Claims
- 1. A coating composition comprising a substituted or unsubstituted thiophene-containing electrically-conductive polymer and an organic solvent media; the media having a water content of less than 12 weight percent.
- 2. The coating composition of claim 1 wherein the organic solvent media has a maximum water content of 10 weight percent.
- 3. The coating composition of claim 1 wherein the electrically-conductive polymer is poly(3,4-ethylene dioxythiophene styrene sulfonate).
- 4. The coating composition of claim 1 wherein the amount of electrically-conductive polymer in the total solids content of said coating composition is from 0.1-100 weight percent
- 5. The coating composition of claim 1 wherein the amount of electrically-conductive polymer is between 2 and 70 weight percent of the total solids content of said coating composition.
- 6. The coating composition of claim 1 further comprising a film-forming binder in an amount up to a maximum of 99.9 weight percent of the total solids content of said coating composition.
- 7. The coating composition of claim 6 wherein the film-forming binder is between 98 and 30 weight percent of the total solids content of said coating composition.
- 8. The coating composition of claim 6 wherein the film-forming binder is a cellulose ester.
- 9. The coating composition of claim 6 wherein the film-forming binder is cellulose diacetate.
- 10. The coating composition of claim 1 further comprising addenda selected from the group consisting of surfactants, coating aids, dispersing aids, thickeners, coalescing aids, crosslinking agents or hardeners, soluble particle dyes, solid particle dyes, antifoggants, biocides, matte particles, lubricants, pigments and magnetic particles.
- 11. The coating composition of claim 1 containing total solids in an amount less than or equal to about 10 weight percent of the total coating composition.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application relates to commonly assigned copending application Ser. No. ______, filed simultaneously herewith. This copending application is incorporated by reference herein for all that it contains.