The present invention concerns a cooling member that absorbs heat conducted from a soldering iron during soldering, a coaxial cable using this, and particularly, a method for soldering thin coaxial cable.
Usually, solder and physical contact with a soldering device are used to connect electrical parts. However, due to the miniaturization of electrical equipment in recent years, especially in connectors, many restrictions arise when connecting is done using solder.
[Problem to be Solved by the Invention]
When connecting a thin conducting wire such as a thin coaxial cable to a connector, a grounding bar is connected to the shield portion surrounding the conducting wire, but when soldering, since the heat due to soldering is conducted to the jacket side of the coaxial cable, molten solder sometimes flows along the shield line towards the jacket. If the solder hardens, then one portion of the conducting wire that is exposed to the outside of the connector loses its flexibility.
In this case, when using a connector to small devices such as mobile devices, when inserting a conducting wire along with a connector into a narrow space, said conducting wire sometimes cannot be bent, or cannot be flexed, at a portion close to the connector, so this can cause the workability of the attaching of connectors to worsen. In order to solve such problems, it is necessary to prevent the flow of solder to the jacket side of the coaxial cable.
[Means for Solving the Problem]
In the light of the problems described above, the present invention provides a soldering method that is a soldering method for thin coaxial cables, including a step wherein the shield of the coaxial cable is placed on the grounding bar, a step wherein solder is supplied to the grounding bar or the shield, a step wherein a cooling member is installed next to and in contact with the grounding bar, and a step wherein the grounding bar and the coaxial cable are soldered, and in which a region next to and in contact with the cooling member is cooled, and the flowing of solder into a region other than the soldering portion is prevented. Whereby, the flowing of solder to the jacket side can be prevented.
Here, the cooling is of the portion next to and in contact with the grounding bar, and the temperature of the coaxial cable at said portion can be maintained at 150 degrees Celsius or below. Whereby, the flow of solder can be prevented.
As a device that realizes such a method, a cooling member is provided that is a cooling member for soldering, said cooling member being able to have a coaxial cable pass through it, and having a pass-through hole for holding said coaxial cable, and a contact region that can come into contact with the region next to the portion on which the soldering is to be done, and which, during soldering with a grounding bar, the heat that is conducted from the portion being soldered to the coaxial cable side is absorbed by the contact region, said region being able to be kept at below the melting point of the solder.
As described above, this cooling member can keep the cooling region at below 150 degrees Celsius. Whereby, if this method or device is applied to a connector, a connector that can be bent flexibly from the connecting portion of the coaxial cable can be realized.
Since, as described above, the flow of solder can be blocked, even if the grounding bar that is fixed to the housing is fixed with solder, the coaxial cable connected to the grounding bar can be bent without losing flexibility.
[Effects of the Invention]
Due to the present invention, the flowing of solder to the jacket side of a coaxial cable can be prevented. This is effective particularly for small connectors.
The present invention is one whereby, when a thin conducting wire such as a thin coaxial cable is connected to a connector, a grounding bar is connected to a shield portion surrounding the conducting wire, and when soldering is performed, the flow of solder is prevented by cooling the coaxial cable in the vicinity of the portion whereon soldering is performed. This utilizes the fact that since the melting point of solder is approximately 150 degrees Celsius, solder will lose its fluidity at temperature regions lower than this. Herebelow, the device shall be explained concretely.
If soldering is performed in this state, the fluidified solder has a tendency to flow in by creeping along the shield 7. Here, since the melting point of solder is approximately 150 degrees Celsius, solder is a solid at any lower temperature. Due to the cooling member 1, only a small amount of heat travels to regions of the shield 7 other than the region that is being soldered to the grounding bar 6 of the coaxial cable 2, so that the coaxial cable 2 will be maintained at 150 degrees Celsius or below during the soldering step. Therefore, the solder will not flow into the coaxial cable side.
As shown in
In this way, by using the cooling member 1 of the present invention, the flowing of solder into the coaxial cable side can be prevented. Further, as shown in
In the present invention, by putting a cooling member 1 next to and in contact with a region on which soldering is to be performed, the temperature of a coaxial cable 2 can be maintained at 150 degrees Celsius or below, thereby preventing the flow of solder into the coaxial cable side. Whereby, bending of the coaxial cable 2 can be done from the portion next to and in contact with the housing, without losing flexibility. This can be used, for example, in devices which demand miniaturization such as cellular telephones, and in particular, when a connector and a coaxial cable is passed through a small pass-through hole, a coaxial cable can be passed through the pass-through hole by bending it from the base of the connector.
Number | Date | Country | Kind |
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2004-107909 | Mar 2004 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP05/06286 | 3/31/2005 | WO | 6/21/2007 |