The present invention relates to a coil component used in various electronic apparatuses, and a method of manufacturing the same.
A conventional coil component will be described in the following with reference to the drawings.
In
The packaging 53 is formed under a constant molding pressure over the entire part thereof, and also the packaging 53 is nearly uniform in density over the entire part thereof.
In the configuration of such conventional coil component, when intended to lower a height of the coil component, it is necessary to increase the molding pressure applied to the packaging 53 in order to entirely compress the packaging 53.
However, although the height of the packaging 53 can be lowered by compressing the packaging 53, the top and bottom portions of the packaging 53 are also reduced in thickness. Accordingly, there has been a problem that magnetic saturation is liable to occur, worsening the reliability, when the magnetic flux passing in the through-hole of the coil 52 passes through the top and bottom portions of the packaging 53.
In order to address the above problem, the present invention provides a coil component improved in reliability, in which magnetic saturation hardly occurs even when the top and bottom portions of the coil component are reduced in thickness for the purpose of lowering the height of the coil component.
Packaging of the coil component of the present invention is a compressed powder magnetic core containing magnetic powder, comprising a top portion disposed at an upper part of the coil, a bottom portion disposed at a lower part of the coil, and a middle portion corresponding to the height of the coil. Also, the outer layer thickness (distance between the coil and the packaging surface) of the middle portion of the packaging including the coil is less than a diameter of the through-hole of the coil, and at the same time, a density of the top portion and the bottom portion are higher than that of the middle portion.
By the above configuration, it is possible to eliminate the occurrence of magnetic saturation at the top portion and the bottom portion even when the top and bottom portions of the packaging are lowered in height by compressing until the outer layer thickness of the middle portion including the coil becomes less than the diameter of the through-hole of the coil. This is because the density of the top portion and the bottom portion are higher than that of the middle portion.
That is, a density of the inside of the through-hole of the coil, which corresponds to the middle portion of the packaging, is lower than densities of the top and bottom portions of the packaging. Accordingly, even when the magnetic flux passing through the through-hole passes through the top and bottom portions whose thicknesses are less than the diameter of the through-hole, magnetic saturation does not occur at the top and bottom portions, enabling the lowering of the height of the coil component. This is because the magnetic permeability can be increased in the top and bottom portions where the packaging density is higher than the middle portion.
a) to 3(e) respectively show a part of the manufacturing process for the coil component.
a) to 7(e) respectively show a part of a manufacturing process of another coil component of the present invention.
a) to 8(d) respectively show a part of a manufacturing process of yet another coil component of the present invention.
The present invention will be described in the following embodiment with reference to the drawings.
In
Also, the packaging 3 is a compressed powder magnetic core (dust core) containing magnetic powder. The materials for the packaging 3 comprise thermosetting binder resin comprising silicone resin of tough resin component and elastic resin component and magnetic powder. The materials are mixed without heating so that the thermosetting resin does not cure and is molded under a pressure ranging from 0.5 to 2.0 t/cm2, thereby forming compressed powder body 5. Further, the compressed powder body 5 is subjected to re-molding under a pressure ranging from 3.0 to 5.0 t/cm2 so as to encapsulate the coil 2 while being heated at 100° C. to 180° C. so that the thermosetting resin completely cures, thereby molding packaging 3.
The compressed powder magnetic core (dust core) employs heat-treated soft magnetic alloy powder as magnetic powder. The magnetic alloy powder ranges from 1 μm to 100 μm in average particle diameter, and it includes component A, chrome (Cr), oxygen (O), manganese (Mn), carbon (C) and iron (Fe). Component A includes at least one selected from the group consisting of silicon (Si), aluminum (Al), titanium (Ti) and magnesium (Mg). The composition of each component is as follows: 1 wt %≦component A≦7 wt %, 2 wt %≦Cr≦8 wt %, 0.05 wt %≦O≦0.6 wt %, 0.01 wt %≦Mn≦0.2 wt %, 0.005 wt %≦C≦0.2 wt %, and the rest is iron (Fe). Depending on the conditions where the coil components are used, it is possible to use nickel (Ni) of 2 wt %≦Ni≦15 wt % in place of component A.
Two compressed powder bodies 5 are used for molding the packaging 3 as shown in
As shown in
Here, the expression that the shape of compressed powder body 5 is “collapsed” means that the shape is collapsed to a size of particle size of the magnetic powder. The strong portion has a strength high enough to keep the shape of compressed powder body 5. A state of being broken into blocks (lumps) is not included in the range of being weak since the shape is not broken into the particle size of the magnetic powder.
And as shown in
In that case, the packaging 3 is molded so that an outer layer thickness (W1) shown in
Particularly, the middle portion 13 is formed so that a density of the outside middle portion 14 is higher than a density of the inside middle portion 15.
As for these densities, the densities of the top portion 11 and bottom portion 12 are in a range from 5.0 to 6.0 g/cm3 and that of the inside middle portion 13 is 85% to 98% of the densities of the top portion 11 and bottom portion 12.
The manufacturing method of the present invention will be described in the following.
The manufacturing method of the present invention comprises a packaging molding process for encapsulating coil 2 in packaging 3 made up of magnetic material, and a terminal forming process for forming terminals 4 connected to the coil 2.
First, the packaging molding process comprises a step of molding two compressed powder bodies 5 where a thermosetting resin binder, which includes silicone resin having tough resin component and elastic resin component, and magnetic powder are mixed without heating so that the thermosetting resin does not cure, and are molded under pressure.
Compressed powder body 5 has a pot shape with an E-shaped cross section with back portion 6, a central portion 7 and an outside portion 8, and the back portion 6 is a strong portion that is able to keep the shape of compressed powder body 5 during re-molding under pressure, while the central portion and the outside portion respectively serve as a weak portion that is unable to keep the shape of compressed powder body 5 during re-molding under pressure.
Next, the coil 2 is placed in the mold so that the top and bottom thereof are held by the strong portions of two compressed powder bodies 5, then the two compressed powder bodies 5 are re-molded under heat and pressure for molding the packaging 3. In this molding process, the outer periphery of coil 2 and the inside of through-hole 1 are covered with the weak portion.
In the re-molding, as shown in
Particularly, due to the pressure applied during the re-molding operation, the back portion 6 (strong portion) of each compressed powder body 5 that opposes the inner part of through-hole 1 of coil 2 is buried into the through-hole 1 of coil 2 in a block. Also, while the back portion 6 (strong portion) of each compressed powder body 5 that opposes each terminal 4 is buried toward the terminal 4 in a block, the central portion 7 (weak portion) and outside portion 8 (weak portion) of compressed powder body 5 are collapsed, thereby covering the remaining outer periphery of coil 2 and the inner part of through-hole 1.
With the mold appropriately designed, in the packaging molding process, it is possible to make the outer layer thickness (W1) of the middle portion including the coil 2 less than the diameter of through-hole 1 of the coil 2. Also, according to the manufacturing method of the present invention, top portion 11 at the upper part of coil 2 and bottom portion 12 at the lower part of coil 2 are formed higher in density than the middle portion 13 corresponding to the height part of coil 2.
Further, as for the middle portion 13, there are provided inside middle portion 15 corresponding to the through-hole 1 of coil 2 and outside middle portion 14 corresponding to the outer periphery of coil 2, and the outside middle portion 14 is formed higher in density than the inside middle portion 15.
And the packaging 3 is molded so that the densities of the top portion 11 and bottom portion 12 is in a range from 5.0 to 6.0 g/cm3, while that of the inner middle portion 13 is 85% to 98% of the densities.
By the above configuration and method, even when the height of a coil component is lowered as a whole by making the outer layer thickness (W1) of the middle portion including the coil 2 less than the diameter of through-hole 1 and by forming the top portion 11 and bottom portion 12, reducing the thickness thereof, it is possible to form the top portion 11 and the bottom portion 12 higher in density than the middle portion 13. As a result, it is possible to suppress the occurrence of magnetic saturation at the top portion 11 and the bottom portion 12.
That is, the top portion 11 and bottom portion 12 of the packaging 3 are higher in density than the inner part 15 of middle portion 13, which corresponds to the inside of through-hole 1. Accordingly, even when the magnetic flux passing through the through-hole 1 passes through the top portion 11 and the bottom portion 12 whose thickness (W2, W3) is less than the diameter of through-hole 1, the top portion 11 and the bottom portion 12 can obtain higher magnetic permeability since the top portion 11 and the bottom portion 12 are higher in density than the middle portion 13. As a result, the height of the coil component can be lowered without allowing the occurrence of magnetic saturation at the top portion 11 and the bottom portion 12.
Also, the middle portion 13 includes inside middle portion 15 corresponding to through-hole 1 and outside middle portion 14 corresponding to the outside portion of coil 2. Since the outside middle portion 14 is higher in density than the inside middle portion 15, outside middle portion 14 can obtain higher magnetic permeability. Accordingly, it is possible to reduce the size of the coil component in the lateral direction thereof and to save the space for mounting of the coil component without allowing the occurrence of magnetic saturation at the outside middle portion 14.
Particularly, the packaging 3 is molded so that the densities of the top portion 11 and bottom portion 12 are in a range from 5.0 to 6.0 g/cm3 and that of the inner middle portion 13 is 85% to 98% of the densities, and therefore, excessive stresses will not be applied to the coil 2. At the same time, it is possible to suppress the breakdown of packaging 3 itself due to internal stresses or the like while suppressing the breakdown of coil 2. Also, it is possible to suppress the occurrence of magnetic saturation and to make the coil component smaller in size.
The packaging 3 is a compressed powder magnetic core, and has a specific composition. That is, the ratio of Fe component is high and it is advantageous for DC-bias characteristics. Moreover, having the compressed powder magnetic core Cr component suppresses the generation of rust due to the presence of the Fe component. Further, since the Cr content is not more than 8 wt %, it is possible to suppress a loss in a frequency range of higher than 100 kHz. In this way, the present invention is able to realize a composite magnetic material having excellent corrosion resistance without losing the magnetic characteristic.
Also, an ordinary powder molding generally uses powder for the molding, but in the present invention where solid compressed powder body 5 is used, the quantity of compressed powder body 5 between the punch 9 and the coil 2 hardly varies during re-molding under pressure, and the covering thickness of packaging 3 is easier to make uniform over the entire periphery of coil 2. Accordingly, it is possible to suppress the dispersions in characteristics such as inductance, saturation characteristic and magnetic losses during DC-biasing of the inductance. Further, since the coil 2 can be held by compressed powder bodies 5, the coil 2 is precisely positioned, and defective molding of packaging 3 may be prevented. Regarding the compressed powder body 5, magnetic powder and binder including thermosetting resin are mixed and pressed to form compressed powder body 5. And, the thermosetting resin includes silicone resin having tough resin component and elastic resin component, and therefore it is possible to mold the packaging well balanced in strength and brittleness, and to minimize defects of packaging 3.
Further, since coil 2 is covered when compressed powder body 5 is re-molded under pressure, the coil 2 can be precisely covered. Also, as gaps between compressed powder 5 and coil 2 can be completely filled, it is possible to improve the magnetic efficiency by reducing the magnetic gaps.
Particularly, as the strong portion of compressed powder body 5 reliably holds one side of coil 2, the position of coil 2 is hardly misaligned during re-molding under pressure, and another side of coil 2 can be easily covered with the weak portion of compressed powder body 5 as the weak portion collapses. Accordingly, it is possible to make the covering of packaging 3 uniform in thickness over the entire periphery of coil 2 and to suppress the dispersions in characteristics of the coil component.
Also, the compressed powder body 5 is in a pot shape with an E-shaped cross section with back portion 6, a central portion 7 and an outside portion 8, and the back portion 6 is a strong portion, while the central portion 7 and the outside portion 8 respectively serve as a weak portion. As a result, positional misregistration (misalignment) hardly occur due to the strong portion of compressed powder body 5, and it is easier to cover the other side of coil 2, and the dispersions in characteristics of the coil component can be reduced.
As described above, according to the embodiment of the present invention, the covering of packaging 3 is more easily made uniform in thickness over the entire periphery of coil 2, and it is possible to reduce the dispersions in characteristics and also to obtain higher magnetic permeability in top portion 11 and bottom portion 12 as the top portion 11 and bottom portion 12 of packaging 3 are higher in density than the middle portion 13. Also, the height can be lowered without allowing the occurrence of magnetic saturation at the top portion 11 and the bottom portion 12.
In the embodiment of the present invention, the compressed powder 5 has an E-shaped cross section, but it is also possible to make the central portion 7 longer or shorter than the outside portion 8 provided that the shape is within the scope of the present invention. Particularly, a T-shaped cross section with only the central portion 7 formed at the back portion 6 and a C-shaped cross section with only the outside portion 8 formed at the portion can be considered equivalent to the E-shaped cross section of the present embodiment.
Also, as for the relative positions of coil 2 and compressed powder bodies 5, one side of the coil 2 may be held by a strong portion of one compressed powder body 5, while another side of the coil 2 is supported by a weak portion of another compressed powder body 5. In that case, it is also allowable to make the strong portion of E-shaped compressed powder body 5 higher in density than the weak portion.
Further, as for the coil 2, it is allowable to wind a flat wire as well as a round wire into an edgewise coil. In this case, it is possible to enhance the space factor of the coil and to make it compatible with high current. Especially, when a flat wire is tightly wound so that packaging 3 will not be molded between the adjacent flat wires, it is possible to suppress the generation of magnetic flux that circulates around the flat wire and to reduce the losses since the packaging 3 is not molded between the flat wires.
As other examples of molding, as shown in
In the present embodiment of the present invention, before or during re-molding under pressure, one side of the coil 2 is supported by the strong portion of compressed powder body 5, but it is preferable to let one side of the coil 2 be supported by the strong portion of the compressed powder body even after re-molding under pressure.
According to the present invention as described above, even when the height of a coil component is lowered as a whole by forming the top portion of the packaging, corresponding to the upper part of the coil, and the bottom portion of the packaging, corresponding to the lower part of the coil, less in thickness until the outer layer thickness of the middle portion including the coil becomes less than the diameter of the through-hole of the coil, it is possible to suppress the occurrence of magnetic saturation at the top and bottom portions since the top portion and the bottom portion are higher in density than the middle portion.
That is, the density of the inside of the through-hole of the coil, which corresponds to the middle portion of the packaging, is lower than the density of the top portion and bottom portion of the packaging. Accordingly, the magnetic permeability can be increased at the top portion and bottom portion as the top portion and bottom portion are higher in density than the middle portion. Thus, it is possible to provide a coil component and its manufacturing method by which the height can be lowered without allowing the occurrence of magnetic saturation at the top and bottom portions even when the magnetic flux passing through the through-hole of the coil passes through the top portion and the bottom portion whose thickness is less than the diameter of the through-hole.
Number | Date | Country | Kind |
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2001-051803 | Feb 2001 | JP | national |
2002-012515 | Jan 2002 | JP | national |
2002-015051 | Jan 2002 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP02/01736 | 2/26/2002 | WO | 00 | 6/26/2003 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO02/069360 | 9/6/2002 | WO | A |
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6661328 | Inoue et al. | Dec 2003 | B1 |
Number | Date | Country |
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199 01 255 | Jul 2000 | DE |
Number | Date | Country | |
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20040046626 A1 | Mar 2004 | US |