The disclosures herein generally relate to a coil antenna, a coil antenna-mounted structure, a coil antenna manufacturing method, and a coil antenna-mounted structure manufacturing method, and particularly to a coil antenna having a plate-shaped core including a magnetic material and a coil wire that is wound around the plate-shaped core.
A coil antenna having a coil wire wound around a magnetic material may be used in a non-contact information recording medium such as an integrated circuit (IC) card, a radio frequency identification (RFI) tag, a subscriber identity module (SIM) card, or a micro secure digital (SD) card.
A non-contact information recording medium is prone to influences from metallic surfaces located in the surrounding environment and may suffer from communication property degradation. Japanese Laid-Open Patent Application No. 2009-130446 discloses technology for maintaining the communication property of a coil antenna by interposing the coil antenna between two metal plates.
The coil wire 105 is wound around Ore 103. The metal foil 109a is arranged on one surface 103a of the core 103 via the adhesive layer 107a. The metal foil 109b is arranged on a rear face 103b of the core 103 via the adhesive layer 107b.
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It is a general object of at least one embodiment of the present invention to provide a coil antenna that substantially obviates one or more problems caused by the limitations and disadvantages of the related art.
According to one aspect of the present invention, a coil antenna-mounted structure includes a coil antenna having a core that is plate-shaped and includes a magnetic material and a coil wire that is wound around the core; and a mounting substrate on which the coil antenna is mounted; wherein the coil antenna includes an insulating layer having a flat surface and a flat metal layer that is arranged on the flat surface of the insulating layer, the insulating layer being arranged on a surface of the core opposite the mounting substrate to cover the coil wire; and the mounting substrate includes a flat metal layer antenna pattern that is arranged at a location facing the coil antenna.
According to another aspect of the present invention, a coil antenna includes a core that is plate-shaped and includes a magnetic material; a coil wire that is wound around the core; a first insulating layer that is arranged on a surface of the core, the insulating layer being arranged to cover the coil wire and have a flat surface opposite the core; a second insulating layer that is arranged on a rear face opposite the surface of the core, the second insulating layer being arranged to cover the coil wire and to have a flat surface opposite the core; a flat first metal layer arranged on the flat surface of the first insulating layer; and a flat second metal layer arranged on the flat surface of the second insulating layer.
According to another aspect of the present embodiment, a method of manufacturing a coil antenna having a core that is plate-shaped and includes magnetic material and a coil wire that is wound around the core is provided, the method including the steps of arranging an insulating layer on a surface of the core, the insulating layer being arranged to cover the coil wire and to have a flat surface opposite the surface of the core; and arranging a flat metal layer on the flat surface of the insulating layer.
According to another aspect of the present invention, a method of manufacturing a coil antenna having a core that is plate-shaped and includes a magnetic material and a coil wire that is wound around the core is provided, the method including the steps of dropping a predetermined amount of insulating adhesive on a surface of the core; and arranging a metal layer having a substantially uniform thickness on the insulating adhesive, pressing the metal layer towards the core using a press member having a flat surface that is parallel to the surface of the core, creating an insulating layer from the insulating adhesive by arranging the insulating adhesive on the surface of the core to cover the coil wire and have a flat surface opposite the core, and arranging the flat metal layer to be flat on the flat surface of the insulating layer.
According to another aspect of the present invention, a method of manufacturing a coil antenna-mounted structure is provided, the method including the steps of arranging a coil antenna having a core that is plate-shaped and includes a magnetic material, a coil wire that is wound around the core, an insulating layer having a flat surface and a flat metal layer that is arranged on the flat surface of the insulating layer, the insulating layer being arranged on a surface of the core to cover the coil wire; and mounting the coil antenna on a mounting substrate, the mounting substrate having a metal layer antenna pattern arranged at a mounting location of the coil antenna; wherein the metal layer antenna pattern is arranged to face a rear face of the core opposite the surface on which the flat metal layer is arranged.
According to one aspect of the present invention, a coil antenna-mounted structure includes a coil antenna having a flat metal layer arranged on a flat surface of an insulating layer and a mounting substrate having a flat metal layer antenna pattern arranged at a position facing the coil antenna. In this way, the communication distance of the coil antenna may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
Further, by using a flat metal layer antenna pattern arranged on the mounting substrate as one of the metal layers of a coil antenna-mounted structure having a core interposed between two flat metal layers, the process of manufacturing the coil antenna-mounted structure may be simplified and the manufacturing cost may be reduced.
According to another aspect of the present invention, a coil antenna includes a flat first metal layer and a flat second metal layer arranged on the flat surfaces of a first insulating layer and a second insulating layer that are arranged on a surface and a rear face of the core. In this way, the communication distance of the coil antenna may be improved compared to a coil antenna having metal layers that are warped and/or uneven.
Further, by arranging the flat first metal layer and the flat second metal layer on the core beforehand, the mounting process may be simplified and deviations in the coil antenna performance may be prevented so that mass production of the coil antenna may be possible.
According to another aspect of the present invention, a method of manufacturing a coil antenna includes the steps of arranging an insulating layer on a surface of the core, the insulating layer being arranged to cover the coil wire and to have a flat surface opposite the surface of the core; and arranging a flat metal layer on the flat surface of the insulating layer. In this way, a flat metal layer may be arranged on the surface of the core so that the communication distance of the coil antenna may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
According to another aspect of the present invention, a method of manufacturing a coil antenna includes the steps of dropping a predetermined amount of insulating adhesive on a surface of the core; and arranging a metal layer having a substantially uniform thickness on the insulating adhesive, pressing the metal layer towards the core using a press member having a flat surface that is parallel to the surface of the core, creating an insulating layer from the insulating adhesive by arranging the insulating adhesive on the surface of the core to cover the coil wire and have a flat surface opposite the core, and arranging the flat metal layer to be flat on the flat surface of the insulating layer. In this way, a flat metal layer may be arranged on the surface of the core so that the communication distance of the coil antenna may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
According to another aspect of the present invention, a method of manufacturing a coil antenna-mounted structure includes the steps of arranging a coil antenna having a core that is plate-shaped and includes a magnetic material, a coil wire that is wound around the core, an insulating layer having a flat surface and a flat metal layer that is arranged on the flat surface of the insulating layer, the insulating layer being arranged on a surface of the core to cover the coil wire; and mounting the coil antenna on a mounting substrate, the mounting substrate having a metal layer antenna pattern arranged at a mounting location of the coil antenna; wherein the metal layer antenna pattern is arranged to face a rear face of the core opposite the surface on which the flat metal layer is arranged. In this way, a coil antenna-mounted structure having a core and a coil wire interposed between a flat metal layer and a flat metal layer antenna pattern may be created so that the communication distance of the coil antenna may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
Further, by using a flat metal layer antenna pattern arranged on the mounting substrate as one of the metal layers of a coil antenna-mounted structure having a core interposed between two flat metal layers, the process of manufacturing the coil antenna-mounted structure may be simplified and the manufacturing cost may be reduced.
In the following, embodiments of the present invention are described with reference to the accompanying drawings.
In the present embodiment, a coil antenna 1 includes a core 3 that is plate-shaped and includes magnetic material, a coil wire 5, a first insulating layer 7a, a second insulating layer 7b, a first metal layer 9a, a second metal layer 9b, and coil antenna terminals 11, 13.
The coil wire 5 is wound around the core 3. The coil wire 5 may be mechanically wound on the core 3 or formed on the surface of the core 3 as a pattern through vapor deposition, for example. The first metal layer 9a is arranged on a surface 3a of the core 3 via the first insulating layer 7a. The second metal layer 9b is arranged on a rear face 3b of the core 3 via the second insulating layer 7b. As can be appreciated from
The coil antenna terminals 11, 13 are arranged at the sides of the core 3. The coil antenna terminal 11 is connected to one end of the coil wire 5, and the coil antenna terminal 13 is connected to the other end of the coil wire 5.
The surfaces of the first and second insulating layers 7a, 7b opposite the core 3 are arranged to be flat. The first and second insulating layers 7a, 7b may be made of insulating adhesive and may be arranged to have thicknesses in the range of 2-3 μm, for example.
The first and second metal layers 9a, 9b are arranged on the flat surfaces of the first and second insulating layers 7a, 7b. The first and second metal layers 9a, 9b are flat and are arranged to have substantially uniform thicknesses. For example, the first and second metal layers 9a, 9b may be made of a metal foil such as copper foil and may be arranged at a thickness of no more than 50 μm.
In the following, the communication distance of the coil antenna 1 according to the present embodiment is compared with the communication distance of the coil antenna 101 shown in
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Table 1 shown below indicates the measurement results from measuring the communication distance of twelve samples of the coil antenna 1 of the present embodiment and twelve samples of the coil antenna 101 of
As is shown in Table 1, the average communication distance of the coil antenna 1 of the present embodiment was 11.8 mm. The average communication distance of the coil antenna 101 of FIG. 1 was 3.9 mm.
As can be appreciated from the above measurement results, greater communication distance may be obtained by the coil antenna 1 of the present embodiment compared to the coil antenna 101 of
The coil antenna-mounted structure shown in
The coil antenna 15 includes the core 3, the coil wire 5, the insulating layer 7a, the metal layer 9a, and the coil antenna terminals 11, 13. The coil antenna terminals 11, 13 are arranged at the side faces of the core 3. It is noted that the coil antenna 15 of the present embodiment does not include the second insulating layer 7b and the second metal layer 9b of the coil antenna 1 shown in
The mounting substrate 17 may be a printed circuit board having an insulating base material 19 on which metal layer patterns 21, 23, 25 and a resist insulating film 27 are arranged in this order. The metal layer patterns 21, 23, 25 may have thicknesses in the range of 30-50 μm, for example. It is noted that the insulating base material 19 may have other metal layer patterns (i.e., patterns other than the metal layer patterns 21, 23, 25) arranged at locations other than the coil antenna 15 mounting location.
The metal layer pattern 21 is a flat metal layer antenna pattern that is arranged to face the coil antenna 15 when the coil antenna 15 is mounted on the mounting substrate 17.
The metal layer patterns 23, 25 are metal layer land patterns arranged to face the coil antenna terminals 11, 13.
The resist insulating film 27 is removed from the coil antenna 15 mounting location including the location where the metal layer antenna pattern 21 is arranged. The resist insulating film 27 is also removed from the location where the metal layer land patterns 23, 25 are arranged. The resist insulating film 27 may have a thickness in the range of 10-30 μm, for example.
The coil antenna 15 has the rear face 3b that is mounted on the mounting substrate 17. The coil antenna terminal 11 and the metal layer land pattern 23 are bonded by solder 29. The coil antenna terminal 13 and the metal layer land pattern 25 are bonded by solder 31. In this way, the mounting substrate 17 may be fixed to the coil antenna 15.
The coil wire 5 of the coil antenna 15 arranged on the rear face 3b of the core 3 comes into contact with the metal layer antenna pattern 21. It is noted that a thin insulating film (not shown) is arranged-on the surface of the coil wire 5. In this way, the coil wire 5 may be insulated from the metal layer antenna pattern 21.
According to one aspect of the present embodiment, the core 3 having the coil wire 5 wound thereon is interposed between the flat metal layer 9a and the flat metal layer antenna pattern 21 so that the communication distance may be improved in the coil antenna 15 compared to a coil antenna having a metal layer that is warped and/or uneven.
According to another aspect of the present embodiment, the resist insulating layer 27 is removed from the location where the metal layer antenna pattern 21 is arranged so that the distance between the coil antenna 15 and the metal layer antenna pattern 21 may be reduced compared to a coil antenna-mounted structure in which the resist insulating layer is not removed. In this way, the communication distance of the coil antenna 15 may be further improved.
According to another aspect of the present embodiment, since the coil antenna terminals 11, 13 are arranged at the side faces of the core 3, and the solders 29, 31 are not arranged at the rear face 3b side of the core 3, the distance between the coil antenna 15 and the metal layer antenna pattern 21 may be reduced compared to a coil antenna-mounted structure in which solder is arranged at the rear face side of the core. In this way, the communication distance of the coil antenna 15 may be further improved.
In another embodiment, the coil antenna 15 may have the coil antenna terminals 11, 13 arranged at the side faces and the rear face of the core 3.
In the coil antenna-mounted structure according to the present embodiment, the coil antenna terminals 11, 13 are arranged at the side faces and the rear face 3b of the core 3.
When the coil antenna 15 is mounted on the mounting substrate 17, the solders 29, 31 are bonded to the side faces of the coil antenna terminals 11, 13. It is noted that the solders 29, 30 are not arranged on the rear face 3b of the core 3.
According to an aspect of the present embodiment, since the solders 29, 31 are not arranged on the rear face 3b of the core 3, the distance between the coil antenna 15 and the metal layer antenna pattern 21 may be reduced compared to a coil antenna-mounted structure in which solder is arranged on the rear face of the core. In turn, the communication distance of the coil antenna 15 may be improved.
In the coil antenna-mounted structure according to the present embodiment, the solders 29, 31 are bonded to the side faces and bottom faces of the coil antenna terminals 11, 13. It is noted that other features of the present embodiment may be identical to those of the coil antenna-mounted structure shown in
According to an aspect of the present embodiment, since the core 3 having the coil wire 5 wound thereon is interposed between the flat metal layer 9a and the flat metal layer antenna pattern 21, the communication distance of the coil antenna 15 may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
In the coil antenna-mounted structure according to the present embodiment, the coil antenna 15 has the coil antenna terminals 11, 13 arranged at the rear face 3b of the core 3. The solders 29, 31 are bonded to the rear faces of the coil antenna terminals 11, 13. It is noted that other features of the present embodiment may be identical to those of the coil antenna-mounted structure shown in
According to an aspect of the present embodiment, since the core 3 having the coil wire 5 wound thereon is interposed between the flat metal layer 9a and the flat metal layer antenna pattern 21, the communication distance of the coil antenna 15 may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
In the coil antenna-mounted structure according to the present embodiment, the mounting substrate 17 has the metal layer antenna pattern 21 covered by the resist insulating film 27. It is noted that other features of the present embodiment may be identical to those of the coil antenna-mounted structure shown in
According to an aspect of the present embodiment, since the core 3 having the coil wire 5 wound thereon is interposed between the flat metal layer 9a and the flat metal layer antenna pattern 21, the communication distance of the coil antenna 15 may be improved compared to a coil antenna having a metal layer that is warped and/or uneven.
It is noted that in the coil antenna-mounted structure of
In the above embodiments of the coil antenna-mounted structure, the planar size of the metal layer antenna pattern 21 is arranged to be smaller than the planar size of the coil antenna 15. However, in other embodiments of the present invention, the planar size of the metal layer antenna pattern may be larger than the planar size of the coil antenna.
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A metal foil suction jig 38 shown in
The suction groove 38b includes a circular portion arranged at the center of the suction surface 38a, a frame portion arranged around the periphery of the suction surface 38a, and linear portions extending from the four corners of the frame portion towards the circular portion.
With such an arrangement, warping of the metal layer 9a may be prevented when the metal layer 9a is suctioned by the suction jig 38. It is noted that the jig used for transporting the metal layer 9a is not limited to the metal foil suction jig 38 described above.
The coil antenna 15 having the flat metal layer 9a arranged on the surface 3a of the core 3 created by the process steps of
It is noted that the process steps described in
In other embodiments, non-conductive paste rather than an insulating adhesive may be used to create the insulating layer 7a and a metal paste such as silver paste rather than a metal foil may be used to create the metal layer 9a. It is noted that these alternative materials may also be used to create a flat insulating layer 7a and a flat metal layer 9a on the surface 3a of the core 3.
In the case of using a non-conductive paste as the material for the insulating layer 7a, the non-conductive paste may be used to create the insulating layer 7a having a flat surface opposite the core 3 in a manner similar to the case of using the insulating adhesive 35.
In the case of using a metal paste as the material for the metal layer 9a, the metal paste may be used to create the metal layer 9a that is flat and substantially uniform in thickness on the flat surface of the insulating layer 7a without involving mechanical transportation. That is, the metal layer 9a is not mechanically transported to the core 3 from a separate location. In the case of using a metal foil or a metal plate that is pre-fabricated, the metal foil or the metal plate is mechanically transported and placed on the core 3.
When the metal foil or metal plate is mechanically transported, the metal foil or metal plate may be damaged from loosening, warping, or scratching, for example. Such problems may be avoided by creating the metal layer 9a through screen printing using a metal paste, for example.
It is noted that in
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The coil antenna 15 having the flat metal layer 9a arranged on the surface 3a of the core 3 created by the process steps of
It is noted that the process steps described in
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The coil antenna 15 having the flat metal layer 9a arranged on the surface 3a of the core 3 created by the process steps of
It is noted that the process steps described in
While preferred embodiments of a method of manufacturing a coil antenna according to one aspect of the present invention have been described above, the present invention is not limited to these embodiments.
For example, a method of manufacturing a coil antenna according to an embodiment of the present invention may use any process to perform the step of arranging an insulating layer on a surface of the core in a manner such that the insulating layer covers the coil wire and has a flat surface opposite the surface of the core.
Also, a method of manufacturing a coil antenna according to an embodiment of the present invention may use any process to perform the step of arranging a flat metal layer on the flat surface of the insulating layer.
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The dispenser 49 includes a porous nozzle 49a and a syringe pump 49b.
By driving a plunger of the syringe pump 49b that is connected to the porous nozzle 49a, the insulating adhesive 35 may be pushed out of the porous nozzle 49a at a certain pressure. In this way, plural drops of the insulating adhesive in substantially uniform amounts may be simultaneously applied on the surface 3a of the core 3.
In
As is shown in
The coil antenna 15 having the flat metal layer 9a arranged on the surface 3a of the core 3 created by the process steps of
It is noted that the process steps described in
While a preferred embodiment of a method of manufacturing a coil antenna according to another aspect of the present invention has been described above, the present invention is not limited to this embodiment.
For example, a method of manufacturing a coil antenna according to an embodiment of the present invention may use any process to perform the step of dropping a predetermined amount of insulating adhesive on a surface of the core.
Also, a method of manufacturing a coil antenna according to an embodiment of the present invention may use any process to perform the step of arranging a metal layer having a substantially uniform thickness on the insulating adhesive, pressing the metal layer towards the core using a press member having a flat surface that is parallel to the surface of the core, creating an insulating layer from the insulating adhesive by arranging the insulating adhesive on the surface of the core to cover the coil wire and have a flat surface opposite the core, and arranging the flat metal layer to be flat on the flat surface of the insulating layer.
A method of manufacturing a coil antenna-mounted structure according to an embodiment of the present invention may use a coil antenna 15 that has a flat metal layer 9a arranged on the surface 3a of the core 3 and a mounting substrate 17 that has a flat metal layer antenna pattern 21 arranged at the mounting location of the coil antenna 15 (see
Further, the present invention is not limited to these embodiments, and numerous variations and modifications may be made without departing from the scope of the present invention.
The present application is based on and claims the benefit of the priority date of Japanese Patent Application No. 2011-242592 filed on Nov. 4, 2011 with the Japanese Patent Office, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | Kind |
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2011-242592 | Nov 2011 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2012/077819 | 10/23/2012 | WO | 00 | 5/1/2014 |