This application claims benefit of priority to Japanese Patent Application No. 2020-204653, filed Dec. 10, 2020, the entire content of which is incorporated herein by reference.
The present disclosure relates to a winding-type coil component having a structure in which a wire is wound around a winding core portion, and particularly relates to a connection structure between a wire and a terminal electrode.
As a technique of interest for the present disclosure, for example, there is a technique described in Japanese Patent Application Laid-Open No. 10-312922. Japanese Patent Application Laid-Open No. 10-312922 describes a coil component having a structure in which a wire and a terminal electrode are connected by thermocompression bonding.
As illustrated in
In the thermocompression bonding process described above, the terminal 8 of the wire is disposed on the terminal electrode 4, and in this state, the terminal 8 of the wire is pushed toward the terminal electrode 4 by a heater chip (not illustrated). As a result, the terminal 8 of the wire is crushed so as to have a flat section, and is embedded up to a position substantially flush with the surface of the solder wettable layer 7. In this way, a highly reliable bonding state is obtained between the terminal 8 of the wire and the terminal electrode 4.
It has been found that in accordance with advancement in miniaturization of the core, diversification (thickening and thinning) of the wire diameter, and high heat resistance of the insulation film of the wire, and changes in required specifications such as an increase in load of the reliability test, a desired connection state may not be obtained although the terminal 8 of the wire and the solder wettable layer 7 of the terminal electrode 4 are connected by the thermocompression bonding as described in Japanese Patent Application Laid-Open No. 10-312922 described above.
For example, in the thermocompression bonding process, in a case where the terminal 8 of the wire is pressurized to a position substantially flush with the surface of the solder wettable layer 7, the flange portion 2 of the core 1, the winding core portion, or the terminal 8 of the wire cannot withstand the thermocompression bonding and may be damaged, or the solder wettable layer 7 may scatter around the terminal 8 of the wire as illustrated in
It has been found that in a case where the damage described above is fine, or the degree of scattering of the solder wettable layer 7 is low, there is no problem under the conventional reliability test conditions, but the damage of the core 1, the disconnection of the wire, the peeling of the terminal electrode 4, and the like may be caused under the high-load reliability test conditions.
On the other hand, when the thermocompression bonding condition is loosened in order to avoid excessive thermocompression bonding as described above, as illustrated in
Due to insufficient thermocompression bonding, the terminal 8 of the wire may protrude largely from the solder wettable layer 7. In this case, in the coil component having a structure in which the bottom surface 3 of the flange portion 2 provided with the terminal electrode 4 faces the mounting surface at the time of mounting, and the terminal 8 of the wire is thermocompression-bonded to the terminal electrode 4 on the bottom surface 3, the protruding terminal 8 of the wire inhibits wet spreading of the solder paste used for mounting. Further, the protrusion of the terminal 8 of the wire on the bottom surface 3 of the flange portion 2 also leads to destabilization of the posture of the coil component before being fixed to the mounting substrate. In particular, the problem of the destabilization of the posture of the coil component at the time of mounting is more likely to occur due to the weight reduction of the coil component, the narrowing of the mounting area, and the narrowing of the terminal electrode area.
As described above, particularly in the coil component in which the terminal electrode 4 and the terminal 8 of the wire are thermocompression-bonded on the bottom surface 3 of the flange portion 2, the difficulty of thermocompression bonding is increased.
Incidentally, the coil component usually includes at least two terminal electrodes, and the terminal of the wire is connected to each of the terminal electrodes. Therefore, it is ideal that the various problems described above are solved for all connections between the terminal electrodes and the terminals of the wires. However, also in a case where the problem is solved only for the connection between one terminal electrode and one terminal of the wire, it should be considered that improvement is made toward solving the problem as compared with a case where the problem is not solved at all.
Therefore, the present disclosure provides a coil component in which a terminal electrode and a terminal of a wire are connected by thermocompression bonding on a bottom surface of a flange portion and in which as a result of performing thermocompression bonding under appropriate conditions without excess or deficiency, not only core damage, wire disconnection, peeling of the terminal electrode, and the like are difficult to occur, but also in a connection state between the terminal electrode and the terminal of the wire, a strong fixing force is obtained, and inconvenience due to protrusion of the terminal of the wire from the terminal electrode is difficult to occur.
According to the present disclosure, a coil component includes a core which includes a winding core portion extending in an axial direction, and a first flange portion and a second flange portion respectively provided at a first end and a second end of the winding core portion opposite to each other in the axial direction; a first terminal electrode provided on the first flange portion; a second terminal electrode provided on the second flange portion; and a first wire wound around the winding core portion.
The first wire has a first terminal connected to the first terminal electrode and a second terminal connected to the second terminal electrode.
The first flange portion has a first bottom surface facing a mounting surface side, and the second flange portion has a second bottom surface facing the mounting surface side.
The first terminal electrode has a first main surface extending along the first bottom surface, and the second terminal electrode has a second main surface extending along the second bottom surface.
The first terminal is in a state of extending along the first main surface while at least a part of the first terminal is disposed in the first terminal electrode and has a first top surface which is positioned on a side opposite to the first bottom surface side with respect to the first main surface.
In addition, in the coil component according to the present disclosure, an outer surface of the first terminal electrode has a first fillet surface which rises from the first main surface toward the first top surface and forms a concave curved surface.
According to the present disclosure, the first fillet surface which rises from the first main surface of the first terminal electrode toward the first top surface of the first wire and forms the concave curved surface is provided on the outer surface of the first terminal electrode provided on the bottom surface of the flange portion. Accordingly, it is possible to check that thermocompression bonding between the first terminal electrode and the first terminal of the first wire is performed under appropriate conditions without excess or deficiency. As a result, core damage, wire disconnection, peeling of the first terminal electrode, and the like can be made difficult to occur also under a high load environment.
The formation of the first fillet surface in the first terminal electrode can increase the bonding area between the first terminal of the first wire and the first terminal electrode, and can alleviate the stress concentration in the first terminal electrode. Thus, the fixing force between the first terminal electrode and the first terminal of the first wire which are connected can be improved.
The formation of the first fillet surface in the first terminal electrode can alleviate the sharpness of the protruding state of the first terminal of the first wire from the first terminal electrode. Thus, also in a coil component having a structure in which the first terminal of the first wire is connected to the first terminal electrode on the first bottom surface of the first flange portion, the wet spreading of the solder paste used for mounting can be made more difficult to be hindered, and the posture of the coil component before being fixed to the mounting substrate can be made more difficult to be destabilized.
Referring to
The coil component 11 further includes a top plate 16 that connects one pair of flange portions 13 and 14 included in the core 15. When both the core 15 and the top plate 16 are configured of a magnetic material, the top plate 16 can configure a closed magnetic circuit around which a magnetic flux circulates in cooperation with the core 15.
A first terminal electrode 17 and a third terminal electrode 19 are provided on the first flange portion 13. A second terminal electrode 18 and a fourth terminal electrode 20 are provided on the second flange portion 14.
A first wire 21 and a second wire 22 are wound around the winding core portion 12 in the same direction. The first wire 21 has a first terminal 21a connected to the first terminal electrode 17 and a second terminal 21b connected to the second terminal electrode 18. The second wire 22 has a third terminal 22a connected to the third terminal electrode 19 and a fourth terminal 22b connected to the fourth terminal electrode 20.
The first flange portion 13 has a first bottom surface 23 facing the mounting surface side. The second flange portion 14 has a second bottom surface 24 facing the mounting surface side.
The first terminal electrode 17 is provided on the first bottom surface 23 and is provided so as to extend from the first bottom surface 23 to a part of each of a plurality of surfaces adjacent thereto. The second terminal electrode 18 is provided on the second bottom surface 24 and is provided so as to extend from the second bottom surface 24 to a part of each of a plurality of surfaces adjacent thereto. The first terminal electrode 17 has a first main surface 25 extending along the first bottom surface 23. The second terminal electrode 18 has a second main surface 26 extending along the second bottom surface 24.
The third terminal electrode 19 is provided on the first bottom surface 23 in a state of being separated from the first terminal electrode 17 by a predetermined interval, and is provided so as to extend from the first bottom surface 23 to a part of each of the plurality of surfaces adjacent thereto. The fourth terminal electrode 20 is provided on the second bottom surface 24 in a state of being separated from the second terminal electrode 18 by a predetermined interval, and is provided so as to extend from the second bottom surface 24 to a part of each of the plurality of surfaces adjacent thereto. The third terminal electrode 19 has a third main surface 27 extending along the first bottom surface 23. The fourth terminal electrode 20 has a fourth main surface 28 extending along the second bottom surface 24.
The first terminal electrode 17 is positioned on the first bottom surface 23 of the first flange portion 13, and includes, for example, a highly conductive material layer 29 made of silver, copper, an alloy thereof or the like, a solder resistant material layer 30 made of nickel or the like thereon, and a solder wettable layer 31 made of tin, a tin alloy, or the like thereon. The first main surface 25 of the first terminal electrode 17 described above is provided by the solder wettable layer 31 configuring the outermost layer. Usually, the highly conductive material layer 29 is formed by baking a conductive paste, but may be formed by sputtering. Further, the solder resistant material layer 30 and the solder wettable layer 31 are usually formed by plating.
The first wire 21 is made of, for example, a core wire having a circular section made of copper and an insulation film made of a resin such as polyurethane or polyimide covering the peripheral surface of the core wire. As the first wire 21, a wire having a core wire diameter of 20 pm to 150 pm is preferably used. In this case, as a result of the above-described thermocompression bonding, the first terminal 21a of the first wire 21 crushed so as to have a flat section preferably has a width direction dimension (the dimension measured in a right-left direction in
As an example, it is assumed that a core wire having a diameter of 30 pm is used as the first wire 21. In this case, as a result of thermocompression bonding, the first terminal 21a of the first wire 21 crushed so as to have a flat section has a width direction dimension of the section of 40 μm, that is, exhibits an increase rate of +33%, and on the other hand, has a height direction dimension of the section of 15 μm, that is, exhibits a decrease rate of −50%.
The second wire 22 is also substantially similar to the first wire 21.
As a result of the thermocompression bonding described above, as described above, at least a part of the first terminal 21a of the first wire 21 is disposed in the first terminal electrode 17, more specifically, in the solder wettable layer 31. The first terminal 21a of the first wire 21 is in a state of extending along the first main surface 25 of the first terminal electrode 17. At this time, a top surface 33 of the first terminal 21a is positioned on the side opposite to the first bottom surface 23 side of the first flange portion 13 with respect to the first main surface 25 of the first terminal electrode 17. More notably, the outer surface of the first terminal electrode 17 is provided with a fillet surface 37 which rises from the first main surface 25 toward the top surface 33 of the first terminal 21a of the first wire 21 and forms a concave curved surface.
As described above, when the fillet surface 37 is provided, it can be checked that thermocompression bonding between the first terminal electrode 17 and the first terminal 21a of the first wire 21 is performed under appropriate conditions without excess or deficiency. This makes it difficult to cause damage to the core 15, disconnection of the wire 21, peeling of the first terminal electrode 17, and the like also under a high load environment.
The formation of the fillet surface 37 in the first terminal electrode 17 can increase the bonding area between the first terminal 21a of the first wire 21 and the first terminal electrode 17, and can alleviate the stress concentration in the first terminal electrode 17. Thus, the fixing force between the first terminal electrode 17 and the first terminal 21a of the first wire 21 which are connected can be improved.
The formation of the fillet surface 37 in the first terminal electrode 17 can alleviate the sharpness of the protruding state of the first terminal 21a of the first wire 21 from the first terminal electrode 17. Thus, also in a structure in which the first terminal 21a of the first wire 21 is connected to the first terminal electrode 17 on the first bottom surface 23 of the first flange portion 13 as in the illustrated coil component 11, the wet spreading of the solder paste used for mounting can be made more difficult to be hindered, and the posture of the coil component 11 before being fixed to the mounting substrate can be made more difficult to be destabilized.
The embodiment illustrated in
The above feature contributes to reducing the sharpness of the protruding state of the first terminal 21a of the first wire 21 from the first terminal electrode 17. Therefore, due to this feature, the wet spreading of the solder paste used for mounting can be made more difficult to be hindered, and the posture of the coil component 11 before being fixed to the mounting substrate can be made more difficult to be destabilized.
The embodiment illustrated in
According to the above feature, the bonding area between the first terminal electrode 17 and the first terminal 21a of the first wire 21 can be increased, and thus, the fixing force between the first terminal electrode 17 and the first terminal 21a of the first wire 21 which are connected can be improved. Further, the exposed area of the first terminal 21a of the first wire 21 from the first terminal electrode 17 can be reduced, and thus as in the case described above, the wet spreading of the solder paste used for mounting can be made more difficult to be hindered, and the posture of the coil component 11 before being fixed to the mounting substrate can be made more difficult to be destabilized.
The above description relates to the first terminal electrode 17 and the first wire 21 of the first terminal 21a illustrated in
Therefore, in consideration that the characteristic connection structure of the present disclosure can be applied to the connection portions of all terminal electrodes and the terminals of all wires connected thereto, the top surface 33 of the first terminal 21a in the first wire 21 is referred to as a “first top surface 33”, and the top surfaces of the second terminal 21b, the third terminal 22a, land the fourth terminal 22b are referred to as a “second top surface 34”, a “third top surface 35”, and a “fourth top surface 36”, respectively. Further, the fillet surface 37 formed on the first terminal electrode 17 is referred to as a “first fillet surface 37”, and the fillet surfaces formed on the second terminal electrode 18, the third terminal electrode 19, and the fourth terminal electrode 20 are referred to as a “second fillet surface 38”, a “third fillet surface 39”, and a “fourth fillet surface 40”, respectively.
A second embodiment of the present disclosure will be described with reference to
The embodiment illustrated in
According to the above feature, the sharpness of the protruding state of the first terminal 21a of the first wire 21 with respect to the first main surface 25 of the first terminal electrode 17 can be alleviated. Thus, the wet spreading of the solder paste used for mounting can be made more difficult to be hindered, and the posture of the coil component 11 before being fixed to the mounting substrate can be made more difficult to be destabilized.
A third embodiment of the present disclosure will be described with reference to
The embodiment illustrated in
According to the above feature, as compared with the case of the embodiment illustrated in
A fourth embodiment of the present disclosure will be described with reference to
First, on the first terminal electrode 17 side, as illustrated in
On the other hand, on the second terminal electrode 18 side, as illustrated in
The embodiment illustrated in
The reason why the shape of the first fillet surface 37 and the shape of the second fillet surface 38 are different from each other as described above is based on the following technical background.
Although the state (a tension, a contact angle with a terminal electrode, a length) of the wire is different between the start and end of winding of the wire, the optimum condition of thermocompression bonding changes also when the difference is slight with respect to the state of such a wire.
For example, when the first terminal 21a side of the first wire 21 connected to the first terminal electrode 17 and the second terminal 21b side of the first wire 21 connected to the second terminal electrode 18 are compared with each other, the first terminal 21a side and the second terminal 21b side are different from each other in the tension of the first wire 21 in that one of the first terminal 21a and the second terminal 21b starts winding, and the other ends winding. Further, the first terminal 21a traverses the first terminal electrode 17 in a right-left direction of
In this embodiment, more appropriate thermocompression bonding conditions are set independently of each other on the first terminal 21a side and the second terminal 21b side according to the difference in the state of the first wire 21. As a result, the shape of the first fillet surface 37 is different from the shape of the second fillet surface 38.
The thermocompression bonding condition can be adjusted, for example, by changing the temperature condition of the heater chip, the pressurization condition and the pressurization time by the heater chip, and the like. Further, in order to make the shape of the first fillet surface 37 different from the shape of the second fillet surface 38, thermocompression bonding on the first terminal 21a side and thermocompression bonding on the second terminal 21b side may be performed separately, or may be performed simultaneously using a plurality of independently controllable heater chips. Further, also in a case where the thermocompression bonding on the first terminal 21a side and the thermocompression bonding on the second terminal 21b side are simultaneously performed with the same heater chip, the thermocompression bonding condition may be adjusted by changing a position, an angle, or the like at which the heater chip and the terminal electrode are in contact with each other, or a position, a tension, or the like of the wire.
Incidentally, as an example,
As another embodiment of the present disclosure, with reference to
In this case, the third terminal 22a traverses the third terminal electrode 19 from the upper right to the lower left in
As still another embodiment of the present disclosure, with reference to
In this case, the fourth terminal 22b traverses the fourth terminal electrode 20 in the right-left direction of
Although the present disclosure has been described above with reference to the illustrated embodiment, various other embodiments are possible within the scope of the present disclosure.
For example, the above-described embodiments relate to a coil component including two wires, but the present disclosure can also be applied to a coil component including one wire or three or more wires. Therefore, the number of terminal electrodes can also be changed according to the number of wires.
The embodiment illustrated in
The embodiment illustrated in
Although the embodiment illustrated in
The coil component 11 includes the top plate 16 which connects one pair of flange portions 13 and 14, but instead of this, a coating material may be applied so as to cover the winding core portion 12 and the wires 21 and 22 on the side opposite to respective bottom surfaces 23 and 24 of one pair of flange portions 13 and 14. As the coating material, a resin containing a magnetic powder is preferably used. Further, in the coil component 11, both the top plate 16 and the coating material may be omitted.
Each embodiment described in this specification is exemplary, and partial replacement or combination of configurations is possible between different embodiments.
Number | Date | Country | Kind |
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2020-204653 | Dec 2020 | JP | national |