Patent Application
20170287380
The present invention relates to the field of displays, and more particularly to a chip on film (COF) structure, a driving circuit, and a display device.
With technological development, users desire more and more from the display panel design. Generally, a chip on film (COF) structure is used to drive the conventional display panel.
Please kindly refer to
On the same COF structure 10, a certain distance should be reserved between the bonding wires 12 and the bonding mark 13, and a certain distance should be reserved between the bonding mark 13 and edges of the COF structure 10, in order to ensure the working stability of the COF. Meanwhile, a safe distance should be reserved between adjacent COF structures 10, to prevent mutual interference among the adjacent COF structures.
However, in the conventional art, intervals between the adjacent COF structures 10 are too large to be suitable for the requirement of a display panel with a high resolution rate and a driving chip with small intervals.
Hence, it is necessary to provide a COF structure, a driving circuit, and a display device, to solve the above technical issues.
An objective of the present invention is to provide a COF structure, a driving circuit, and a display device which are suitable for the requirement of a display panel with a high resolution rate and a driving chip with small intervals, with the basis of keeping larger intervals between adjacent COFs. The present invention solves the technical issues regarding a longer interval between two adjacent COF structures, which is not suitable for a high resolution display panel in need of smaller intervals between adjacent driving chips.
The embodiment of the present invention provides a COF structure, which comprises:
a thin-film body; two or more driving chips are disposed on the same thin-film body, to generate driving signals; bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips; and bonding marks are disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
In the preferred embodiment, a distance between the two driving chips of the same thin-film body is less than a distance between the adjacent COF structures.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are the same.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are different.
In the preferred embodiment, the bonding mark is disposed on a left side of the thin-film body.
In the preferred embodiment, the bonding mark is disposed on a right side of the thin-film body.
In the preferred embodiment, the bonding mark is disposed on a left side and a right side of the thin-film body.
The embodiment of the present invention provides a driving circuit for driving a display panel, which comprises a COF structure. The COF structure comprises:
a thin-film body; two or more driving chips disposed on the same thin-film body, to generate driving signals; bonding wires disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips; and bonding marks disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
In the preferred embodiment, a distance between the two driving chips of the same thin-film body is less than a distance between the adjacent COF structures.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are the same.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are different.
In the preferred embodiment, the bonding mark is disposed on a left side of the thin-film body.
In the preferred embodiment, the bonding mark is disposed on a right side of the thin-film body.
In the preferred embodiment, the bonding mark is disposed on a left side and a right side of the thin-film body.
The embodiment of the present invention provides a display device, which comprises a display panel and a driving circuit with a COF structure. The COF structure comprises:
a thin-film body; two or more driving chips are disposed on the same thin-film body, to generate driving signals; bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips; and bonding marks are disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are the same.
In the preferred embodiment, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are different.
In the preferred embodiment, the bonding mark is disposed on a left side and/or a right side of the thin-film body.
In the preferred embodiment, the display panel is a curve display panel.
Compared with the conventional art, the COF structure, the driving circuit, and the display device of the present invention, with the basis of keeping larger intervals between adjacent COFs, is suitable for the requirement of a high resolution display panel in need of a narrow interval between adjacent driving chips. The present invention solves the technical issues regarding a longer interval between two adjacent COF structures, which is not suitable for a high resolution display panel in need of a narrow interval between adjacent driving chips.
To make the above-described present invention more fully comprehensible, with preferred embodiments accompanied with drawings, the detail descriptions are as below.
The following description of each embodiment, with reference to the accompanying drawings, is used to exemplify specific embodiments which may be carried out in the present invention. Directional terms mentioned in the present invention, such as “top”, “bottom”, “front”, “back”, “left”, “right”, “inside”, “outside”, “side”, etc., are only used with reference to the orientation of the accompanying drawings. Therefore, the used directional terms are intended to illustrate, but not to limit, the present invention.
In the drawings, components having similar structures are denoted by the same numerals.
Please refer to
The two or more driving chips 22 are disposed on the same thin-film body 21, to generate driving signals. The bonding wires 23 are disposed on a top side or a bottom side of the thin-film body 21, to form a bonding connection between external signal lines and wires of the driving chips 22. The bonding marks 24 are disposed laterally on the thin-film body 21, to perform a location operation on the thin-film body 21 which is used for bonding operation.
As
In the COF structure 20 of the preferred embodiment, quantities of the bonding wires 23 corresponding to the two driving chips 22 of the same thin-film body 21 can be the same or different. Specifically, it is setup according to the user's requirements.
In the COF structure 20 of the preferred embodiment, the bonding marks 24 can be disposed on a left side and a right side of the thin-film body 21, to facilitate a bonding operation with external signal lines.
When using the COF structure 20 of the preferred embodiment, the position operation of the thin-film body 21 of the COF structure 20 is performed by the bonding marks 24, then the bonding operation is directly performed by using the external signal lines and the bonding wires 23, to realize the connection between the external signal lines and the wires of the driving chips 22.
Please refer to
However, in COF structure 20 of
Because the COF structure of the preferred embodiment disposed two or more driving chips in the thin-film body, with the basis of keeping larger intervals between adjacent COFs, it is suitable for the requirement of a display panel with a high resolution rate and a driving chip with small intervals.
The present invention further provides a driving circuit with a COF structure for driving a display panel. The COF structure comprises a thin-film body, bonding wires, and bonding marks.
The two or more driving chips are disposed on the same thin-film body, and are used to generate driving signals. The bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips. The bonding marks disposed laterally on the thin-film body, are used to locate on the thin-film body which is used for a bonding operation.
Preferably, a distance between the two driving chips of the same thin-film body is less than a distance between the adjacent COF structures.
Preferably, quantities of the bonding wires corresponding to the two driving chips of the same thin-film body are the same or different.
Preferably, the bonding mark is disposed on a left side and a right side of the thin-film body.
The specific working theory of the driving circuit of the present invention is the same or similar to COF structure of the preferred embodiment, please refer to the relative description of the COF structure of the preferred embodiment.
The present invention further provides a display device, which comprises a display panel and a driving circuit, wherein the driving circuit comprises a COF structure, which comprises a thin-film body, bonding wires, and bonding marks.
The two or more driving chips are disposed on the same thin-film body, to generate driving signals; the bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips; the bonding marks are disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
The specifically working theory of the display device of the present invention is the same or similar to the COF structure of the preferred embodiment, please refer to the relative description of the COF structure of the preferred embodiment.
Preferably, the display panel is a curved display panel. The display device of the present invention uses less COF structures at the same resolution rate, with the larger intervals between the adjacent COF structures. Such display device is able to solve the technical problem of damaging the COF structure resulting from a narrow interval between the adjacent COF structures, and greatly raises the yield rate of the display device.
The COF structure, the driving circuit, and the display device of the present invention, with the basis of keeping larger intervals between adjacent COFs, is for suitable for the requirement of a high resolution display panel in need of a narrow interval between adjacent driving chips. The present invention solves the technical issues regarding a longer interval between two adjacent COF structures, which is not suitable for a high resolution display panel in need of a narrow interval between adjacent driving chips.
Although the present invention has been disclosed as preferred embodiments, the foregoing preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art, without departing from the spirit and scope of the present invention, can make various kinds of modifications and variations to the present invention. Therefore, the scope of the claims of the present invention must be defined.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201610204869.7 | Apr 2016 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2016/080034 | 4/22/2016 | WO | 00 |
