels may communicate with the jig groove portion, and the ends of the jig channels may be arranged at different heights.

Further, the CMP conditioning disk manufacturing device may further include a detection sensor for measuring an internal pressure of the jig pocket when the suction force is applied to the jig pocket; and a controller for controlling the vibration unit to increase vibration intensity of the vibration unit when the measured internal pressure is maintained lower than a preset reference pressure for a preset reference time.

In accordance with another aspect of the present disclosure, there is provided a CMP conditioning disk manufacturing method including: a jig preparation step of preparing a diamond jig with a jig pocket; a diamond providing step of providing at least one diamond to a surface of the diamond jig; a jig fixing step of temporarily fixing the diamond in the jig pocket of the diamond jig; a bonding layer forming step of forming a bonding layer on a surface of a shank base; a diamond fixing step of fixing the diamond to the bonding layer of the shank base; and a jig separation step of separating the diamond from the diamond jig.

Further, in the jig fixing step, suction force may be applied to the jig pocket to temporarily fix the diamond to the jig pocket.

Further, in the jig fixing step, the diamond jig may be vibrated to guide the diamond to the jig pocket when the suction force is applied to the jig pocket.

Further, in the jig fixing step, an internal pressure of the jig pocket may be measured when the suction force is applied to the jig pocket, and the application of the suction force may be stopped when the measured internal pressure reaches a preset reference pressure.

Further, in the diamond fixing step, the diamond jig may be turned over so that the diamond faces downward and the turned-over diamond jig is moved toward the bonding layer to fix the diamond to the bonding layer of the shank base.

A CMP conditioning disk according to still another aspect of the present disclosure may be manufactured by the CMP conditioning disk manufacturing device described above or the CMP conditioning disk manufacturing method described above.

Effect of Invention

According to the embodiment of the present disclosure, the diamond can be disposed by adjusting the orientation of the diamond an arbitrary angle using the diamond jig with the jig pocket, so that when the diamond is fused to the shank base, the diamond can be positioned on the shank base in an orientation desired by an operator, which results in a high pad cut rate (PCR).

In addition, according to the embodiment of the present disclosure, by forming the shape and orientation of the jig pocket in which the diamond is seated in various ways, the various diamond orientations can be determined, and each jig pocket can be formed in various diamond orientation in accordance with the shape/characteristics of the diamond, etc., so that various pad polishing characteristics (PCR) can be implemented according to the shape/characteristics of the diamond, etc.

Further, the embodiments of the present disclosure have the advantage of improving wear resistance and enhancing grinding performance for a polishing pad by arranging the diamonds to have directionality in an orientation on the shank base.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a diamond jig of a CMP conditioning disk manufacturing device according to one embodiment of the present disclosure.

FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1.

FIG. 3 is a plan view of FIG. 2 as viewed from above.

FIG. 4 is a state diagram showing a state in which a diamond is seated in a jig pocket of FIG. 2.

FIG. 5 is a cross-sectional view taken along line II-II of FIG. 1 according to a modified example of the present disclosure.

FIG. 6 is a state diagram showing a state in which a different type of diamond is seated in a jig pocket of FIG. 5.

FIG. 7 is a block diagram showing a control flow of the CMP conditioning disk manufacturing device according to one embodiment of the present disclosure.

FIG. 8 is a state diagram showing a state before turnover of the diamond jig of the CMP conditioning disk manufacturing device according to one embodiment of the present disclosure.

FIG. 9 is a state diagram showing a state after turnover of the diamond jig of the CMP conditioning disk manufacturing device according to one embodiment of the present disclosure.

FIG. 10 is a state diagram showing a state in which the diamond jig of the CMP conditioning disk manufacturing device is turned over and moved to a shank base to apply pressure, according to one embodiment of the present disclosure.

FIG. 11 is a state diagram showing a state in which the diamond jig of the CMP conditioning disk manufacturing device is separated from the shank base, according to one embodiment of the present disclosure.

FIG. 12 is a cross-sectional view showing a diamond jig of a CMP conditioning disk manufacturing device according to another embodiment of the present disclosure.

FIG. 13 is a state diagram showing a state before turnover of the diamond jig of the CMP conditioning disk manufacturing device according to another embodiment of the present disclosure.

FIG. 14 is a state diagram showing a state after turnover of the diamond jig of the CMP conditioning disk manufacturing device according to another embodiment of the present disclosure.

FIG. 15 is a state diagram showing a state in which the diamond jig of the CMP conditioning disk manufacturing device is turned over and moved to the shank base and pressurized according to another embodiment of the present disclosure.

FIG. 16 is a state diagram showing a state in which the diamond jig of the CMP conditioning disk manufacturing device is separated from the shank base according to another embodiment of the present disclosure.

FIG. 17 is a block diagram showing a method for manufacturing a CMP conditioning disk according to the present disclosure.

FIG. 18 is a graph showing pad polishing characteristics (PCR) for the CMP conditioning disk according to the present disclosure.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a preferred embodiment of the present disclosure for implementing the spirit of the present disclosure will be described in more detail with reference to the accompanying drawings.

In describing the embodiments of the present disclosure, the detailed descriptions of well-known functions or configurations will be omitted if it is determined that the detailed descriptions of well-known functions or configurations may make obscure the spirit of the present disclosure.

Further, when an element is referred to as being ‘connected’ to, ‘supported’ by, ‘accessed’ to, ‘supplied’ to, ‘transferred’ to, or ‘contacted’ with another element, it should be understood that the element may be directly connected to, supported by, accessed to, supplied to, transferred to, or contacted with another element, but that other elements may exist in the middle.

The terms used in the present disclosure are only used for describing specific embodiments, and are not intended to limit the present disclosure. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Further, in the present disclosure, it is to be noted that expressions, such as the upper side, the lower side, and the side surface are described based on the illustration of drawings, but may be modified if directions of corresponding objects are changed. For the same reasons, some components are exaggerated, omitted, or schematically illustrated in the accompanying drawings, and the size of each component does not fully reflect the actual size.

Further, terms including ordinal numbers, such as first and second, may be used for describing various elements, but the corresponding elements are not limited by these terms. These terms are only used for the purpose of distinguishing one element from another element.

In the present specification, it is to be understood that the terms such as “including” are intended to indicate the existence of the certain features, areas, integers, steps, actions, elements and/or combinations thereof disclosed in the specification, and are not intended to preclude the possibility that one or more other certain features, areas, integers, steps, actions, elements and/or combinations thereof may exist or may be added.

Hereinafter, with reference to the drawings, the specific configuration of a CMP conditioning disk, and a device and method for manufacturing the CMP conditioning disk manufacturing device according to the present disclosure will be described.

Referring to FIGS. 1 to 7, a CMP conditioning disk manufacturing device 10 according to one embodiment of the present disclosure can manufacture a CMP conditioning disk 30 in which the orientation of a diamond 31 is adjusted. The CMP conditioning disk manufacturing device 10 may include a diamond jig 100, a suction unit 200, a moving unit 300, a vibration unit 400, a detection sensor 500, and a controller 600.

Specifically, the diamond jig 100 may be a jig for adjusting the orientation of the diamond 31. The diamond 31 may be directionally seated on the diamond jig 100. When the diamond 31 is seated, the diamond jig 100 may arrange the diamond 31 in an orientation desired by an operator. The diamond jig 100 may include a jig body 110 and a jig pocket 120.

The jig body 110 may be a disk/cylinder shaped jig that can stably support the diamond jig 100 when the diamond 31 is seated on it. The jig body 110 may be made of a flexible material. When the diamond 31 is seated on the jig body 110, the jig body 110 made of a flexible material can minimize the gap between the diamond 31 and the jig body 110.

The jig pocket 120 may provide a space that allows the diamond 31 to be arranged to have directionality. The jig pocket 120 may be a groove formed on a surface of the jig body 110. The jig pocket 120 may be provided in a pocket shape that can accommodate at least a portion of the diamond 31. The jig pocket 120) may also be provided as a pocket shape corresponding to at least a portion of the diamond 31 accommodated therein.

A plurality of jig pockets 120 may be provided on the surface of the jig body 110 to be spaced apart in one direction. The plurality of jig pockets 120 may be spaced apart to form a pattern of a certain shape on the surface of the jig body 110. Each jig pocket 120 may include a jig groove portion 121 and a jig channel 122.

The jig groove portion 121 may support at least a lower portion of the diamond 31. For example, when the diamond 31 is seated in the jig pocket 120, an upper edge of the jig groove portion 121 may support an edge of the lower portion of the diamond 31. The jig groove portion 121 may be formed with a symmetrical shape based on the lowermost groove with respect to a direction perpendicular to the surface of the jig body 110. The jig groove portion 121 may include a first symmetrical inclined surface 121-11 and a second symmetrical inclined surface 121-12. The first symmetrical inclined surface 121-11 may be a slope surface that extends in one direction from the lowermost groove toward the surface of the diamond jig 100. The second symmetrical inclined surface 121-12 may be a slope surface that extends in a different direction from the lowest groove toward the surface of the diamond jig 100. The first symmetrical inclined surface 121-11 and the second symmetrical inclined surface 121-12 may be symmetrical to each other based on the lowermost groove with respect to the direction perpendicular to the surface of the jig body 110.

The jig groove portion 121 may vary the orientation of the diamond 31 in various ways depending on its shape. In the present embodiment, when viewed in longitudinal section through the center of the jig pocket 120, the longitudinal-sectional shape of the jig groove portion 121 may be a triangular shape corresponding to the lower longitudinal-sectional shape of the diamond 31, but is not limited thereto. Depending on the shape/characteristics of the diamond 31 seated on the diamond jig 100, the longitudinal-sectional shape of the jig groove portion 121 may be formed in various shapes other than the triangular shape. For example, the longitudinal-sectional shape of the jig groove portion 121 may be a square shape.

The jig channel 122 may provide a passage that allows the jig groove portion 121 and the suction unit 200 to communicate with each other. When the diamond 31 is seated in the jig pocket 120, suction force from the suction unit 200 may be transmitted to the jig groove portion 121 through the jig channel 122. The jig channel 122 may be smaller than the size of the diamond 31 and the size of the jig groove portion 121. For example, when the size of the diamond 31 is 150 to 200 micrometers, the diameter of the jig channel 122 may be 50 micrometers or less. The jig channel 122 may be formed into the jig body through an etching process.

The jig channel 122 may be formed in plurality on the lower side of the jig groove portion 121. The jig channel 122 may be provided in at least one or more positions corresponding to the lower edges of the diamond 31. For example, the jig channel 122 may include a first channel 122-1, a second channel 122-2, and a third channel 122-3. The first channel 122-1 may be a single passage that is connected to the lowermost groove of the jig groove portion 121 to communicate therewith. The second channel 122-2 may be a plurality of passages that are connected to the edges of the jig groove portion 121 to communicate therewith. The third channel 122-3 may be a plurality of passages that are connected to the bottom surface of the jig groove portion 121 to communicate therewith (see FIG. 6).

The suction unit 200 may selectively apply suction force to the jig pocket 120. For example, the suction unit 200 may be a negative pressure device capable of applying suction force. When the diamond 31 is seated in the jig pocket 120 of the diamond jig 100, the suction unit 200 may apply suction force to the jig pocket 120 to secure the diamond 31 seated in the jig pocket 120. The suction unit 200 may stop applying suction force to the jig pocket 120, thereby allowing the diamond 31 seated in the jig pocket 120 to be separated from the jig pocket 120. The operation of the suction unit 200 may be controlled by the controller 600.

The moving unit 300 may rotate or move the diamond jig 100. The moving unit 300 may position the diamond 31 downward by rotating the diamond jig 100 on which the diamond 31 is seated upside down. By moving downward the diamond jig 100 on which the diamond 31 is positioned downward, the diamond 31 seated in the jig pocket 120 can be secured to the shank base 32. The moving unit 300 may include a jig rotating unit 310 and a jig moving unit 320.

The jig rotating unit 310 may provide a rotational force to the diamond jig 100 to turn it over. When the diamond 31 is seated in the jig pocket 120 of the diamond jig 100, the jig rotating unit 310 may turn over the diamond jig 100 by rotating the diamond jig 100 by 180 degrees so that the diamond 31 faces downward. The jig rotating unit 310 may be a motor that is drivingly connected to the diamond jig 100 to rotate the diamond jig 100.

The jig moving unit 320 may provide a moving force to the diamond jig 100 to move the diamond jig 100 toward the shank base 32. The jig moving unit 320 may move the diamond jig 100 away from or toward the shank base 32. For example, when the diamond jig 100 is turned over so that the diamond 31 faces downward, the jig moving unit 320 may move the diamond jig 100 toward the shank base 32, pressing the diamond 31 of the diamond jig 100 against the surface of the shank base 32. The jig moving unit 320 may be an actuator that is drivingly connected to the diamond jig 100 to move the diamond jig 100.

The vibration unit 400 may provide a driving force for vibrating the diamond jig 100. For example, the vibration unit 400 may be a vibrator capable of providing a driving force for repeatedly moving the diamond jig 100 in a left-right direction. When the vibration unit 400 vibrates the diamond jig 100, the diamond 31 can freely move up, down, left, and right on the surface of the diamond jig 100, and when suction force is applied to the jig pocket 120, the diamond 31 can be moved into and seated in the jig pocket 120. The vibration unit 400 may be disposed at a lower side of the diamond jig 100. The operation of the vibration unit 400 may be controlled by the controller 600.

The detection sensor 500 may be a sensor capable of measuring an internal pressure of the jig pocket 120. When suction force is applied to the jig pocket 120, the detection sensor 500 may measure the internal pressure of the jig pocket 120. Information about the internal pressure measured by the detection sensor 500 may be transmitted to the controller 600.

The controller 600 may control the operations of the suction unit 200, the moving unit 300, and the vibration unit 400 based on the information obtained from the detection sensor 500. The controller 600 may control the operation of the suction unit 200 according to the internal pressure of the jig pocket 120 measured by the detection sensor 500.

For example, if the internal pressure measured by the detection sensor 500 remains lower than a preset reference pressure for a predetermined reference time, the controller 600 may control the operation of the vibration unit 400 so that the vibration intensity increases. In other words, when the diamond 31 is not seated in the jig pocket 120 within the reference time, the controller 600 may increase the vibration intensity of the vibration unit 400 to promptly seat the diamond 31 in the jig pocket 120.

In addition, if the internal pressure measured by the detection sensor 500 remains lower than the preset reference pressure for the predetermined reference time, the controller 600 may control the operation of the suction unit 200 to increase the suction force. In other words, when the diamond 31 is not seated in the jig pocket 120 within the reference time due to insufficient suction force, the controller 600 may increase the suction force of the suction unit 200 to promptly seat the diamond 31 in the jig pocket 120.

Hereinafter, the operational effects of the CMP conditioning disk manufacturing device according to one embodiment of the present disclosure will be described.

Referring to FIG. 8, in a state where the diamond jig 100 with the jig pockets 120 is prepared, at least one or more diamonds 31 may be provided and dispersed on the surface of the diamond jig 100. When the diamonds 31 are provided on the surface of the diamond jig 100, if the suction force of the suction unit 200 is applied to the jig pockets 120, the diamonds 31 located in the jig pockets 120 of the diamond jig 100 can be temporarily fixed to the diamond jig 100.

When suction force is applied to the jig pockets 120 by the suction unit 200, the diamond jig 100 can be vibrated by the vibration unit. When the diamond jig 100 is vibrated, the diamonds 31 provided to the surface of the diamond jig 100 can be effectively guided to the positions at which the jig pockets 120 of the diamond jig 100 are located. A bonding layer B may be formed on the surface of the shank base 32. The bonding layer B may be an adhesive material for fusion between the diamonds 31 and the shank base 32. The bonding layer B may include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1.

Referring to FIG. 9, once the diamonds 31 are temporarily fixed to the diamond jig 100, by rotating the diamond jig 100 to turn over the diamond jig 100 so that the diamonds 31 face downward, and by moving the turned-over diamond jig 100 toward the bonding layer B, the turned-over diamonds 31 can be fixed to the bonding layer B of the shank base 32.

Referring to FIG. 10, when the diamonds 31 are fixed to the bonding layer B of the shank base 32, the diamonds 31 can be firmly fixed to the bonding layer B of the shank base 32 by being pressed by the diamond jig 100. As the turned-over diamond jig 100 is moved toward and pressed against the bonding layer B, the diamonds 31 can be semi-fixed to the adhesive layer B2 of the bonding layer B, and as the diamond jig 100 is pressed more strongly against the bonding layer B, the diamonds 31 can be pushed to the metal powder layer B1 of the bonding layer B and be securely fixed in place.

Referring to FIG. 11, the diamond jig 100 can be separated from the diamonds 31. In order to separate the diamond jig 100, the suction force applied to the jig pockets 120 of the diamond jig 100 may be stopped. When the application of the suction force is stopped, the diamonds 31 fixed to the diamond jig 100 by the suction force can be separated from the diamond jig 100. Once the diamond jig 100 is separated from the diamonds 31, the diamond jig 100 is moved upward, so that the CMP conditioning disk 30 in which the diamonds 31 are arranged in a symmetrical pattern can be completely manufactured through fusion heat treatment.

Meanwhile, in addition to such configurations, a CMP conditioning disk manufacturing device 10 according to another embodiment of the present disclosure may be provided. Hereinafter, another embodiment of the present disclosure will be described with reference to FIGS. 12 to 16. In describing another embodiment, compared to the above-described embodiment, there are differences in the configuration of a movement restriction unit, so the following description will focus on the differences, and the same description and reference numerals will be used as before.

Referring to FIG. 12, the diamond jig 100 may include jig pockets 120 having an asymmetrical shape when viewed in longitudinal section through the center of the jig pocket 120. The asymmetrical jig pockets 120 may be arranged in one direction on the surface of the diamond jig 100 in consideration of the rotation direction (clockwise or counterclockwise) in which the CMP conditioning disk 30 rotates. The jig pocket 120 may include a jig groove portion 121 having a first asymmetrical inclined surface 121-21 and a second asymmetrical inclined surface 121-22.

The first asymmetrical inclined surface 121-21 may be a slope surface that extends in one direction from the lowermost groove toward the surface of the diamond jig 100. The first asymmetrical inclined surface 121-21 may be extended in one direction from the lowermost groove toward the surface of the diamond jig 100. The second asymmetrical inclined surface 121-22 may be a slope surface that extends in a different direction from the lowermost groove toward the surface of the diamond jig 100. The second asymmetrical inclined surface 121-22 may be extended in the different direction from the lowermost groove toward the surface of the diamond jig 100. The first asymmetrical inclined surface 121-21 and the second asymmetrical inclined surface 121-22 may be asymmetrical to each other based on the lowermost groove with respect to a direction perpendicular to the surface of the jig pocket 120.

Hereinafter, the operational effects of the CMP conditioning disk manufacturing device according to another embodiment of the present disclosure will be described.

Referring to FIG. 13, in a state where the diamond jig 100 with the asymmetrical jig pockets 120 is prepared, at least one or more diamonds 31 may be provided and dispersed on the surface of the diamond jig 100. When the diamonds 31 are provided on the surface of the diamond jig 100, if the suction force of the suction unit 200 is applied to the jig pockets 120, the diamonds 31 located in the jig pockets 120 of the diamond jig 100 can be temporarily fixed to the diamond jig 100.

Referring to FIG. 14, once the diamonds 31 are temporarily fixed to the diamond jig 100, by rotating the diamond jig 100 to turn over the diamond jig 100 so that the diamonds 31 face downward, and by moving the turned-over diamond jig 100 toward the bonding layer B, the turned-over diamonds 31 can be fixed to the bonding layer B of the shank base 32.

Referring to FIG. 15, when the diamonds 31 are fixed to the bonding layer B of the shank base 32, the diamonds 31 can be firmly fixed to the bonding layer B of the shank base 32 by being pressed by the diamond jig 100. As the turned-over diamond jig 100 is moved toward and pressed against the bonding layer B, the diamonds 31 can be semi-fixed to the adhesive layer B2 of the bonding layer B, and as the diamond jig 100 is pressed more strongly against the bonding layer B, the diamonds 31 can be pushed to the metal powder layer B1 of the bonding layer B and be securely fixed in place.

Referring to FIG. 16, the diamond jig 100 can be separated from the diamonds 31. In order to separate the diamond jig 100, the suction force applied to the jig pockets 120 of the diamond jig 100 may be stopped. When the application of the suction force is stopped, the diamonds 31 fixed to the diamond jig 100 by the suction force can be separated from the diamond jig 100. Once the diamond jig 100 is separated from the diamonds 31, the diamond jig 100 is moved upward, so that the CMP conditioning disk 30 in which the diamonds 31 are arranged in an asymmetrical pattern facing one direction can be completely manufactured through fusion heat treatment.

Hereinafter, a CMP conditioning disk manufacturing method according to the present disclosure will be described.

Referring to FIGS. 17 and 18, a CMP conditioning disk manufacturing method according to one embodiment of the present disclosure may include a jig preparation step (S100), a diamond providing step (S200), a jig fixing step (S300), a bonding layer forming step (S400), a diamond fixing step (S500), and a jig separation step (S600). After the jig separation step (S600), a heat treatment (fusion) process may be performed on the CMP conditioning disk. Since the heat treatment process corresponds to a typical heat treatment process for a conditioning disk, a detailed description thereof will be omitted.

In the jig preparation step (S100), a diamond jig 100 with a jig pocket 120 may be prepared. A plurality of jig pockets 120 spaced apart in one direction may be formed on the surface of the diamond jig 100, and a suction unit for applying suction force may be connected to the jig pocket 120.

In the diamond providing step (S200), at least one or more diamonds 31 may be provided on the surface of the prepared diamond jig 100. At least one or more diamonds 31 may be provided and dispersed on the surface of the diamond jig 100.

In the jig fixing step (S300), suction force is applied to the jig pockets 120 by the suction unit 200, so that the diamonds 31 provided on the surface of the diamond jig 100 can be guided to and seated in the jig pocket 120 of the diamond jig 100. The diamonds 31 provided on the surface of the diamond jig 100 can be temporarily fixed to the jig pocket 120 by the suction force of the suction unit 200.

In the jig fixing step (S300), when suction force is applied to the jig pockets 120 by the suction unit 200, the diamond jig 100 may be vibrated by the vibration unit. The diamonds 31 provided on the surface of the diamond jig 100 can be more easily guided to the jig pocket 120 by the vibration of the diamond jig 100. Any diamonds 31 that are not seated in the jig pockets 120 even by the vibration of the diamond jig 100 may be removed from the surface of the diamond jig 100.

In the jig fixing step (S300), when suction force is applied to the jig pockets 120 by the suction unit 200, an internal pressure of the jig pocket 120 may be measured by the detection sensor 500. If the internal pressure measured by the detection sensor 500 is lower than a preset reference pressure, the suction force may be increased to more strongly guide the diamonds 31 to the jig pockets 120 to be seated therein.

In the bonding layer forming step (S400), a bonding layer B may be formed on the surface of the shank base 32. The bonding layer B may be an adhesive material for fusion between the diamonds 31 and the shank base 32. The bonding layer B may include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1.

In the diamond fixing step (S500), the diamonds 31 may be fixed to the bonding layer B of the shank base 32. In the diamond fixing step (S500), the diamond jig 100 may be rotated to turn over the diamond jig 100 so that the diamonds 31 face downward, and by moving the turned-over diamond jig 100 toward the bonding layer B, the turned-over diamonds 31 can be fixed to the bonding layer B of the shank base 32. When the diamonds 31 are fixed to the bonding layer B of the shank base 32, the diamonds 31 can be firmly fixed to the bonding layer B of the shank base 32 by being pressed by the diamond jig 100.

In the jig separation step (S600), the diamond jig 100 may be separated from the diamonds 31. For separation of the diamond jig 100, the suction unit 200 can stop applying suction force. When the application of suction force is stopped, the diamonds 31 fixed to the diamond jig 100 by the suction force can be separated from the diamond jig 100. Once the diamond jig 100 is separated from the diamonds 31, the diamond jig 100 may be moved upward.

The diamonds 31 fixed to the bonding layer B of the shank base 32 may be subjected to a heat treatment (fusion) process to complete the manufacturing of the CMP conditioning disk 30. For example, after the jig separation step (S600), the prepared shank base 32 goes through the fusion step, and the diamonds 31 are finally fixed to the shank base 32. In this case, the orientation of the diamonds 31 is maintained as it is before fusion by optimizing the thickness of the metal powder layer (MPL) mentioned previously.

Meanwhile, the CMP conditioning disk 30 manufactured by the CMP conditioning disk manufacturing device 10 or the CMP conditioning disk manufacturing method 20 described above can finely polish the surface of a polishing pad. The CMP conditioning disk 30 may include a shank base 32 and diamonds 31 fused to the shank base 32.

Specifically, the shank base 32 may be a backing plate of the disk. A bonding layer B may be formed on the surface of the shank base 32. The bonding layer B may be an adhesive material for fusion between the diamonds 31 and the shank base 32. The bonding layer B may include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1. The metal powder layer B1 may be applied to the surface of the shank base 32 and then formed into a solid phase pre-sintered body through a drying and pre-sintering process. The adhesive layer B2 may be an adhesive layer applied to the surface of the metal powder layer B1 to temporarily attach the diamonds. The diamonds 31 may be adhered to and fixed on the metal powder layer B1 to which the adhesive layer B2 is applied. The shank base 32 corresponds to the conventional shank base 32 applied to the CMP conditioning disk 30, so a detailed description thereof will be omitted.

The diamonds 31 may be applied to the CMP conditioning disk 30 manufactured by the CMP conditioning disk manufacturing device 10 or the CMP conditioning disk manufacturing method 20 described above. At least some of the diamonds 31 according to another embodiment of the present disclosure may be disposed on the bonding layer B in a posture in which the uppermost surface meeting a major axis stands upright downward from the top of the major axis. At least some of the diamonds 31 according to another embodiment of the present disclosure may be disposed on the bonding layer B in a posture in which the uppermost surface meeting the major axis tilts downward from the top of the major axis.

In the present embodiment, an imaginary line connecting two vertices that are furthest apart from each other while facing each other, among a plurality of vertices of the diamond 31, may be defined as an ‘axis’, and the longest axis among these axes may be defined as a ‘major axis’. In addition, a ‘vertex’ may be defined as the point where adjacent edges meet.

As described above, according to the present disclosure, the diamond orientation can be adjusted and positioned at any angle through the diamond jig with the jig pockets, so that when the diamonds are fused to the shank base, the diamonds can be positioned on the shank base in a certain orientation desired by an operator, resulting in enhanced pad polishing characteristics. Further, the diamond orientation can be determined in various ways by forming the shape and orientation of the jig pocket in which the diamond is seated, and each jig pocket can be formed in various diamond orientations according to the shape/characteristics of the diamond, and therefore various pad polishing characteristics (PCR) can be implemented according to the shape/characteristics of the diamond.

The examples of the present disclosure have been described above as specific embodiments, but these are only examples, and the present disclosure is not limited thereto, and should be construed as having the widest scope according to the technical spirit disclosed in the present specification. A person skilled in the art may combine/substitute the disclosed embodiments to implement a pattern of a shape that is not disclosed, but it also does not depart from the scope of the present disclosure. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the present specification, and it is clear that such changes or modifications also belong to the scope of the present disclosure.

Number	Date	Country	Kind
10-2022-0034438	Mar 2022	KR	national
10-2023-0036424	Mar 2023	KR	national

CMP CONDITIONING DISK, AND METHOD AND DEVICE FOR MANUFACTURING CMP CONDITIONING DISK

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