This is a divisional of application Ser. No. 09/790,095, filed Feb. 22, 2001 now U.S. Pat. No. 6,562,135. Attention is directed to commonly owned and assigned, applications U.S. Ser. No. 09/466,565 filed Dec. 17, 1999, now U.S. Pat. No. 6,214,419, discloses a process for immersion coating of a substrate comprising positioning a substrate having a top and bottom within a coating vessel having an inner surface to define a space between the inner surface and the substrate, filling at least a portion of the space with a coating mixture; stopping the filling slightly below the top of the substrate, initiating removal of the coating mixture at a gradually increasing rate to a predetermined maximum flow rate in a short predetermined distance, and continuing removal of the coating mixture at substantially the predetermined maximum flow rate to deposit a layer of the coating mixture on the substrate; U.S. Ser. No. 09/450,363, filed Nov. 29, 1999, which discloses a process including: providing a hollow imaging drum having a first end, a second end, an outside surface, an inside surface and coating material on both the inside surface and the outside surface at least the first end; simultaneously contacting the coating material on both the inside surface and the outside surface at the first end of the drum with resilient foam material contacts the first end drum, the foam material being insoluble in the flowing solvent; producing relative movement between the foam material and the drum to simultaneously wipe both the inside surface and the outside surface of the first end of the drum with the foam material and solvent material and simultaneously remove coating material from the inside surface and the outside surface of the first end of the drum; and flowing the solvent away from the drum to carry away coating material removed from the inside surface and the outside surface of the first end of the drum; U.S. Ser. No. 09/416,824 and 09/416,840 now U.S. Pat. No. 6,177,219, both filed Nov. 12, 1999, and U.S. Ser. No. 09/576147 now U.S. Pat. No. 6,156,468. The disclosures of each the above mentioned copending applications or patents are incorporated herein by reference in their entirety. The appropriate components and processes of these applications may be selected for the materials and processes of the present invention in embodiments thereof.
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