This application claims the benefit under 35 USC 119(a) of Korean Patent Application No. 10-2019-0057062 filed on May 15, 2019 in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.
The present disclosure relates to a coil component.
Inductors, coil components, are representative passive electronic components used in electronic devices along with resistors and capacitors.
With electronic devices having increasingly higher performance and smaller sizes, the number of coil components used in electronic devices has been increasing while the size thereof has been decreasing.
In the case of a general thin film type inductor, since a body includes metal powder as a conductor, an insulating film is interposed between a coil and the body for electrical insulation between the coil and the body.
On the other hand, as a relative area occupied by a lead-out pattern of a coil in the body increases, coupling force between the lead-out pattern and the body may be reduced by the above-described insulating film.
An aspect of the present disclosure is to provide a coil component in which reliability of coupling between a coil and a body may be secured.
According to an aspect of the present disclosure, a coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including a first lead-out pattern and a second lead-out pattern respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which:
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent to one of ordinary skill in the art. The sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed, as will be apparent to one of ordinary skill in the art, with the exception of operations necessarily occurring in a certain order. Also, descriptions of functions and constructions that would be well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.
The terminology used herein describes particular embodiments only, and the present disclosure is not limited thereby. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “including”, “comprises,” and/or “comprising” when used in this specification, specify the presence of stated features, integers, steps, operations, members, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, members, elements, and/or groups thereof.
Throughout the specification, it will be understood that when an element, such as a layer, region or wafer (substrate), is referred to as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element or other elements intervening therebetween may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element, there may be no elements or layers intervening therebetween. Like numerals refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
In addition, the term “coupled” is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also in the case in which other constituent elements are interposed between the constituent elements such that they are in respective contact with each other, being used as a comprehensive concept.
The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
In the drawings, the L direction may be defined as a first direction or a length direction, the W direction as a second direction or a width direction, and the T direction as a third direction or a thickness direction.
Hereinafter, a coil component according to an embodiment in the present disclosure will be described in detail with reference to the accompanying drawings.
Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions thereof will be omitted.
Various types of electronic parts are used in electronic devices. Various types of coil components may be suitably used for noise removal or the like between these electronic parts.
For example, as a coil component in an electronic device, a power inductor, a high frequency inductor (HF Inductor), a general bead, a bead for high frequency (GHz Bead), a common mode filter, or the liken used.
Referring to
The body 100 forms the exterior of the coil component 1000 according to the embodiment, and the coil portion 300 is embedded in the body 100. The body 100 includes an anchor portion 120 inserted into each of the lead-out patterns 321 and 322, for example, first and second lead-out patterns 321 and 322 to be described later, which will be described later.
The body 100 may be formed to have a hexahedral shape as a whole.
Based on
The body 100 may be formed in such a manner that the coil component 1000 according to the embodiment, having external electrodes 500 and 600 to be described later, has a length of 1.0 mm, a width of 0.6 mm, and a thickness of 0.8 mm, but an embodiment thereof is not limited thereto. On the other hand, the numerical values described above are merely design values without reflecting process errors or the like therein, and thus, should be considered to be within the scope of the present disclosure as long as the extent thereof is recognized to be within process errors.
The body 100 may include a magnetic material and a resin. As a result, the body 100 has magnetism. The body 100 may be formed by laminating one or more magnetic composite sheets containing a resin and a magnetic material dispersed in a resin. Further, the body 100 may also have a structure other than the structure in which the magnetic material is dispersed in the resin. For example, the body 100 may also be formed of a magnetic material such as ferrite.
The magnetic material may be ferrite or a metal magnetic powder.
Ferrite powder may be one or more of spinel type ferrite such as Mg—Zn type, Mn—Zn type, Mn—Mg type, Cu—Zn type, Mg—Mn—Sr type, Ni—Zn type or the like, hexagonal ferrite such as Ba—Zn, Ba—Mg, Ba—Ni, Ba—Co, Ba—Ni—Co type, or the like, garnet type ferrite such as Y type or the like, and Li-based ferrite.
The metal magnetic powder may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one or more selected from the group consisting of pure iron powder, Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Ni alloy powder, Fe—Ni—Mo alloy powder, Fe—Ni—Mo—Cu alloy powder, Fe—Co alloy powder, Fe—Ni—Co alloy powder, Fe—Cr alloy powder, Fe—Cr—Si alloy powder, Fe—Si—Cu—Nb alloy powder, Fe—Ni—Cr alloy powder, and Fe—Cr—Al alloy powder.
The metal magnetic powder may be amorphous or crystalline. For example, the metal magnetic powder may be an Fe—Si—B—Cr amorphous alloy powder, but is not limited thereto.
The ferrite and the metal magnetic powder may have an average diameter of about 0.1 μm to 30 μm, respectively, but embodiments thereof are not limited thereto.
The body 100 may include two or more kinds of magnetic materials dispersed in a resin. In this case, the term “different kinds of magnetic materials” means that the magnetic materials dispersed in the resin are distinguished from each other by at least one of an average diameter, a composition, crystallinity and a shape.
The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, or the like, alone or in combination.
The body 100 includes a core 110 passing through the coil portion 300 and the support substrate 200 to be described later. The core 110 may be formed by filling a through hole of the coil portion 300 with a magnetic composite sheet, but an embodiment thereof is not limited thereto.
The support substrate 200 is embedded in the body 100. In detail, the support substrate 200 is embedded in the body 100 to be perpendicular to one surface 106 of the body 100. Thus, the coil portion 300 disposed on the support substrate 200 is disposed to be perpendicular to one surface 106 of the body 100. The support substrate 200 includes the support portion 210 and the distal ends 220 and 230. The support portion 210 supports the first and second coil patterns 311 and 312, which will be described later. In the case of the distal ends, for example, a first distal end 220 supports the first lead-out pattern 321 and the auxiliary lead-out pattern 331, for example, the first auxiliary lead-out pattern 331, and a second distal end 230 supports the second lead-out pattern 322 and the auxiliary lead-out pattern 332, for example, the second auxiliary lead-out pattern 332.
The support substrate 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photoimageable dielectric resin, or an insulating material including a reinforcing material such as a glass fiber or an inorganic filler with these insulating resins. For example, the support substrate 200 may be formed of a material such as a prepreg, an Ajinomoto Build-up Film (ABF), a Bismaleimide Triazine (FR-4), a bismaleimide triazine (BT) resin, a Photo Imageable Dielectric (PID), or a Copper Clad Laminate (CCL), or the like, but the material thereof is not limited thereto.
The inorganic filler may be one or more selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulphate (BaSO4), talc, mud, mica powder, aluminum hydroxide (AlOH3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3).
In the case in which the support substrate 200 is formed of an insulating material including a reinforcing material, the support substrate 200 may provide relatively better rigidity. In the case in which the support substrate 200 is formed of an insulating material that does not include glass fibers, an overall thickness of the coil portion 300 may be reduced by the support substrate 200, and a width of the coil component 1000 according to the embodiment may thus be reduced.
The coil portion 300 is disposed on the support substrate 200. The coil portion 300 is embedded in the body 100 to exhibit characteristics of a coil component. For example, when the coil component 1000 according to the embodiment is used as a power inductor, the coil portion 300 may function to stabilize the power supply of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.
The coil portion 300 is formed on at least one of opposite surfaces of the support substrate 200, and has at least one turn. In this embodiment, the coil portion 300 includes first and second coil patterns 311 and 312, disposed on both surfaces of the support portion 210 facing opposing other in the width direction W of the body 100, respectively, to face each other, a first lead-out pattern 321 and a first auxiliary lead-out pattern 331 disposed on both surfaces of the first distal end 220, respectively, to face each other, and a second lead-out pattern 322 and a second auxiliary lead-out pattern 332 disposed on both surfaces of the second distal end 230, respectively, to face each other. The coil portion 300 also includes the via 340 penetrating through the support portion 210 to connect the first and second coil patterns 311 and 312 to each other.
Each of the first coil pattern 311 and the second coil pattern 312 may be formed to have the form of a plane helix having at least one turn about the core 110. As an example, based on the direction of
Referring to
The first lead-out pattern 321 may be continuously exposed to the first surface 101 and the sixth surface 106 of the body 100. The second lead-out pattern 322 may be continuously exposed to the second surface 102 and the sixth surface 106 of the body 100. When the first lead-out pattern 321 is continuously exposed to the first surface 101 and the sixth surface 106 of the body 100, a contact area of the first lead-out pattern 321 with the first external electrode 500 to be described later may be increased to increase coupling force therebetween. When the second lead-out pattern 322 is continuously exposed to the second surface 102 and the sixth surface 106 of the body 100, a contact area of the second lead-out pattern 322 with the second external electrode 600 to be described later may be increased, to increase coupling force therebetween.
The first auxiliary lead-out pattern 331 is disposed on the other surface of the first distal end 220 to correspond to the first lead-out pattern 321, and is spaced apart from the second coil pattern 312. The first auxiliary lead-out pattern 331 and the first lead-out pattern 321 are connected to each other by connection vias passing through the first distal end 220. The second auxiliary lead-out pattern 332 is disposed on one surface of the second distal end 230 to correspond to the second lead-out pattern 322, and is spaced apart from the first coil pattern 311. The second auxiliary lead-out pattern 332 and the second lead-out pattern 322 are connected to each other by connection vias passing through the second distal end 230. The coupling reliability between the external electrodes 500 and 600 and the coil portion 300 may be increased due to the first and second auxiliary lead-out patterns 331 and 332.
The first coil pattern 311 and the first lead-out pattern 321 may be integrally formed without forming a boundary therebetween. The second coil pattern 312 and the second lead-out pattern 322 may be integrally formed without forming a boundary therebetween. However, embodiments thereof are not limited thereto, and thus, do not exclude a case in which the above-described configurations are formed at different steps to have boundaries therebetween.
At least one of the coil patterns 311 and 312, the via 340, the lead-out patterns 321 and 322 and the auxiliary lead-out patterns 331 and 332 may include at least one conductive layer.
As an example, when the first coil pattern 311, the first lead-out pattern 321, the second auxiliary lead-out pattern 332, and the via 340 are formed on one surface side of the support substrate 200 by plating, each of the first coil pattern 311, the first lead-out pattern 321, the second auxiliary lead-out pattern 332, and the via 340 may include a seed layer and an electroplating layer. The seed layer may be formed by a vapor deposition method such as electroless plating or sputtering. Each of the seed layer and the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer of the multi-layer structure may be formed to have a conformal film structure in which one electroplating layer is covered by another electroplating layer, and may also be formed to have a form in which only on one surface of one electroplating layer, another electroplating layer is laminated. The seed layer of the first coil pattern 311 and the seed layer of the via 340 may be integrally formed without forming a boundary therebetween, but an embodiment thereof is not limited thereto. The electroplating layer of the second coil pattern 312 and the electroplating layer of the via 340 may be integrally formed without forming a boundary therebetween, but an embodiment thereof is not limited thereto.
The coil patterns 311 and 312, the lead-out patterns 321 and 322, the auxiliary lead-out patterns 331 and 332 and the via 340 are respectively formed of a conductive material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof.
The insulating film 400 is disposed between each of the support substrate 200 and the coil portion 300, and the body 100. In this embodiment, since the body 100 includes a magnetic metal powder, the insulating film 400 is disposed between the coil portion 300 and the body 100 to insulate the coil portion 300 from the body 100. The insulating film 400 may be formed of parylene or the like, but an embodiment thereof is not limited thereto.
The external electrodes 500 and 600 are spaced apart from each other on one surface 106 of the body 100 and are connected to the first and second lead-out patterns 321 and 322. The first external electrode 500 is in contact with and connected to the first lead-out pattern 321 and the first auxiliary lead-out pattern 331, and the second external electrode 600 is in contact with and is connected to the second lead-out pattern 322 and the second auxiliary lead-out pattern 332.
The external electrodes 500 and 600 electrically connect the coil component 1000 to a printed circuit board or the like when the coil component 1000 according to the embodiment is mounted on the printed circuit board or the like. For example, the coil component 1000 according to the embodiment may be mounted in such a manner that the sixth surface 106 of the body 100 faces an upper surface of the printed circuit board. In this case, since the external electrodes 500 and 600 are disposed on the sixth surface 106 of the body 100 to be spaced apart from each other, connecting portions of the printed circuit board may be electrically connected.
The external electrodes 500 and 600 may include at least one of a conductive resin layer and an electroplating layer. The conductive resin layer may be formed by printing a conductive paste on the surface of the body 100 and curing the conductive paste. The conductive paste may include one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The electroplating layer may include one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). The external electrodes 500 and 600 may each include a first plating layer 10 formed on the surface of the body 100 and in direct contact with the lead-out patterns 321 and 322 and the auxiliary lead-out patterns 331 and 332, and a second plating layer 20 disposed on the first plating layer 10. For example, the first plating layer 10 may be a nickel (Ni) plating layer, and the second plating layer 20 may be a tin (Sn) plating layer, but embodiments thereof are not limited thereto.
The anchor portion 120 of the body 100 is inserted into each of the first and second lead-out patterns 321 and 322. The first lead-out pattern 321 has a first external surface exposed to one surface 106 and one end surface 101 of the body 100, and a first internal surface opposing the first external surface, and the anchor portion 120 is inserted into the internal surface side of the first lead-out pattern 321. The second lead-out pattern 322 has a second external surface exposed on one surface 106 and the other end surface 102 of the body 100, and a second internal surface opposing the second external surface, and the anchor portion 120 is inserted into the internal surface side of the second lead-out pattern 322. In this case, the first and second external surfaces of the first and second lead-out patterns 321 and 322 include a surface thereof exposed to the first and sixth surfaces 101 and 106 of the body 100 and a surface thereof exposed to the second and sixth faces 102 and 106 of the body 100, as illustrated in
Referring to
Shapes of the distal ends 220 and 230 and the lead-out patterns 321 and 322 correspond to each other. As a result, the distal ends 220 and 230 have regions corresponding to the protrusions P of the lead-out patterns 321 and 322. The anchor portion 120 extends from the region disposed between the protrusions P of the lead-out patterns 321 and 322 to the regions of the distal ends 220 and 230 described above, to be disposed in the above-described regions of the distal ends 220 and 230. For example, the anchor portion 120 may penetrate through the distal ends 220 and 230 in the thickness direction of the distal ends 220 and 230 (the width direction W of the body).
The shapes of the auxiliary lead-out patterns 331 and 332 and the lead-out patterns 321 and 322 correspond to each other. As a result, the protrusions P are also formed on the auxiliary lead-out patterns 331 and 332. The anchor portion 120 may extend to also be disposed in a region between adjacent protrusions P of the auxiliary lead-out patterns 331 and 332. As a result, the anchor portion 120 disposed on the first lead-out pattern 321 side is formed to respectively penetrate through the first lead-out pattern 321, the first distal end 220, and the first auxiliary lead-out pattern 331 in the thickness direction of the first lead-out pattern 321 (the width direction W of the body) to be formed integrally therewith. The anchor portion 120 disposed on the second lead-out pattern 322 side may be formed to respectively penetrate through the second lead-out pattern 322, the second distal end 230 and the second auxiliary lead-out pattern 332 in the thickness direction of the second lead-out pattern 322 (the width direction W of the body) to be formed integrally therewith.
Although not illustrated in the drawings, the coil component 1000 according to the embodiment may further include an insulating layer disposed in a region other than the regions in which the external electrodes 500 and 600 are formed, from among the first to sixth surfaces 101, 102, 103, 104, 105 and 106 of the body 100. The insulating layer may be an oxide film obtained by oxidizing a cut surface having metal magnetic powder and exposed by the first to sixth surfaces 101, 102, 103, 104, 105 and 106 of the body 100, or may be formed by laminating an insulating layer including an insulating resin on the first to sixth surfaces 101 to 106 of the body 100, by vapor deposition of an insulating material on the first to sixth surfaces 101 to 106 of the body 100, or by applying an insulating paste to the first to sixth surfaces 101 to 106 of the body 100, to then be cured. The insulating layer may include a metal oxide film or may include an insulating resin such as epoxy, as described above. The insulating layer may function as a plating resist in forming the external electrodes 500 and 600 by electroplating, but an embodiment thereof is not limited thereto.
In comparing
On the other hand, referring to
Referring to
In this embodiment, coupling force between the lead-out patterns 321 and 322 and the auxiliary lead-out patterns 331 and 332, and the body 100, may be further improved, as the protrusion P and the anchor portion 120 are formed to have a trapezoidal cross-sectional shape and an inverted-trapezoidal cross sectional shape, complementary to each other.
In comparing
Referring to
The exposed surface of the auxiliary anchor portion 120′ is disposed between the exposed surfaces of the adjacent first lead-out patterns 321, as illustrated in
The anchor portion 120 and the auxiliary anchor portion 120′ are disposed to be shifted from each other with respect to a cross section of the first lead-out pattern 321, perpendicular to the width direction, for example, a cross section thereof in length L-thickness T directions of the body. The arrangement of the anchor portion 120 and the auxiliary anchor portion 120′ to be shifted from each other refers to the arrangement in which a centerline of the width of the anchor portion 120 and a centerline of the width of the auxiliary anchor portion 120′ are not disposed on the same line segment, with respect to a cross section of the first lead-out pattern 321, perpendicular to the width direction, for example, a cross section thereof in length L-thickness T directions of the body. When the anchor portion 120 and the auxiliary anchor portion 120′ are disposed to be shifted from each other, coupling reliability between the first lead-out pattern 321 and the body 100 may be secured even in a case in which shear stress occurs.
Although the above description is based on the first lead-out pattern 321, the above description may be applied to the second lead-out pattern 322 and the first and second auxiliary lead-out patterns 331 and 332 as is.
In comparing
In the following, the embodiment is mainly described with the first lead-out pattern 321, but the following description may be applied to the second lead-out pattern 322 and the auxiliary lead-out patterns 331 and 332 as they are.
Referring to
With reference to a cross section of the first lead-out pattern 321 in a thickness direction (a cross section thereof in length L-width W directions of the body, based on a region of the first lead-out pattern exposed to the sixth surface of the body, and a cross section thereof in width W-thickness T directions of the body, based on a region of the first lead-out pattern exposed to the first surface of the body), the anchor portion 120 is formed in such a manner that a length d of a first region on the support substrate 200 side is greater than a length c of a second region disposed on the first region. For example, the anchor portion 120 is formed to have a shape in which the cross-sectional area thereof increases in the thickness direction of the first lead-out pattern 321. As a result, the region of the first lead-out pattern 321 in which the anchor part 120 is disposed may have a form similar to an undercut in which the width increases toward the bottom.
In this embodiment, coupling reliability between the lead-out patterns 321 and 322 and the body 100 may be maintained even in a case in which external force is applied in the width direction W of the body 100, compared with the foregoing embodiments.
As set forth above, according to an embodiment, reliability of coupling between a coil and a body may be secured.
While this disclosure includes specific examples, it will be apparent to one of ordinary skill in the art that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed to have a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
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Entry |
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Korean Office Action dated May 12, 2020 issued in Korean Patent Application No. 10-2019-0057062 (with English translation). |
Office Action dated Nov. 20, 2023 issued in the corresponding Chinese Patent Application No. 201911126658.6 with English translation. |
Number | Date | Country | |
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20210027931 A1 | Jan 2021 | US |