This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2019-233233, filed on 24 Dec. 2019, the entire contents of which are incorporated herein by reference.
The present disclosure relates to a coil component.
The specification of Unites States Patent Application, Publication No. 2017-196091 (Patent Document 1) discloses a coil component which includes two coils aligned in an element body and a non-magnetic layer disposed between the two coils. This document demonstrates that mutual interference between the magnetic fluxes of the two coils is suppressed by the non-magnetic layer.
In the coil component according to the above-described conventional technology, mutual interference of magnetic fluxes cannot be sufficiently suppressed, and further suppression of the mutual interference of the magnetic fluxes is required.
According to the present disclosure, a coil component capable of further suppressing mutual interference of magnetic fluxes is provided.
A coil component according to one aspect of the present disclosure includes an element body, a first coil provided in the element body and wound around a first magnetic core, a second coil provided in the element body, wound around a second magnetic core extending in a direction along the first magnetic core, and adjacent to the first coil in a direction perpendicular to the first magnetic core, and a non-magnetic part bridged between the first coil and the second coil in a cross section including the magnetic core of the first coil and the magnetic core of the second coil of the element body.
In the above-described coil component, the non-magnetic part is bridged between the first coil and the second coil in a cross section including the magnetic core of the first coil and the magnetic core of the second coil of the element body. Therefore, a magnetic flux in a direction along the first magnetic core is hindered by the non-magnetic part between the first coil and the second coil. Therefore, a magnetic flux of the first coil and a magnetic flux of the second coil are difficult to interfere with each other.
In the coil component according to another aspect, the first coil and the second coil may be formed in a first layer of the element body.
In the coil component according to another aspect, the non-magnetic part may include a first portion positioned in the first layer.
The coil component according to another aspect may further include a resin part extending between the first coil and the second coil in the first layer. The resin part may constitute the first portion of the non-magnetic part.
In the coil component according to another aspect, the non-magnetic part may include a second portion positioned in a second layer. The second layer overlaps the first layer of the element body.
The coil component according to another aspect may further include an insulating substrate provided in the element body, formed of a non-magnetic insulating material, and including a main surface. The first coil and the second coil are formed on the main surface. The insulating substrate may constitute at least a part of the second portion of the non-magnetic part.
In the coil component according to another aspect, at least one of the first coil and the second coil may include a first coil pattern provided on one main surface of the insulating substrate and a second coil pattern provided on the other main surface.
The coil component according to another aspect may further include a protective film covering the insulating substrate along with the first coil and the second coil integrally. The protective film may constitute at least a part of the second portion of the non-magnetic part.
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same function will be denoted by the same reference signs and duplicate descriptions thereof will be omitted.
A coil component 10 according to an embodiment will be described with reference to
The coil component 10 is configured to include a main body part 12 (element body) having a rectangular flat plate-like outer shape, and two pairs of external terminal electrodes 14A, 14B, 14C, and 14D provided on surfaces of the main body part 12. The main body part 12 includes a rectangular upper surface 12a and a rectangular lower surface 12b parallel to each other, a pair of side surfaces 12c and 12d perpendicular to the upper surface 12a and the lower surface 12b, and a pair of end surfaces 12e and 12f perpendicular to the pair of main surfaces 12a and 12b and the pair of side surfaces 12c and 12d. The external terminal electrodes 14A, 14B, 14C, and 14D are formed on the side surfaces 12c and 12d in pairs. As an example, the main body part 12 is designed with dimensions such that a long side length of the upper surface 12a is 3.2 mm, a short side length of the upper surface is 2.0 mm, and a height is 0.5 mm.
The main body part 12 is configured to include an insulating substrate 20, a first coil C1 and a second coil C2 provided on the insulating substrate 20, and a magnetic material 30.
The insulating substrate 20 is a plate-shaped member provided inside the main body part 12 and is formed of a non-magnetic insulating material. As the insulating substrate 20, a substrate in which a glass cloth is impregnated with an epoxy-based resin and having a plate thickness of 10 μm to 60 μm can be used. Further, a BT resin, polyimide, aramid, or the like can also be used in addition to an epoxy-based resin. As a material of the insulating substrate 20, a ceramic or glass can also be used. A material of the insulating substrate 20 may be a mass-produced printed circuit board material and may be a resin material particularly used for a BT printed circuit board, an FR4 printed circuit board, or an FR5 printed circuit board.
A plurality of through holes including a first through hole 20c and a second through hole 20d are provided in the insulating substrate 20. The first through hole 20c and the second through hole 20d both have an elliptical shape and are aligned in a direction in which the pair of end surfaces 12e and 12f face each other.
As illustrated in
As illustrated in
As illustrated in
The first coil C1 includes the first through conductor V1 that connects the inner end portion 22b of the first planar coil pattern 22 to the inner end portion 24b of the second planar coil pattern 24. The first through conductor V1 penetrates the insulating substrate 20 in a thickness direction, is in contact with the inner end portion 22b of the first planar coil pattern 22 at an upper end thereof, and is in contact with the inner end portion 24b of the second planar coil pattern 24 at a lower end thereof.
When a voltage is applied between the external terminal electrodes 14A and 14B, a current flows through the first planar coil pattern 22 and the second planar coil pattern 24 connected by the first through conductor V1 in the same circumferential direction (for example, clockwise direction) when viewed from the upper surface 20a side of the insulating substrate 20. Therefore, in the first coil C1, the first planar coil pattern 22 and the second planar coil pattern 24 cooperate to function as one coil.
As illustrated in
The first planar coil pattern 22 of the second coil C2 has the same shape as the first planar coil pattern 22 of the first coil C1. Regarding the second coil C2, the external terminal electrode 14C is formed in a region of the side surface 12c at which an outer end portion 22a of the first planar coil pattern 22 is exposed, and the outer end portion 22a of the first planar coil pattern 22 is connected to the external terminal electrode 14C on the side surface 12c. Also, the external terminal electrode 14D is formed in a region of the side surface 12d at which an outer end portion 24a of the second planar coil pattern 24 is exposed, and the outer end portion 24a of the second planar coil pattern 24 is connected to the external terminal electrode 14D on the side surface 12d. Further, an inner end portion 22b of the first planar coil pattern 22 and an inner end portion 24b of the second planar coil pattern 24 positioned at positions overlapping each other in an edge region of the second through hole 20d are connected via a second through conductor V2 similarly to the first through conductor V1.
In the second coil C2, similarly to the first coil C1, when a voltage is applied between the external terminal electrodes 14C and 14D, the first planar coil pattern 22 and the second planar coil pattern 24 cooperate to function as one coil.
The first planar coil pattern 22 and the second planar coil pattern 24 can be formed using plating.
In the first coil C1 and the second coil C2, a side surface of the first planar coil pattern 22 (that is, a surface perpendicular to the insulating substrate 20) is covered with a resin wall 25, a side surface of the second planar coil pattern 24 is covered with a resin wall 26, and the resin walls 25 and 26 are formed of an insulating resin material. The resin walls 25 and 26 can be provided on the insulating substrate 20 before the first planar coil pattern 22 and the second planar coil pattern 24 are formed, and in this case, the first planar coil pattern 22 and the second planar coil pattern 24 are plated and grown in a space between walls defined by the resin walls 25 and 26. That is, formation regions of the first planar coil pattern 22 and the second planar coil pattern 24 are defined by the resin walls 25 and 26 provided on the insulating substrate 20. The resin walls 25 and 26 can be provided on the insulating substrate 20 after the first planar coil pattern 22 and the second planar coil pattern 24 are formed, and in this case, the resin walls 25 and 26 are provided in the first planar coil pattern 22 and the second planar coil pattern 24 by filling, coating, or the like. As will be described below, a space between the resin walls 25 and 26 between the first coil C1 and the second coil C2 is filled with a resist (resin part) 27. The resist 27 can be formed through the same process as the process of forming the resin walls 25 and 26. The resist 27 is formed of an insulating resin material and may be the same resin material as that of the resin walls 25 and 26.
The insulating substrate 20, together with the first coil C1 and the second coil C2, is integrally covered with a protective film 28. The protective film 28 covers an upper surface of the first planar coil pattern 22 and a lower surface of the second planar coil pattern 24, and fills a space between the first coil C1 and the second coil C2 on the insulating substrate 20. Specifically, the protective film 28 fills a space between the first planar coil pattern 22 of the first coil C1 and the first planar coil pattern 22 of the second coil C2 on the upper surface 20a of the insulating substrate 20, and fills a space between the second planar coil pattern 24 of the first coil C1 and the second planar coil pattern 24 of the second coil C2 on the lower surface 20b of the insulating substrate 20. The protective film 28 may be formed of a resin such as, for example, an epoxy resin or a polyimide resin and may be formed, for example, using a photolithography method.
The magnetic material 30 integrally covers the insulating substrate 20, the first coil C1, and the second coil C2. More specifically, the magnetic material 30 covers the insulating substrate 20, the first coil C1, and the second coil C2 from a vertical direction (thickness direction of the insulating substrate), and covers outer circumferences of the insulating substrate 20, the first coil C1, and the second coil C2. Also, the magnetic material 30 fills insides of the through holes 20c and 20d of the insulating substrate 20, and fills inner regions of the first coil C1 and the second coil C2. In the magnetic material 30, the magnetic material 30 of a portion filling the inside of the through hole 20c of the insulating substrate 20 and the inner region of the first coil C1 constitutes a magnetic core Z1 of the first coil C1, and the magnetic material 30 of a portion filling the inside of the through hole 20d of the insulating substrate 20 and the inner region of the second coil C2 constitutes a magnetic core Z2 of the second coil C2. In the present embodiment, the magnetic core Z1 of the first coil C1 and the magnetic core Z2 of the second coil C2 have a parallel relationship.
The magnetic material 30 is formed of a metal magnetic powder-containing resin. The metal magnetic powder-containing resin is a binder powder in which a metal magnetic powder is bound by a binder resin. The metal magnetic powder of the metal magnetic powder-containing resin constituting the magnetic material 30 may be formed of, for example, an iron-nickel alloy (a Permalloy alloy), carbonyl iron, an amorphous, non-crystalline, or crystalline FeSiCr-based alloy, Sendust, or the like. The binder resin may be, for example, a thermosetting epoxy resin. In the present embodiment, a content of the metal magnetic powder in the binder powder is 80 to 92% by volume percentage and 95 to 99% by mass percentage. From a viewpoint of magnetic characteristics, a content of the metal magnetic powder in the binder powder may also be 85 to 92% by volume percentage and 97 to 99% by mass percentage. A magnetic powder of the metal magnetic powder-containing resin constituting the magnetic material 30 may be a powder having an average particle diameter of one type, or may be a mixed powder having average particle diameters of a plurality of types. In the present embodiment, the magnetic powder of the metal magnetic powder-containing resin constituting the magnetic material 30 is a mixed powder having average particle diameters of three types. When the magnetic powder of the metal magnetic powder-containing resin constituting the magnetic material 30 is a mixed powder, types of the magnetic powder having different average particle sizes may be the same or different.
The cross-sectional view of
In the present embodiment, the resin walls 25 and 26 and the resist 27 form a resin part extending between the first coil C1 and the second coil C2 in the first layers L11 and L12, and the resin part constitutes a first portion 40a of the non-magnetic part 40. Also, in the present embodiment, a portion of the insulating substrate 20 connecting the first coil C1 and the second coil C2 constitutes a part of the second portion 40b of the non-magnetic part 40 positioned in the second layer L21 overlapping the first layers L11 and L12. Further, in the present embodiment, a portion of the protective film 28 connecting the first coil C1 and the second coil C2 constitutes a part of the second portion 40b of the non-magnetic part 40 positioned in the second layer L22 and L23 overlapping the first layers L11 and L12.
In the coil component 10 described above, the non-magnetic part 40 is stretched between the first coil C1 and the second coil C2 in the cross section of the element body illustrated in
Further, the non-magnetic material constituting the non-magnetic part 40 can be appropriately replaced with a different non-magnetic material, and a part thereof can also be configured as a space (void). For example, as illustrated in
Also, the non-magnetic part 40 is not limited to the configuration in which the insulating material is present in all of the first layers L11 and L12 and the second layers L21 to L23 described above, and may also have a configuration in which the insulating material is present in a part (one layer or a plurality of layers) of the first layers L11 and L12 and the second layers L21 to L23. For example, as illustrated in
Further, the present disclosure is not limited to the above-described embodiments and may take various aspects.
For example, the coil component may have a configuration that does not include the insulating substrate. In this case, the first coil and the second coil may be constituted by a one-layer planar coil pattern. Both the first coil and the second coil need not be configured by a two-layer planar coil pattern (for example, a first planar coil pattern and a second planar coil pattern), and only one of them may be configured by a two-layer planar coil pattern. The two-layer planar coil pattern does not have to be line-symmetrical. Also, the number of turns of the first coil and the number of turns of the second coil can be increased or decreased as appropriate. The magnetic core of the first coil and the magnetic core of the second coil do not necessarily have to have a parallel relationship, and one magnetic core may be slightly inclined with respect to the other magnetic core.
Number | Date | Country | Kind |
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2019-233233 | Dec 2019 | JP | national |