The present application claims the benefit of priority to Korean Patent Application No. 10-2019-0137554 filed on Oct. 31, 2019 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a coil component.
An inductor, a coil component, is a typical passive electronic component used in electronic devices, along with a resistor and a capacitor.
With higher performance and smaller sizes gradually implemented in the electronic devices, the number of electronic components used in the electronic devices increases and becomes smaller.
Accordingly, there is an increasing demand for a coupled coil component to reduce a mounting area of components. In order to increase efficiency of the components within the same size, mutual inductance may be increased to raise a coupling coefficient thereof, or leakage inductance may be increased to appropriately lower a coupling coefficient thereof. For example, in accordance with to the needs of those skilled in the art, a shape of a coil portion of a coupled inductor may be appropriately modified to control the mutual inductance and the leakage inductance, to appropriately adjust the coupling coefficients.
Meanwhile, when a plurality of coil portions in a variety of forms are arranged in a single coil component, a separation space between the plurality of coil portions may occur. Since the separation space between the coil portions may be relatively narrow such that it is difficult to fill a magnetic material or introduce plating liquid for forming the coil portions thereinto, a problem of deteriorating characteristics of the coil components in total may occur.
An aspect of the present disclosure is to provide a coil component capable of effectively controlling coupling inductance between a plurality of coil portions in a coupled inductor.
Another aspect of the present disclosure is to provide a coil component having improved DC resistance characteristics by increasing an area occupied by a plurality of coil portions between the plurality of coil portions in a coupled inductor.
According to an aspect of the present disclosure, a coil component includes a support substrate; a first coil portion and a second coil portion arranged on the support substrate and spaced apart from each other; and a body having a first core and a second core, spaced apart from the first core, wherein the first and second coil portions include a first coiled portion and a second coiled portion that include at least one turn about the first and second cores, respectively, and a first extension portion and a second extension portion extending from the first and second coiled portions, respectively, the first and second extension portions surrounding the first and second cores. The body further comprises spacing portions, facing each other, defined between the first coiled portion and the second coiled portion and spaced apart from the first and second cores. In the first and second extension portions, a line width of each of adjacent regions adjacent to the spacing portions is greater than a line width of a region except the adjacent regions.
According to another aspect of the present disclosure, a coil component includes a support substrate; a first coil portion and a second coil portion arranged on the support substrate and spaced apart from each other; and a body having a first core and a second core, spaced apart from the first core, wherein the first and second coil portions include a first coiled portion and a second coiled portion that include at least one turn about the first and second cores, respectively, and a first extension portion and a second extension portion extending from the first and second coiled portions, respectively, the first and second extension portions surrounding the first and second cores. Each of the first and second coil portions includes first and second coil layers disposed on one surface of the support substrate, the first and second coil layers sequentially disposed from the one surface of the support substrate. A line width of the first and second extension portions at a center region thereof in the first direction is greater than a line width of the first and second extension portions at a region except the center region. Aline width of the second coil layer at the center region is greater than a line width of the first coil layer at the center region.
According to still another aspect of the present disclosure, a coil component includes a support substrate; a first coil portion and a second coil portion arranged on the support substrate and spaced apart from each other; and a body having a first core and a second core, spaced apart from the first core, wherein the first and second coil portions include a first coiled portion and a second coiled portion that include at least one turnabout the first and second cores, respectively, and a first extension portion and a second extension portion extending from the first and second coiled portions, respectively, the first and second extension portions surrounding the first and second cores. Each of the first and second coil portions includes first and second coil layers disposed on one surface of the support substrate, the first and second coil layers sequentially disposed from the one surface of the support substrate. A line width of the first and second extension portions at a center region thereof in the first direction is greater than a line width of the first and second extension portions at a region except the center region. A line width of the second coil layer at the center region is substantially same as a line width of the first coil layer at the center region.
The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which:
The terms used in the description of the present disclosure are used to describe a specific embodiment, and are not intended to limit the present disclosure. A singular term includes a plural form unless otherwise indicated. The terms “include,” “comprise,” “is configured to,” etc. of the description of the present disclosure are used to indicate the presence of features, numbers, steps, operations, elements, parts, or combination thereof, and do not exclude the possibilities of combination or addition of one or more additional features, numbers, steps, operations, elements, parts, or combination thereof. Also, the terms “disposed on,” “positioned on,” and the like, may indicate that an element is positioned on or beneath an object, and does not necessarily mean that the element is positioned above the object with reference to a gravity direction.
The term “coupled to,” “combined to,” and the like, may not only indicate that elements are directly and physically in contact with each other, but also include the configuration in which another element is interposed between the elements such that the elements are also in contact with the other component.
Sizes and thicknesses of elements illustrated in the drawings are indicated as examples for ease of description, and the present disclosure are not limited thereto.
In the drawings, an X direction is a first direction or a length direction, a Y direction is a second direction or a width direction, and a Z direction is a third direction or a thickness direction.
A value used to describe a parameter such as a 1-D dimension of an element including, but not limited to, “length,” “width,” “thickness,” “diameter,” “distance,” “gap,” and/or “size,” a 2-D dimension of an element including, but not limited to, “area” and/or “size,” a 3-D dimension of an element including, but not limited to, “volume” and/or “size”, and a property of an element including, not limited to, “roughness,” “density,” “weight,” “weight ratio,” and/or “molar ratio” may be obtained by the method(s) and/or the tool(s) described in the present disclosure. The present disclosure, however, is not limited thereto. Other methods and/or tools appreciated by one of ordinary skill in the art, even if not described in the present disclosure, may also be used.
Hereinafter, a coil component according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components may be denoted by the same reference numerals, and overlapped descriptions will be omitted.
In electronic devices, various types of electronic components may be used, and various types of coil components may be used between the electronic components to remove noise, or for other purposes.
In other words, in electronic devices, a coil component may be used as a power inductor, a high frequency (HF) inductor, a general bead, a high frequency (GHz) bead, a common mode filter, and the like.
Referring to
The support substrate 100 may be embedded in the body 300 to be described later, and may be disposed to be spaced apart from the body 300 in the body 300. The support substrate 100 may include one surface and the other surface opposing the one surface, and may support the first and second coil portions 210 and 220 to be described later.
The support substrate 100 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed of an insulating material in which a reinforcing material such as a glass fiber or an inorganic filler is impregnated with such an insulating resin. For example, the support substrate 100 may be formed of an insulating material such as prepreg, Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine (BT) resin, a photoimageable dielectric (PID), and the like, but is not limited thereto.
As the inorganic filler, at least one or more selected from a group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, a mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) may be used.
When the support substrate 100 is formed of an insulating material including a reinforcing material, the support substrate 100 may provide better rigidity. When the support substrate 100 is formed of an insulating material not containing glass fibers, the support substrate 100 may be advantageous for reducing a thickness of the overall first and second coil portions 210 and 220. When the support substrate 100 is formed of an insulating material containing a photosensitive insulating resin, the number of processes for forming the first and second coil portions 210 and 220 may be reduced. Therefore, it may be advantageous in reducing production costs, and a fine via may be formed.
The body 300 may form an exterior of the coil component 1000 according to this embodiment, and may embed the first and second coil portions 210 and 220 therein.
The body 300 may be formed to have a hexahedral shape overall.
Referring to
The body 300 may include first and second cores 310 and 320 passing through the first and second coil portions 210 and 220 to be described later and spaced apart from each other. The first and second cores 310 and 320 may be formed by filling a magnetic composite sheet with through-holes of the first and second coil portions 210 and 220, but is not limited thereto.
The body 300 may further include spacing portions 3301 and 3302 arranged to face each other between first and second coiled portions 211 and 221, which will be described later, and spaced apart from the first and second cores 310 and 320. The spacing portions 3301 and 3302 may include a first spacing portion 3301 surrounded by the first coiled portion 211, the second coiled portion 221, and a second extension portion 222, and a second spacing portion 3302 surrounded by the first coiled portion 211, the second coiled portion 221, and a first extension portion 212. For example, the spacing portions 3301 and 3302 may refer to a space spaced apart between the plurality of coil portions 210 and 220 in a coupled inductor that arranges the plurality of coil portions 210 and 220 in various forms in a single coil component.
The body 300 may include a magnetic material and a resin. Specifically, the body 300 may be formed by stacking at least one magnetic composite sheet including the resin and the magnetic material dispersed in the resin, and then curing the magnetic composite sheet. The body 300 may have a structure other than the structure in which the magnetic material may be dispersed in the resin. For example, the body 300 may be made of a magnetic material such as ferrite.
The magnetic material may be, for example, a ferrite powder particle or a metal magnetic powder particle.
Examples of the ferrite powder particle may include at least one or more of spinel type ferrites such as Mg—Zn-based ferrite, Mn—Zn-based ferrite, Mn—Mg-based ferrite, Cu—Zn-based ferrite, Mg—Mn—Sr-based ferrite, Ni—Zn-based ferrite, and the like, hexagonal ferrites such as Ba—Zn-based ferrite, Ba—Mg-based ferrite, Ba—Ni-based ferrite, Ba—Co-based ferrite, Ba—Ni—Co-based ferrite, and the like, garnet type ferrites such as Y-based ferrite, and the like, and Li-based ferrites.
The metal magnetic powder particle may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic powder particle may be at least one or more of a pure iron powder, a Fe—Si-based alloy powder, a Fe—Si—Al-based alloy powder, a Fe—Ni-based alloy powder, a Fe—Ni—Mo-based alloy powder, a Fe—Ni—Mo—Cu-based alloy powder, a Fe—Co-based alloy powder, a Fe—Ni—Co-based alloy powder, a Fe—Cr-based alloy powder, a Fe—Cr—Si-based alloy powder, a Fe—Si—Cu—Nb-based alloy powder, a Fe—Ni—Cr-based alloy powder, and a Fe—Cr—Al-based alloy powder.
The metallic magnetic material may be amorphous or crystalline. For example, the metal magnetic powder particle may be a Fe—Si—B—Cr-based amorphous alloy powder, but is not limited thereto.
The ferrite powder and the metal magnetic powder particle may have an average diameter of about 0.1 μm to 30 μm, respectively, but are not limited thereto.
The body 300 may include two or more types of magnetic materials dispersed in a resin. In this case, the term “different types of magnetic material” means that the magnetic materials dispersed in the resin are distinguished from each other by average diameter, composition, crystallinity, and a shape.
The resin may include an epoxy, a polyimide, a liquid crystal polymer, or the like, in a single form or in combined forms, but is not limited thereto.
The first and second coil portions 210 and 220 may be arranged on the support substrate 100 to be spaced apart from each other, to express characteristics of the coil component.
The first and second coil portions 210 and 220 applied to this embodiment may include first and second coiled portions 211 and 221, first and second extension portions 212 and 222, first to fourth coil layers 2101, 2102, 2103, and 2104, and first and second lead-out portions 231 and 232.
Referring to
Referring to
Referring to
Referring to
In one example, the line width (W2) may refer to a maximum line width of the second coil layer 2102 adjacent to one of the spacing portions 3301 and 3302 in a cross-sectional view of the coil component in a width-thickness direction (e.g., Y-Z direction), and the line width (W1) may refer to a maximum line width of the first coil layer 2101 adjacent to one of the spacing portions 3301 and 3302 in the cross-sectional view of the coil component in the width-thickness direction.
In the related art, since spaces spaced between the coil portions 210 and 220 may be significantly narrow to fill the magnetic material or to inflow of the plating liquid for forming the coil portions 210 and 220, there may be a problem that characteristics of the coil component in total are deteriorated. In particular, since the inflow of the plating liquid for forming the coil portions 210 and 220 may be insufficient, growths of the coil portions 210 and 220 in height and width directions, in a region adjacent to the spacing portions 3301 and 3302, may be lowered, to generate a problem that DC resistance characteristics decrease. Therefore, in this embodiment, an area occupied by the coil portions 210 and 220 between the plurality of coil portions 210 and 220 may be increased by the above-described process to improve characteristics of the coil component 1000. Referring to
All dimensions described in the specification and indicated in the drawings may be measured by a standard method that will be apparent to and understood by one of ordinary skill in the art.
Referring to
The first and second coil layers 2101 and 2102 and the third and fourth coil layers 2103 and 2104 may be connected by vias (not illustrated), respectively.
The coil portions 210 and 220 and the vias (not illustrated) may include at least one conductive layer.
For example, when the first and second coil portions 210 and 220 and the vias (not illustrated) are formed on the one surface of the support substrate 100 by a plating process, the first and second coil portions 210 and 220 and the vias (not illustrated) may include a seed layer, such as an electroless plating layer or the like, and an electroplating layer, respectively. In this case, the electroplating layer may have a single layer structure or a multilayer structure. The electroplating layer of the multilayer structure may be formed in a conformal film structure in which one electroplating layer may be covered by the other electroplating layer, and may be only formed in a structure in which the other electroplating layer is stacked on one surface of anyone electroplating layer. The seed layers of the first and second coil portions 210 and 220 and the seed layers of the vias (not illustrated) may be integrally formed so as not to form a boundary therebetween, but are not limited thereto. The electroplating layers of the first and second coil portions 210 and 220 and the electroplating layers of the vias (not illustrated) may be integrally formed so as not to form a boundary therebetween, but are not limited thereto.
Each of the first and second coil portions 210 and 220, and the vias (not illustrated) may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto.
First to fourth external electrodes 510, 520, 530, and 540 may be arranged outside the body 300, and may be connected to the first and second lead-out portions 231 and 232, respectively. Referring to
In this embodiment, the first to fourth external electrodes 510, 520, 530, and 540 may be formed by forming first an insulating layer (not illustrated) on a surface of the body 300, except for a region in which the first to fourth external electrodes 510, 520, 530, and 540, and, then, placing the first to fourth external electrodes 510, 520, 530, and 540 in a region, other than a region in which the insulating layer (not illustrated) is disposed.
The first to fourth external electrodes 510, 520, 530, and 540 may be formed by using a paste including a metal having excellent electrical conductivity. For example, a conductive paste containing nickel (Ni), copper (Cu), tin (Sn), silver (Ag), or the like, as a single component, alloys thereof, or the like may be included. In addition, a plating layer may be further formed on each of the first to fourth external electrodes 510, 520, 530, and 540. In this case, the plating layer may include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, a nickel (Ni) layer and a tin (Sn) layer may be sequentially formed.
Referring to
Referring to
The present disclosure is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.
Therefore, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present disclosure described in the claims, which may be also within the scope of the present disclosure.
According to the present disclosure, a coil component may effectively control coupling inductance between a plurality of coil portions in a coupled inductor.
In addition, according to the present disclosure, a coil component may improve DC resistance characteristics of components in total by additionally arranging a plurality of coil portions between the plurality of coil portions in a coupled inductor.
While exemplary embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims.
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10-2019-0137554 | Oct 2019 | KR | national |
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Entry |
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Office Action issued in corresponding Korean Patent Application No. 10-2019-0137554 dated Sep. 18, 2020, with English translation. |
Number | Date | Country | |
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20210134515 A1 | May 2021 | US |