This application claims benefit of priority to Korean Patent Application No. 10-2018-0047656 filed on Apr. 25, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a coil component, and more particularly, to a power inductor.
In accordance with the development of information technology (IT), apparatuses have been rapidly miniaturized and thinned. Therefore, market demand for small and thin devices has increased.
In accordance with such a technical trend, Korean Patent Laid-Open Publication No. 10-1999-0066108 provides a power inductor including a substrate having a via hole and coils disposed on opposite surfaces of the substrate and electrically connected to each other through the via hole of the substrate to make an effort to provide an inductor including coils having a uniform and wide aspect ratio.
In addition, in a design of the power inductor, an area of a core region in the coil may be generally narrow, and magnetic flux may be mainly concentrated in the core region in the coil. Therefore, there has been demand to optimize a flow of the magnetic flux through structural technology improvements of the core region in which the magnetic flux is concentrated.
An aspect of the present disclosure may provide a coil component of which an inductance (Ls) and saturated current (Isat) characteristics may be improved by significantly increasing a magnetic material filling region of a core center.
According to an aspect of the present disclosure, a coil component may include: a body including a support member including a through-hole and a via hole spaced apart from the through-hole, an internal coil supported by the support member and including a plurality of conductive units wound in one direction, and an encapsulant encapsulating the support member and the internal coil and filling the through-hole; and an external electrode connected to the internal coil. The internal coil may include an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface of the support member and may include a via portion connecting end portions of the upper and lower coils to each other and filling the via hole, and an outer boundary surface of a first conductive unit directly surrounding the via portion may include a protrusion portion protruding toward an external surface of the body.
Each of the plurality of conductive units may include linear portions and curved portions alternately disposed and connected to each other.
The via portion may be disposed in the curved portion of the plurality of conductive units.
The via portion may be embedded toward the protrusion portion of the first conductive unit.
A difference between a minimum spacing-distance from a boundary surface of the through-hole to the upper coil and a minimum spacing-distance from the boundary surface of the through-hole to the lower coil may be smaller than a minimum line width of each of the plurality of conductive units of the internal coil.
At least one of the plurality of conductive units surrounding the first conductive unit may have a neck region in which a line width thereof is narrow relative to a width of another region of the at least one of the plurality of conductive units.
The neck region may be a region of one section in which the number of turns of the conductive units is X (X≥2), and the another region may be a region of another section in which the number of turns of the conductive units is X−1.
The neck region may be disposed in a curved portion of the at least one conductive unit.
The plurality of conductive units may be insulated from each other by an insulator disposed between the plurality of conductive units.
The insulator may include openings having a shape corresponding to the internal coil, and the openings may be filled with the internal coil.
The number of conductive units included in the upper coil may be n, and turns of the upper coil may be n.
An entire line width occupied by the n conductive units in one section may be the same as that occupied by n−1 conductive units in another section, on an upper surface of the support member.
The number of conductive units included in the lower coil may be m, and turns of the lower coil may be m.
An entire line width occupied by the m conductive units in one section may be the same as that occupied by m−1 conductive units in another section, on a lower surface of the support member.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
Hereinafter, a coil component according to an exemplary embodiment in the present disclosure will be described. However, the present disclosure is not limited thereto.
A coil component according to the present disclosure is derived in order to solve the abovementioned problem of the coil component according to the related art.
Referring to
The body 1 may have a first end surface and a second end surface opposing each other in a length (L) direction, a first side surface and a second side surface opposing each other in a width (W) direction, and an upper surface and a lower surface opposing each other in a thickness (T) direction to substantially have a hexahedral shape.
The body 1 may include a support member 11. The support member 11 may serve to facilitate formation of an internal coil and support the internal coil. The support member may be formed of a thin plate having an insulation property, for example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide resin, or a resin having a reinforcement material such as a glass fiber or an inorganic filler impregnated in the thermosetting resin and the thermoplastic resin. In detail, any known copper clad laminate (CCL) substrate, an Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) resin, a photoimagable dielectric (PID) resin, or the like, may be used as a material of the support member 11.
The support member 11 may include a through-hole H and a via hole v. The through-hole may be formed substantially in a central portion of the support member 11, and the via hole v may be formed to be spaced apart from the through-hole H by a predetermined distance. The through-hole H may be filled with an encapsulant 12 formed of a magnetic material to serve to increase a magnetic permeability of the coil component 100. Therefore, when a cross-sectional area of the through-hole is increased, the magnetic permeability may be increased, but there may be a limitation in increasing the cross-sectional area of the through-hole in a miniaturized coil component.
Meanwhile, since the via hole v serves to connect an upper coil and a lower coil to each other, the via hole v may be filled with a conductive material to form a via portion 133 to be described below.
The through-hole of the support member 11 may be filled with the encapsulant 12. The encapsulant 12 may encapsulate the support member 11 and the internal coil to substantially determine an appearance of the coil component. The encapsulant 12 may have a magnetic property, and may include a magnetic material and a resin. The magnetic material may be any material having the magnetic property, for example, ferrite or metal magnetic particles. The metal magnetic particles may include specifically iron (Fe), chromium (Cr), aluminum (Al), or nickel (Ni), but are not limited thereto.
The body 1 may include the support member 11 and the internal coil 13 supported by the support member 11 together with the encapsulant 12 and encapsulated by the encapsulant 12. The internal coil 13 may generally be configured in a spiral shape. The internal coil 13 may have a structure that may remove the unusable area X described with reference to
The internal coil 13 may include an upper coil 131 disposed on one surface of the support member 11 and a lower coil 132 disposed on the other surface of the support member. The upper and lower coils 131 and 132 may be connected to each other through the via portion 133. The via portion 133 may connect one end portion of the upper coil 131 and one end portion of the lower coil 132 to each other. For reference, the other end portion of the upper coil 131 that is not connected to the via portion 133 may be exposed to the first end surface of the body to thus be connected to a first external electrode 21, and the other end portion of the lower coil 132 that is not connected to the via portion 133 may be exposed to the second end surface of the body to be thus connected to a second external electrode 22.
Referring to
Referring to
In addition, a second conductive unit 131n′ of the plurality of conductive units constituting the upper coil may surround the first conductive unit, and may have a neck region in which a line width “a” thereof is narrowed, as compared to a width “b” of another region of the at least one of the plurality of conductive units. The neck region may be a region of one section in which the number of turns of the conductive units is X (X≥2). The another region may be a region of another section in which the number of turns of the conductive units is X−1. Formation of a protrusion portion in the outermost conductive unit of the internal coil may be prevented due to the neck region. A case in which the neck region is formed in the second conductive unit is illustrated, but the neck region is not is not limited thereto. That is, those skilled in the art may appropriately adjust a position of the neck region depending on the number of conductive units. In addition, only one neck region is not present, and a neck region may be included in each of the plurality of conductive units.
In each of the plurality of conductive units, linear portions and curved portions may be alternately disposed. The liner portions and the curved portions may be connected to each other to constitute one conductive unit.
The via portion 133 may be disposed in the curved portion of the linear portion and the curved portion of the conductive unit. This may be to significantly decrease a change in a line width of the conductive unit. Resultantly, a change in Rdc characteristics may be significantly decreased.
However, the via portion 133 is not limited to being formed at only a position illustrated in
Meanwhile, the lower coil 132 illustrated in
Referring to
Table 1 illustrates comparison results between characteristics of the coil component (Inventive Example 1) illustrated in
It may be appreciated from Table 1 that inductance Ls and Q characteristics are improved by 10% in Inventive Example 1 as compared to Comparative Example 1 including the same turns of the coil. In Inventive Example 1, it is considered that a magnetic material filling space of the core center of the internal coil is increased, such that an effect of an inductance increase is exhibited.
As set forth above, according to the exemplary embodiment in the present disclosure, the coil component in which the magnetic material filling space of the core center is secured as much as possible by changing a coil structure in the vicinity of the via may be provided.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims.
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Entry |
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First Office Action dated Sep. 24, 2020 in Chinese Patent Application No. 201910090362.7 (English translation). |
Number | Date | Country | |
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20190333684 A1 | Oct 2019 | US |