The present invention relates to a coil component and a manufacturing method thereof and, more particularly, to a coil component having a configuration in which a conductor plate is inserted into a through hole formed in a magnetic core and a manufacturing method thereof.
A coil component for power supply use is sometimes provided with a conductor plate made of metal such as Cu (copper) since a comparatively large current flows therein during actual use. For example, a coil component described in JP 2000-306751 A includes a magnetic core having a through hole and made of NiZn-based ferrite and a conductor plate inserted into the through hole. As described in JP 2000-306751 A, the NiZn-based magnetic core has high insulation, so that there is no need to form an insulating film on the surface of the conductor plate.
However, the NiZn-based ferrite is comparatively low in permeability, so that it is preferable to form the magnetic core by using a magnetic material having conductivity like a MnZn-based material in order to achieve higher magnetic characteristics. When a magnetic material having conductivity is used as the material for the magnetic core, the conductor plate and magnetic core need to be electrically insulated, so that as described in Japanese Patent No. 2,951,324, an insulating film needs to be formed at a part of the conductor surface that contacts the magnetic core.
On the other hand, in order to ensure solder wettability at mounting, a metal film, such as a tin-plated film, made of metal having a low melting point needs to be formed on the surface of the conductor plate. However, when a metal film having a low melting point is interposed between a metal element body and an insulating film, the metal film existing between the metal element body and the insulating film is melted due to heat during reflow, with the result that the insulating film may be broken or peeled off.
It is therefore an object of the present invention to provide a coil component capable of preventing the insulating film from being broken or peeled off during reflow and a manufacturing method for the coil component.
A coil component according to the present invention includes: a conductor plate; and a magnetic core made of a magnetic material having conductivity and having a through hole into which the conductor plate is inserted. The conductor plate includes: a metal element body having a body part positioned inside the through hole and a terminal part positioned outside the through hole; a metal film made of metal having a lower melting point than the metal element body and formed on the terminal part; and an insulating film formed on the surface of the body part with the metal film not interposed.
According to the present invention, the body part of the metal element body positioned inside the through hole is covered with the insulating film, preventing the magnetic core having conductivity and metal element body from being electrically short-circuited. In addition, the body part of the metal element body is covered with the insulating film with the metal film not interposed, preventing the insulating film from being broken or peeled off during reflow. Thus, a highly reliable coil component can be provided.
In the present invention, the metal element body may be bent at the boundary between the body part and the terminal part, and a part of the terminal part may be covered with the insulating film with the metal film not interposed. With this configuration, more surface area of the metal element body is covered with the insulating film, making it possible to more reliably prevent short circuits between the metal element body and the magnetic core.
In the present invention, the cross section of the metal element body may be a substantially rectangular shape having a pair of long sides and a pair of short sides, and the metal film may be selectively formed on the surfaces of the terminal part corresponding to the long sides. This can simplify the manufacturing work of the conductor plate.
In the present invention, the magnetic core may have a cut part formed by cutting the vicinity of the end portion of the through hole, and the terminal part may be housed in the cut part. This allows the volume of the magnetic core to be ensured sufficiently.
In the present invention, the magnetic core may include a first core constituting a part of the inner wall of the through hole and a second core constituting the remaining part of the inner wall of the through hole, and a magnetic gap may be formed between the first and second cores. This facilitates the work of combining the magnetic core and the conductor plate and can prevent magnetic saturation by leakage magnetic flux from the magnetic gap.
In the present invention, the through hole may include first and second through holes, the body part of the metal element body may include a first body part positioned inside the first through hole and a second body part positioned inside the second through hole, and the terminal part may include a first terminal part positioned at one end side of the first body part, a second terminal part positioned at one end side of the second body part, a third terminal part positioned at the other end side of the first body part, and a fourth terminal part positioned at the other end side of the second body part. The metal element body may further have a connection part that short-circuits the third and fourth terminal parts, and the third and fourth terminal parts may protrude from the connection part. This allows the difference in heat capacity among the first to fourth terminal parts.
In the present invention, the surface of the connection part may be covered with the insulating film with the metal film not interposed. With this configuration, more surface area of the metal element body is covered with the insulating film, making it possible to more reliably prevent short circuits between the metal element body and the magnetic core.
In the present invention, the distance between the third and fourth terminal parts may be equal to the distance between the first and second terminal parts. This facilitates the design of land patterns on a circuit board on which the coil component is mounted.
In the present invention, the first to fourth terminal parts may each have a tapered shape in which the sectional area thereof is reduced toward the tip end thereof. This facilitates the formation of a solder fillet when the coil component is mounted on a circuit board, making it possible to enhance mounting strength and connection reliability.
In the present invention, the cut part may include a first cut part housing therein the first terminal part, a second cut part housing therein the second terminal part, and a third cut part housing therein the third terminal part, fourth terminal part, and connection part. This allows the volume of the magnetic core to be sufficiently ensured.
In the present invention, the first to third cut portions may each have a tapered shape in which the opening area thereof is increased toward the tip ends of the first to fourth terminal parts. Thus, even when the mounting position of the coil component with respect to a circuit board is slightly displaced, it is possible to prevent the metal element body and magnetic core from being short-circuited through the solder fillet.
A coil component manufacturing method according to the present invention includes: a first step of preparing a metal element body having a body part and a terminal part and forming an insulating film on the surface of the body part by an electrodeposition method; a second step of forming by plating a metal film having a lower melting point than the metal element body on the surface of the terminal part on which the insulating film is not formed; and a third process of preparing a magnetic core having a through hole and combining the magnetic core and the metal element body so that the body part and the terminal part are positioned respectively inside the through hole and outside the through hole.
According to the present invention, the insulating film is formed by the electrodeposition method, so that the insulating film can be uniformly formed on the surface of the metal element body including the corner portions thereof. In addition, the metal film is formed by plating after the formation of the insulating film, so that it is possible to prevent the metal film from being interposed between the metal element body and the insulating film.
In the present invention, the first step may include a step of forming the insulating film on the entire surface of the metal element body by the electrodeposition method and a step of removing at least a part of the insulating film formed on the terminal part. This can simplify the electrodeposition process. In this case, when the process of removing the insulating film is performed by laser beam irradiation, the insulating film can be removed with high accuracy. Further, in this case, the terminal part has a tapered shape in which the sectional area thereof is reduced toward the tip end thereof and, thus, in the removal process, the insulating films on the tip surface of the terminal part and a tapered surface constituting the tapered shape may be removed simultaneously by irradiation of laser beam toward the tip end of the terminal part. This can reduce the number of processes required to remove the insulating film.
In the present invention, the first process may be performed by electrodepositing the insulting film with at least a part of the terminal part covered with a mask member. This allows the process of removing the insulating film to be omitted.
As described above, according to the present invention, there can be provided a coil component capable of preventing the insulating film from being broken or peeled off during reflow and a manufacturing method for the coil component.
The above features and advantages of the present invention will be more apparent from the following description of certain preferred embodiments taken in conjunction with the accompanying drawings, in which:
Preferred embodiments of the present invention will be explained below in detail with reference to the accompanying drawings.
The coil component 10 according to the present embodiment is an inductance element for large current used for a power supply circuit and includes a magnetic core 20 and a conductor plate 30 as illustrated in
The first and second cores 21 and 22 are fixed to each other through a not-shown adhesive. The adhesive functions as a magnetic gap between the first and second cores 21 and 22, and leakage magnetic flux is generated from the magnetic gap. Therefore, it is possible to control the saturation magnetic flux density of the coil component 10 by the thickness of the adhesive. When the first and second cores 21 and 22 are combined, two through holes 20A and 20B extending in the x-direction are formed in the magnetic core 20. A part of the inner wall of each of the through holes 20A and 20B is constituted by the first core 21, and the remaining part thereof is constituted by the second core 22. The conductor plate 30 is inserted into the through holes 20A and 20B.
As illustrated in
The first terminal part 31 is a part formed by bending in the z-direction one end of the first body part 30A in the x-direction and serves as, e.g., an input terminal during actual use. The second terminal part 32 is a part formed by bending in the z-direction one end of the second body part 30B in the x-direction and serves as, e.g., an output terminal during actual use. The third terminal part is a part formed by bending in the z-direction a connection part connecting in the y-direction the other ends of the respective first and second body parts 30A and 30B in the x-direction and serves as, e.g., a dummy terminal during actual use. The dummy terminal is a terminal for fixing the coil component 10 to a circuit board by soldering and is not connected to a conductive pattern on the circuit board. However, the third terminal part 33 may not necessarily serve as the dummy electrode and may be used as an ordinary terminal electrode. The boundaries between the first and second body parts 30A and 30B and first to third terminal parts 31 to 33 are defined by portions where the metal element body 30S is bent by about 90° . The tip end portion of each of the first to third terminal parts 31 to 33 preferably protrudes slightly from the bottom surface of the magnetic core 20.
The surfaces of the respective first and second body parts 30A and 30B are entirely covered with the insulating film 40, and the surfaces of the respective first to third terminal parts 31 to 33 are partially covered with the first to third metal films 31a to 33a, respectively. The first to third metal films 31a to 33a are formed for ensuring solder wettability at mounting and are each made of a metal material, such as Sn or an alloy containing Sn (NiSn alloy, etc.) having a melting point lower than that of the metal element body. The film thickness of each of the first to third metal films 31a to 33a is preferably about 4 μm to about 20 μm and is preferably smaller than the film thickness of the insulating film 40. Alternatively, the first to third metal films 31a to 33a may each have a two-layer structure composed of an underlying Ni plating having a thickness of about 1 μm to about 3 μm and an Sn plating having a thickness of 4 μm to 20 μm formed on the surface of the Ni plating.
In the present embodiment, the surfaces of the first to third terminal parts 31 to 33 are covered respectively with the metal films 31a to 33a only in the vicinity of the tip end portions of the respective first to third terminal parts 31 to 33, and the remaining base portions thereof are covered with the insulating film 40. The insulating film 40 is directly formed on the surface of the metal element body 30S, and another film, particularly, a metal film made of the same metal material as those for the first to third metal films 31a to 33a is not interposed between the insulating film 40 and the surface of the metal element body 30S. Although not particularly limited, as the material for the insulating film 40, a resin material such as polyimide or epoxy resin is preferably used. The film thickness of the insulating film 40 is preferably about 5 μm to about 50 μm and more preferably about 5 μm to about 30 μm.
As illustrated in
With the above configuration, the coil component 10 according to the present embodiment can be used as an inductance element for power supply with the first and second terminal parts 31 and 32 serving, e.g., as input and output terminals, respectively. Although the magnetic core 20 is made of a magnetic material having conductivity, such as MnZn-based ferrite, the surface of the metal element body 30S is covered with the insulating film 40 at portions contacting the magnetic core 20, so that electrical short circuits between the metal element body 30S and the magnetic core 20 can be prevented. Particularly, in the present embodiment, the insulating film 40 is formed not only on the first and second body parts 30A and 30B, but also on the surfaces of the first to third terminal parts 31 to 33 except for the vicinities of the tip end portions, so that it is possible to more reliably prevent short circuits between the metal element body 30S and the magnetic core 20.
In addition, in the present embodiment, the insulating film 40 is directly formed on the metal element body 30S, and a metal film made of a metal material same as those for the first to third metal films 31a to 33a is not interposed between the insulating film 40 and the surface of the metal element body 30S. This prevents the insulating film 40 from being broken or peeled off due to heat during reflow, whereby product reliability can be enhanced.
Next, a manufacturing method for the coil component 10 according to the present embodiment will be described.
First, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
As described above, in the manufacturing process of the coil component 10, the metal films 31a to 33a are formed after electrodeposition of the insulating film 40 and partial removal thereof are performed, so that the insulating film 40 and metal films 31a to 33a can be formed on mutually different surfaces of the metal element body 30S. Thus, the metal film is not interposed between the metal element body 30S and the insulating film 40, preventing the insulating film 40 from being broken or peeled off due to heat during reflow. In addition, the insulating film 40 functions as a plating mask, allowing the metal films 31a to 33a to be selectively formed by plating without forming a plating mask separately.
As illustrated in
The connection part 75 is a part that short-circuits the third and fourth terminal parts 73 and 74, and the third and fourth terminal parts 73 and 74 protrude from the connection part 75 in the z-direction. Thus, unlike the coil component 10 according to the first embodiment, the coil component 50 according to the second embodiment has a four-terminal structure.
As illustrated in
Although not illustrated, the terminal parts 72 to 74 each have the same shape as that of the first terminal part 71. That is, the terminal parts 72 to 74 each have the tip surface S1, tapered surfaces S2, and side surfaces S3, and the surfaces S1 to S3 of the respective terminal parts 72 to 74 are covered respectively with the metal films 72a to 74a. As for the remaining part of each of the terminal parts 72 to 74, the first body part 70A, second body part 70B, and connection part 75, the surface of the metal element body 70S is covered with the insulating film 40 with the metal film (71a to 74a) not interposed.
As illustrated in
A reference numeral 50a in
As illustrated in
As described above, the coil component 50 according to the present embodiment has the four terminal parts 71 to 74, so that the difference in heat capacity among the terminal parts 71 to 74 is reduced. Thus, melting of the solders 85 occurs at substantially simultaneously at the terminal parts 71 to 74 during reflow, thereby making it possible to prevent an unintended rotation of the component due to the difference in melt timing. In addition, as described above, the cut parts 60N1 to 60N3 of the magnetic core 60 each have the tapered shape, making it also possible to prevent contact between the filler of the solder 85 and the magnetic core 60.
Next, a manufacturing method for the coil component 50 according to the present embodiment will be described.
First, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
As described above, in the present embodiment, the terminal parts 71 to 74 each have the tapered surfaces S2 in the vicinity of the tip end thereof, so that irradiation of the laser beam in the direction Z3 removes simultaneously the insulating films 40 on the tip surface S1 of each of the terminal parts 71 to 74 and the tapered surface S2 thereof. This reduces the number of processes required to remove the insulating film 40, allowing reduction in manufacturing cost.
It is apparent that the present invention is not limited to the above embodiments, but may be modified and changed without departing from the scope and spirit of the invention.
For example, in the above-described manufacturing processes, a part of the insulating film 40 is removed (see
Further, in the above-described coil component 10, the conductor plate 30 is bent in a substantially U-shape in a plan view; however, the shape of the conductor plate is not limited to this in the present invention. Thus, like the coil component 10A as illustrated in
A coil component 25A illustrated in
Further, like a coil component 10B illustrated in
Further, in the second embodiment, the side surfaces S3 of each of the terminal parts 71 to 74 constitute the yz plane; however, as illustrated in
Number | Date | Country | Kind |
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JP2018-013479 | Jan 2018 | JP | national |
JP2018-077309 | Apr 2018 | JP | national |
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