Patent Grant
10981184
A claim for priority under 35 U.S.C. ยง 119 is made to Korean Patent Application No. 10-2017-0038701 filed on Mar. 27, 2017, in the Korean Intellectual Property Office, the entire contents of which are hereby incorporated by reference.
Embodiments of the inventive concept described herein relate to a coating apparatus and a coating method.
Substrates may be coated for improvement and change of physical and chemical characteristics. The coating methods include deposition, such as PVD or CVD, spraying, and aerosol deposition.
In the aerosol deposition, a coating material in an aerosol state is ejected toward a substrate at a preset pressure. The coating material has kinetic energy due to the ejection speed. The kinetic energy of the coating material is converted to thermal energy during collision with the substrate. The thermal energy fuses the coating material and the coating material is coated on the substrate. In the aerosol deposition, the particle sizes of the usable coating material are restricted due to the kinetic energy of the coating material and the degree of heat obtained by converting the kinetic energy to thermal energy.
Embodiments of the inventive concept provide a coating apparatus and a coating method, by which a substrate may be efficiently coated.
In accordance with an aspect of the inventive concept, there is provided a coating apparatus including a chamber, a support located in an interior space of the chamber and configured to support a substrate which is to be coated, an ejection nozzle configured to eject a coating material toward the support, and an electric field forming unit configured to form an electric field in or along a movement path of the coating material to provide kinetic energy for the coating material. The electric field lines of the electric field continuously travel in a direction of the movement path of the coating material.
The electric field forming unit may include an electrode member located between the support and the ejection nozzle, and a power source configured to apply a voltage between the substrate located in the support and the electrode member.
The electrode member may have holes, through which the coating material passes.
The electrode member may have a mesh shape.
The substrate may be connected to the power source and the electrode member is grounded.
The power source may be a DC power source.
The support may be located on an upper wall of the chamber and the electrode member may be located at a lower portion of the interior space of the chamber.
The chamber may have an exhaust hole for exhausting the interior space thereof.
The electric field forming unit may further include a connecting line that connects the substrate to the power source to apply a voltage if the substrate is located in the support.
The electric field forming unit may further include an auxiliary electrode member located inside the support and electrically connected to the power source.
The coating apparatus may further include a magnetic field forming unit configured to form a magnetic field in the movement path of the coating material.
The magnetic field forming unit may be located on a side of the movement path of the coating material.
The magnetic field forming unit may include a first magnet and a second magnet located on opposite sides with respect to the movement path of the coating material.
The ejection nozzle may eject the coating material in an aerosol state.
In accordance with another aspect of the inventive concept, there is provided a method for coating a substrate, the method including ejecting a coating material with an ejection nozzle, ionizing the coating material, and guiding the ionized coating material toward the substrate through an electric field to force the coating material to collide with the substrate.
The coating material may be ionized through ions provided by the electrode member while passing through an electrode member located in front of the ejection nozzle with respect to an ejection direction of the coating material.
The electrode member may include holes, the coating material may move toward the substrate across the electrode member through the holes, and the electric field be formed between the substrate and the electrode member.
A magnetic field may be formed in a movement path of the coating material when the coating material is guided toward the substrate.
The above and other objects and features will become apparent from the following description with reference to the following figures, wherein like reference numerals refer to like parts throughout the various figures unless otherwise specified, and wherein:
Hereinafter, exemplary embodiments of the inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept may be modified in various forms, and the scope of the inventive concept should not be construed to be limited to the following embodiments. The embodiments of the inventive concept are provided to describe the inventive concept for those skilled in the art more completely. Accordingly, the shapes of the components of the drawings are exaggerated to emphasize clearer description thereof.
Referring to
The chamber 100 provides a space having a preset volume and in which coating is performed. An exhaust hole 100 is formed on one side of the chamber 100. The exhaust hole 110 is connected to an exhaust line 111, and exhausts the interior space through a negative pressure applied to the exhaust line 111. The exhaust hole 110 may be formed on a surface of the chamber 100 on which the support 120 is located.
The support 120 is located inside the chamber 100 and supports the substrate m (see
The ejection nozzle 130 ejects a coating material into the interior space. As an example, the ejection nozzle 130 may be located in the interior space of the chamber 100, an end of the ejection nozzle 130 may be located to communicate with the interior space of the chamber 100, and the coating material ejected from the ejection nozzle 130 may be supplied into the interior space of the chamber 100. The ejection nozzle 130 may eject the coating material in an aerosol state. The ejection nozzle 130 may eject the coating material at a preset pressure. The coating material may be ceramic. The particle diameters of the ejected coating material may range from several micrometers to several nanometers. The ejection nozzle 130 may be located in a direction that faces the support 120, and ejects the coating material toward the support 120. If the support 120 is located on an upper wall of the chamber 100, the ejection nozzle 130 may be located at a lower portion the chamber 100 and may eject the coating material from the lower side to the upper side.
Referring to
The electrode member 140 may be located between the support 120 and the ejection nozzle 130. As an example, the electrode member 140 may be spaced apart from an end of the ejection nozzle 130 by a preset distance in a movement direction of the coating material. The coating material ejected from the ejection nozzle 130 moves across the electrode member 140. The electrode member 140 includes holes that provide the movement path of the ejection nozzle 130. As an example, the electrode member 140 may be provided in a form of a mesh. The electrode member 140 is formed of a conductive material such as a metal. The electrode member 140 may be fixed to the chamber 100 by a fixing unit 141.
The power source 150 forms an electric potential between the electrode member 140 and the substrate m. In detail, the power source 150 may be electrically connected to the electrode member 140 and the substrate m. In detail, one side of the power source 150 may be connected to the electrode member 140 through an electric wire, and an opposite side of the power source 150 may be connected to an upper surface of the support 120 through an electric wire. Accordingly, if the substrate m is located in the support 120, a voltage is applied to the substrate m and the electrode member 140 by the power source 150. The power source 150 is provided as a DC power source 150 such that a positive electrode thereof may be connected to the substrate m and a negative electrode thereof may be connected to the electrode member 140. Further, one side of the power source 150 and the electrode member 140 may be connected to each other in a grounding manner.
The magnetic field forming unit 160 forms a magnetic field in the movement path of the coating material. The magnetic field forming unit 160 includes a first magnet 161 and a second magnet 162. The magnetic field forming unit 160 is located on a side of the movement path of the coating material. When the support 120 is located on an upper wall of the chamber 100 and the ejection nozzle 130 is located at a lower portion the chamber 100, the first magnet 161 and the second magnet 162 may be located on a side wall of the chamber 100. The first magnet 161 and the second magnet 162 may face each other with respect to the movement path of the coating material. Facing surfaces of the first magnet 161 and the second magnet 162 may have different polarities. The first magnet 161, the second magnet 162, or the first magnet 161 and the second magnet 162 may be magnets, the magnetic flux densities of which may be adjusted. In order that a magnetic field may be formed throughout the movement path of the coating material, the substrate m may be located between upper portions of the first magnet 161 and the second magnet 162 and the electrode member 140 may be located between lower portions of the first magnet 161 and the second magnet 162.
Referring to
The coating material may be charged with negative ions while passing through the electrode member 140. As an example, the coating material may be material, such as an oxide or a nitride, which easily receives electrons. Accordingly, the coating material may receive electrons from the electrode member 140 to be charged with negative ions while moving to the substrate m through the holes of the electrode member 140. Further, the charged coating material may collide with the substrate m after being moved while the kinetic energy thereof is adjusted by the electric field formed between the electrode member 140 and the substrate m. If the power source 150 is provided with a DC power source 150, the kinetic energy of the charged coating material increases due to the electric field, and the coating quality may be improved as the fusion degree increases when the coating material collides with the substrate m.
According to an embodiment of the inventive concept, because the process of coating the coating material is controlled by adjusting a movement state of the coating material through an electric field, the coating quality may be improved.
Further, according to an embodiment of the inventive concept, because the movement state of the coating material is adjusted through an electric field, the coating material having a wide range of particle sizes may be used for the coating.
Referring to
As the coating material is charged while passing through the electrode member 140, the mobility of the coating material increases in the sheath s. The thickness of the sheath s may be adjusted by a magnetic field provided by the magnetic field forming unit 160. Accordingly, when the coating material is ejected to the substrate m to be coated, the kinetic energy of the coating material when the coating material collides with the substrate m may be adjusted by adjusting the magnetic flux formed by the magnetic field forming unit 160 to adjust the sheath s.
According to an embodiment of the inventive concept, because the process of coating the coating material is controlled by adjusting a movement state of the coating material by adjusting the sheath s, the coating quality may be improved.
Further, according to an embodiment of the inventive concept, because the movement state of the coating material is adjusted through the sheath s, the coating material having a wide range of particle sizes may be used for the coating.
Referring to
The electric field forming unit 221, 240, and 250 includes an electrode member 240, an auxiliary electrode member 221, and a power source 250.
The auxiliary electrode member 221 is provided inside the support 220. The auxiliary electrode member 221 may be located adjacent to the surface on which the substrate m is located. The auxiliary electrode member 221 may be connected to the power source 250 in a manner that is similar to that of the coating apparatus 10 of
Because the configurations and operations of the magnetic field forming unit 260 including the chamber 200, the support 220, the ejection nozzle 230, the electrode member 240, the power source 250, and the first and second magnets 261 and 262, except for the auxiliary electrode member 221, are the same as or similar to those of the coating apparatus 10 of
Referring to
The electric field forming unit 340, 350, and 351 includes an electrode member 340, a connecting rod 351, and a power source 350.
The connecting rod 351 is connected to the power source 350 through an electric wire. The connecting rod 351 may be provided while being fixed to the chamber 300. The connecting rod 351 is provided such that an end of the connecting rod 351 contacts the substrate m if the substrate m is located in the support 320. The connecting rod 351 may be a conductor, or may include an electric wire therein. Accordingly, the substrate m in contact with the connecting rod 351 is electrically connected to the power source 350.
Because the configurations and operations of the magnetic field forming unit 360 including the chamber 300, the support 320, the ejection nozzle 330, the electrode member 340, the power source 350, and the first and second magnets 261 and 262, except for the connecting rod 351, are the same as or similar to those of the coating apparatus 10 of
According to an embodiment of the inventive concept, a coating apparatus and a coating method, by which a substrate may be efficiently coated, may be provided.
The above description exemplifies the inventive concept. Furthermore, the above-mentioned contents describe the exemplary embodiment of the inventive concept, and the inventive concept may be used in various other combinations, changes, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept that is disclosed in the specification, the equivalent scope to the written disclosures, and/or the technical or knowledge range of those skilled in the art. The written embodiment describes the best state for implementing the technical spirit of the inventive concept, and various changes required in the detailed application fields and purposes of the inventive concept can be made. Accordingly, the detailed description of the inventive concept is not intended to restrict the inventive concept in the disclosed embodiment state. Furthermore, it should be construed that the attached claims include other embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2017-0038701 | Mar 2017 | KR | national |
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| Number | Date | Country | |
|---|---|---|---|
| 20180272366 A1 | Sep 2018 | US |
