The present disclosure relates to a coil component and method of manufacturing a coil component.
Surface mount coil components are utilized in a variety of electronic devices. The coil components are mounted, often in high density, on a mounting substrate and should be mounted stably to provide robust and reliable bonding to the substrate.
The inventors realized that with the coil component configuration disclosed in the above-described publication, the lower stage portion TB2 of terminal portion having the step profile is more spaced from the mounting substrate than the upper stage portion TB1 at the time of mounting the coil component onto the mounting substrate. This results in an area of Sn around the upper stage portion TB1 that is small relative to the ratio of the overall surface area TB1+TB2, and adversely affects the wettability of the solder. Accordingly, the inventors sought to improve upon the conventional coil component.
The present disclosure has been made in view of the above-described problem and is directed to a coil component including a drum core including a winding core portion extending in a first direction and a pair of flange portions provided at both ends of the winding core portion. At least one flange of the pair of flange portions has at least one step or gradient portion. A terminal electrode is provided on the step or gradient portion, and a wire is wound around the winding core portion with an end bonded to the terminal electrode. The terminal electrode includes plural metal layers, an outermost layer of which is an Sn film having a flattened mounting surface, and the flattened mounting surface overlaps the step or gradient portion when seen in a second direction perpendicular to the first direction.
A coil component according to another aspect of the present disclosure comprises a drum core including a winding core portion extending in a first direction and a first flange portion and a second flange portion provided at both ends of the winding core portion. The first flange portion has a first portion, a second portion and at least one step or gradient portion between the first portion and second portion. A terminal electrode is provided on the step or gradient portion of the first flange portion, and a wire wound around the winding core portion with first ends bonded to the terminal electrode. The terminal electrode includes plural metal layers, an outermost layer of which is an Sn film having a flattened mounting surface, and the flattened mounting surface overlaps the first portion, the second portion and the step or gradient portion when seen in a second direction perpendicular to the first direction.
Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments of the present disclosure with reference to the attached drawings.
A first exemplary embodiment of a coil component 10 according to the present disclosure will be described with reference to
The first flange portions 40A includes at least one terminal electrode 60A, and the second flange portion 40B includes at least one terminal electrode 60B. A Cu wire 32 is wound around the winding core portion 30 to form a coil, and one terminal end of the coil is connected to terminal electrode 60A and another terminal end of the coil is connected to terminal electrode 60B. While not shown, winding core portion 30 can include plural coils and plural terminal electrodes on one or more of the flange portions.
The drum core 12 according to the first embodiment is made of a magnetic material, such as NiCuZn ferrite, although another magnetic material may be used. The drum core can be formed integrally (i.e., as one piece).
In the present disclosure, as illustrated in
As shown in
In an exemplary embodiment of the present disclosure shown in
With reference to
The Sn film includes first portion that is relatively thin in the height direction Td and a second portion adjacent to the first portion and that is relatively thick in the height direction Td when compared with the first portion. Both the first and second portions of the Sn film 68 include portions of the flattened surface 64, and the step portion 62 overlaps with the second portion when seen in the height direction Td.
Each flange portion 40A and 40B includes a first curved portion 61 or inner curved portion just before the step portion 62 and a second curved portion 63 or outer curved portion after the step portion 62, as shown in
The radius of curvature of the first curved portion 61 and the second curved portion 63 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, the first curved portion 61 has a radius of curvature of R0.02 mm, which is smaller than the radius of curvature of R0.03 mm of the second curved portion 63. With a greater radius of curvature for the inner curved portion compared with the outer curved portion, the bottom surface of the Sn film 68 tends to be flat. Further, the range of the step does not increase too much with a smaller outer curved surface.
A process for creating the flattened surface 64 is illustrated in
First, side surfaces of the first flange portion 40A and second flange portion 40B are immersed in a container filled with the Ag paste resulting in the Ag paste being attached to each of the side surface. The side surfaces include the steps 62 of each of the first flange portion 40A and the second flange portion 40B. The attached Ag paste on the sides of the first and second flanges is dried and baked to form the Ag thick film 65 as a base electrode of the terminal electrodes 60A and 60B.
After forming the Ag thick films 65, the Ni film 66, the Cu film 66, and a Sn film 680 are successively formed on each Ag thick film 65, for example, by electroplating or the like. Each of the Ag/Ni/Cu/Sn films 65 to 67 and 680 have a step shape due to conforming with the underlying step portion 62. Thus, the electrodes 60A and 60B are respectively formed on the flange portions 40A and 40B of the core, as shown in
As shown in
Prior to the thermo-compression bonding process, a wire 32 is wound around the winding core portion 30 to form a coil and both of terminal sections of the coil (wire 32) are pulled outward to be located above the outermost Sn films 680 of the respective terminal electrodes 60A and 60B. The heater chip 200 loads and heats these portions of the wire 32 and the terminal electrodes 60A and 60B to create a thermo-compression bond. During thermo-compression bonding, terminal sections 33a and 33b of the coil are sandwiched between the heater chip 200 and the respective electrodes 60A and 60B having the Ag/Ni/Cu/Sn films, and thereafter are pressed by press-contact force of the heater chip 200. Conditions for thermo-compression bonding include a Cu wire diameter of less than or equal to 20 μm, a load of 200 gf, and a temperature around 500° C.
As shown in
It is preferable that the Sn film 680 has a thickness of ½ or more of the height hs of the step because the surfaces of such flattened Sn films 68 tend to be more flat than with a lesser thickness.
It is preferable that a step height hs of the first and second flange portions 40A and 40B is equal to or less than 40 pm to sufficiently flatten the Sn film, and thus also the overall shapes of terminal electrodes 60A and 60B. The shapes of terminal electrodes 60A and 60B might not be rendered sufficiently flat using a step height hs greater than 40 μm.
A coil component according to the present disclosure lowers incidence of burrs at the time of wire cutting. Accordingly, crimp quality is improved. Additionally, at the time of mounting, a coil component according to the present disclosure is stabilized because outer surfaces of the terminal electrodes are flattened to increase contact area despite there being a difference in height due to the step. Thus, a coil component according to the present disclosure can be mounted stably on a mounting substrate, and solder wettability with respect to the terminal electrodes is enhanced.
The bottom portion of the Sn film 68 tends to be more flat when the width of the flattened surface 64 is ½ or greater than the total width of the flange portion 40A in the length direction Ld. It is therefore preferable that the width of the flattened surface 64 is ½ or greater than the width of the flange portion.
More particularly, as shown in
With reference to
The Sn film 868 includes a first portion that is relatively thin in the height direction Td and a second portion positioned adjacent to the first portion and relatively thick in the height direction Td compared with the first portion. Both the first and second portions of the Sn film 868 include portions of the flattened surface 864, and the step portion 862 overlaps with the second portion of the Sn film 868 when seen in the height direction Td.
The flange portion 840A includes a first curved portion 861 or inner curved portion just before the step portion 862 and a second curved portion 863 or outer curved portion just after the step portion 862, as shown in
The processes for forming the terminal electrode 860A (and other terminal electrode of the flange pair, not shown) including the flattened surface 864 is substantially the same as in the first embodiment, where a difference in the present process is a shape of the flange portion 840A.
As with the first embodiment, the radius of curvature of the first curved portion 861 and the second curved portion 863 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, the first curved portion 861 has a radius of curvature of R0.02 mm, which is smaller than the radius of curvature of R0.03 mm of the second curved portion 863.
As shown in
With reference to
The terminal electrode 960A is formed to cover sides of the flange portion 940A including the first and second step portions 962A and 962B. The terminal electrode 960A includes plural metal layers including an innermost Ag thick film 965, a Ni film 966, a Cu film 967, and an outermost Sn film 968. The outermost Sn film 968 has a flattened surface 964 that is configured to be solder mounted on a mounting surface.
The Sn film 968 includes a first portion that is relatively thin in the height direction Td, a second portion positioned adjacent to one side of the first portion and relatively thick in the height direction Td compared with the first portion, and a third portion positioned adjacent to another side of the first portion and also relatively thick in the height direction Td compared with the first portion. The first, second, and third portions of the Sn film 968 include portions of the flattened surface 964, the first step portion 962A overlaps with the second portion of the Sn film 968 when seen in the height direction Td, and the second step portion 962B overlaps with the third portion of the Sn film 968 when seen in the height direction Td.
As shown in
The processes for forming the terminal electrode 960A (and other terminal electrode of the flange pair, not shown) including the flattened surface 964 is substantially the same as in the first and second embodiments, where a difference in the present process is a shape of the flange portion 940A.
As with the first and second embodiments, the radius of curvature of the first curved portion 961, the second curved portion 963, the third curved portion 969, and the fourth curved portion 970 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, the first curved portion 961, second curved portion 963, and the fourth curved portion 970 have a radius of curvature of R0.02 mm, which is smaller than the radius of curvature of R0.03 mm of the third curved portion 969.
As shown in
With reference to
The terminal electrode 1060A can include plural metal layers including an innermost Ag thick film 1065, a Ni film 1066, a Cu film 1067, and an outermost Sn film 1068. The outermost Sn film 1068 has a flattened surface 1064 that is configured to be solder mounted on a mounting surface.
As shown in
The flange portion 1040A includes a first curved portion 1061 or inner curved portion just before the gradient portion 1062 and a second curved portion 1063 or outer curved portion just after the gradient portion 1062, as shown in FIG. 10. In other words, the first curved portion 1061 and the second curved portion 1063 are provided, respectively, at the beginning and end of a gradient portion 1062. Such planes formed before and after a gradient portion facilitate the flattening of the Sn film 1068.
The processes for forming the terminal electrode 1060A (and other terminal electrode of the flange pair, not shown) including the flattened surface 1064 is substantially the same as in the first embodiment, where a difference in the present process is a shape of the flange portion 1040A. Additionally, the Ni film 1066 and the Cu film 1067 retain a gradient shape after forming the flattened Sn film 1068.
As with the first to third embodiments, the radius of curvature of the first curved portion 1061 and the second curved portion 1063 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, both the first curved portion 1061 and the second curved portion 1063 have a radius of curvature of R0.04 mm.
More particularly, as shown in
With reference to
The Sn film 1168 includes first portion that is relatively thin in the height direction Td and a second portion positioned adjacent to the first portion and relatively thick in the height direction Td compared with the first portion. Both the first and second portions of the Sn film 1168 include portions of the flattened surface 1164, and the gradient portion 1162 overlaps with the second portion of the Sn film 1168 when seen in the height direction Td.
The flange portion 1140A includes a first curved portion 1161 just before the gradient portion 1162 and a second curved portion 1163 just after the gradient portion 1162, as shown in
The processes for forming the terminal electrode 1160A (and other terminal electrode of the flange pair, not shown) including the flattened surface 1164 is substantially the same as in the first embodiment, where a difference in the present process is a shape of the flange portion 1140A.
As with the first to fourth embodiments, the radius of curvature of the first curved portion 1161 and the second curved portion 1163 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, the first curved portion 1161 and the second curved portion 1163 have and equal radius of curvature of R0.04 mm.
As shown in
With reference to
The terminal electrode 1260A is formed to cover sides of the flange portion 1240A including the first and second gradient portions 1262A and 1262B. The terminal electrode 1260A includes plural metal layers including an innermost Ag thick film 1265, a Ni film 1266, a Cu film 1267, and an outermost Sn film 1268. The outermost Sn film 1268 has a flattened surface 1264 that is configured to be solder mounted on a mounting surface.
The Sn film 1268 includes first portion that is relatively thin in the height direction Td, a second portion positioned adjacent to one side of the first portion and relatively thick in the height direction Td compared with the first portion, and a third portion positioned adjacent to another side of the first portion and also relatively thick in the height direction Td compared with the first portion. The first, second, and third portions of the Sn film 1268 include portions of the flattened surface 1264, the first gradient portion 1262A overlaps with the second portion of the Sn film 1268 when seen in the height direction Td, and the second gradient portion 1262B overlaps with the third portion of the Sn film 1268 when seen in the height direction Td.
As shown in
The processes for forming the terminal electrode 1260A (and other terminal electrode of the flange pair, not shown) including the flattened surface 1264 is substantially the same as in the first and second embodiments, where a difference in the present process is a shape of the flange portion 1240A.
As with the first to fifth embodiments, the radius of curvature of the first curved portion 1261, the second curved portion 1263, the third curved portion 1269, and the fourth curved portion 1270 can be the same for ease of manufacturing or different for greater degree of design freedom. In this example, the first curved portion 1261, second curved portion 1263, the third curved portion 1269, and the fourth curved surface 1270 all have a radius of curvature of R0.04 mm.
While
With reference to
The Sn film 1368 includes first portion that is relatively thin in the height direction Td and a second portion positioned adjacent to the first portion and relatively thick in the height direction Td compared with the first portion. Both the first and second portions of the Sn film 1368 include portions of the flattened surface 1364, and the step portion 1362 overlaps with the second portion of the Sn film 1368 when seen in the height direction Td. As with other exemplary embodiments described herein, step portion 1362 is preceded by a first curved portion 1361 or inner curved portion just before the gradient portion 1362 and a second curved portion 1363 or outer curved portion just after the gradient portion 1362, as shown in
In the first to sixth embodiments, a Cu layer is utilized in the terminal electrodes to prevent Cu elution to a solder from the Cu wire 32, but the Cu layer may not be needed.
It is to be understood that the same Ag/Ni/Sn terminal electrode metallization of the seventh embodiment can be applied to any of the exemplary embodiments described herein.
A method of manufacturing the coil component 260 according to the seventh embodiment is substantially the same as described above, except the electroplating processes do not include a Cu plating step, and the Sn film 1368 is plated directly on the Ni film 1366.
The eighth embodiment is similar to the first embodiment, but is different in that metallization of terminal electrode 1460A on the flange portion 1440A additionally includes an alloy film containing Cu and Sn.
While
With reference to
Embodiments 1, 4, 7 and 8 each have a step or gradient of each flange on the winding core side of the flange. With such a configuration, the posture of the coil component at the time of mounting is stabilized because the center of gravity of the flange approaches the outside.
Embodiments 2 and 5 each have a step or gradient of each flange on the side of the flange opposite to the winding core portion side of the flange. With such a configuration, since the wire can be crimped inside the flange, it is possible to reduce the Rdc. Further, since an acute angle would be present in the direction of pulling out of the wire in these configurations, it is easy to provide tension to the wire, and thus suppress the occurrence of burrs during wire cutting.
In embodiments 3 and 6, where each flange has plural steps or gradients, one step or gradient on a winding core portion side of the flange and another step or gradient on a side of the flange opposite the winding core portion side, the above effects the stabilizing the posture of the coil component at the time of mounting, reducing Rdc, and providing tension to the wire at an acute angle can be balanced.
The preferred embodiments described above are provided for facilitating understanding the disclosure, but are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Modifications and/or improvements may be made to the disclosure without departing from the scope and spirit of the disclosure, and equivalents of the disclosure are also encompassed in the disclosure. That is, suitable design changes made to the preferred embodiments by those skilled in the art are also encompassed in the disclosure as long as they are within the scope and spirit of the disclosure. For example, the elements of the preferred embodiments and the positions, materials, conditions, configurations, and sizes thereof are not restricted to those described in the embodiments and may be changed in an appropriate manner.
While exemplary embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims.
This application is a non-provisional application of U.S. Provisional Application No. 62/912,302 filed Oct. 8, 2019, the entire content of which is incorporated herein by reference.
Number | Date | Country | |
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62912302 | Oct 2019 | US |