This application claims the benefit under 35 USC 119 (a) of Korean Patent Application No. 10-2020-0085404 filed on Jul. 10, 2020 in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.
The present disclosure relates to a coil component.
Inductors, as coil components, are representative passive electronic components used in electronic devices, along with resistors and capacitors.
As electronic devices have become increasingly better in terms of performance, and smaller, electronic components used in electronic devices are increasing in number and are being miniaturized in size.
Accordingly, there is an increasing demand for a coupled coil component to reduce the mounting area of the component. To increase the efficiency of components within the same size, a coupling coefficient may be increased by increasing the mutual inductance, or the coupling coefficient may be appropriately reduced by increasing leakage inductance. For example, it is necessary to appropriately adjust the coupling coefficient by adjusting the above-described mutual inductance and leakage inductance by appropriately modifying the shape of the coil portion of the coupled inductor according to the needs in the art.
As an example, as a method for adjusting the coupling coefficient without increasing the thickness of a component, there is a case of winding in a bifilar shape such that a plurality of adjacent conductors overlap each other.
Exemplary embodiments provide a coil component having a coupled inductor structure in which mutual inductance between coil portions may be effectively controlled.
According to an aspect of the present disclosure, a coil component includes a core portion, and first and second coil portions wound to form one or more turns on the core portion. The core portion includes a first core portion on which the first coil portion is wound, a second core portion on which the second coil portion is wound, and a third core portion which is disposed to be spaced apart from and between the first and second core portions and on which the first and second coil portions are wound to overlap each other.
The above and other aspects, features, and advantages of the present inventive concept will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which:
The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent to one of ordinary skill in the art. The sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent to one of ordinary skill in the art, with the exception of operations necessarily occurring in a certain order. Also, descriptions of functions and constructions that would be well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.
The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to one of ordinary skill in the art.
Herein, it is noted that use of the term “may” with respect to an embodiment or example, e.g., as to what an embodiment or example may include or implement, means that at least one embodiment or example exists in which such a feature is included or implemented while all examples and examples are not limited thereto.
Throughout the specification, when an element, such as a layer, region, or substrate, is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” “connected to,” or “coupled to” the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there can be no other elements intervening therebetween. In addition, throughout the specification, the term “on” means to be positioned above or below the target portion, and does not necessarily mean to be positioned above, based on the direction of gravity.
As used herein, the term “and/or” includes any one and any combination of any two or more of the associated listed items.
Although terms such as “first,” “second,” and “third” may be used herein to describe various members, components, regions, layers, or sections, these members, components, regions, layers, or sections are not to be limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in examples described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the examples.
Spatially relative terms such as “above,” “upper,” “below,” and “lower” may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being “above” or “upper” relative to another element will then be “below” or “lower” relative to the other element. Thus, the term “above” encompasses both the above and below orientations depending on the spatial orientation of the device. The device may also be oriented in other ways (for example, rotated 90 degrees or at other orientations), and the spatially relative terms used herein are to be interpreted accordingly.
The terminology used herein is for describing various examples only, and is not to be used to limit the disclosure. The articles “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “includes,” and “has” specify the presence of stated features, numbers, operations, members, elements, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, members, elements, and/or combinations thereof.
Due to manufacturing techniques and/or tolerances, variations of the shapes illustrated in the drawings may occur. Thus, the examples described herein are not limited to the specific shapes illustrated in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways as will be apparent after gaining an understanding of the disclosure of the present disclosure. Further, although the examples described herein have a variety of configurations, other configurations are possible as will be apparent after gaining an understanding of the disclosure of the present disclosure.
The drawings may not be to scale, and the relative sizes, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
Since the sizes and thicknesses of respective components illustrated in the drawings are arbitrarily illustrated for convenience of description, the present disclosure is not necessarily limited to the illustration of the drawings.
In the drawings, the X direction may be defined as a first direction or a length direction, the Y direction may be defined as a second direction or a width direction, and the Z direction may be defined as a third direction or a thickness direction.
Hereinafter, a coil component according to an embodiment will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are assigned the same reference numbers and overlapped descriptions thereof are omitted.
Various types of electronic components are used in electronic devices, and various types of coil components may be appropriately used between the electronic components, to remove noise or the like.
For example, coil components in electronic devices may be used as power inductors, high frequency inductors (HF inductors), general beads, high frequency beads (GHz beads), common mode filters, or the like.
Wound Coil Component
Referring to
The core portion 100 forms the exterior of the coil component 1000 according to the present embodiment, and may be formed in a toroidal shape forming a closed loop.
The core portion 100 includes a first core portion 110 on which the first coil portion 210 to be described later is wound, a second core portion 120 on which the second coil portion 220 is wound, and a third core portion 130, which is disposed between the first and second core portions 110 and 120 and on which the first and second coil portions 210 and 220 are wound to be adjacent to each other.
The core portion 100 may include a magnetic material and an insulating resin. Specifically, the core portion 100 may be formed by stacking one or more magnetic sheets including an insulating resin and a magnetic material dispersed in the insulating resin. The core portion 100 may also have a different structure, in addition to the structure in which a magnetic material is dispersed in an insulating resin. For example, the core portion 100 may be formed of a magnetic material such as ferrite.
The magnetic material may be ferrite or magnetic powder.
The ferrite may be at least one or more of, for example, Mg—Zn-based, Mn—Zn-based, Mn—Mg-based, Cu—Zn-based, Mg—Mn—Sr-based, Ni—Zn-based spinel ferrites, Ba—Zn-based, Ba—Mg-based, Ba—Ni-based, Ba—Co-based, Ba—Ni—Co-based hexagonal ferrites, and Y-based garnet-type ferrite and Li-based ferrite.
Magnetic metal powder may include at least one of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), nickel (Ni) and alloys thereof. For example, the magnetic metal powder may be at least one or more of pure iron powder, Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Ni alloy powder, Fe—Ni—Mo alloy powder, Fe—Ni—Mo—Cu alloy powder, Fe—Co alloy powder, Fe—Ni—Co alloy powder, Fe—Cr alloy powder, Fe—Cr—Si alloy powder, Fe—Si—Cu—Nb alloy powder, Fe—Ni—Cr alloy powder, and Fe— Cr—Al alloy powder.
The magnetic metal powder may be amorphous or crystalline. For example, the magnetic metal powder may be a Fe—Si—B—Cr-based amorphous alloy powder, but is not limited thereto.
Ferrite and magnetic metal powder may each have particles having an average diameter of about 0.1 μm to 30 μm, but are not limited thereto.
The core portion 100 may include two or more types of magnetic materials dispersed in an insulating resin. In this case, that the magnetic materials are of different types means that the magnetic materials dispersed in the insulating resin are distinguished from each other by any one of an average diameter, composition, crystallinity, and shape.
The insulating resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, or the like alone or as a mixture.
The coil portion 200 is wound on the core portion 100 to express characteristics of a coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil portion 200 may serve to stabilize power of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.
In this embodiment, the first and second coil portions 210 and 220 may be formed by winding a metal conductor such as a copper conductor in a spiral shape. As described later, an insulating layer (not illustrated) may be disposed on the surface of each of a plurality of turns of the first and second coil portions 210 and 220.
The coil portion 200 includes the first and second coil portions 210 and 220 wound to form at least one or more turns on the core portion 100. The first and second coil portions 210 and 220 wound on the third core portion 130 may be wound as bifilar windings. In this embodiment, the winding refers to a winding comprised of two adjacent insulated conductors. As an example of the aforementioned bifilar winding, the first and second coil portions 210 and 220 wound on the third core portion 130 may overlap each other and/or may be alternately disposed.
Referring to
Looking at the experimental results in Table 1, when the number of turns of the first and second coil portions 210 and 220 is the same as the number of turns of each of the first coil portion 210 or the second coil portion 220, it can be seen that the absolute value of the coupling coefficient is close to about 0.5. According to an embodiment of the present disclosure, by forming a region in which coil portions overlap in a single coil component, the coupling coefficient may be adjusted without increasing the size of the component.
Referring to
Referring to
Meanwhile, referring to
Referring to
Referring to
The second coil portion 220 has one end 221 wound on the third core portion 130 and the other end 222 extending to the second core portion 120 to forma turn in the second direction from one end.
The one end 211 of the first coil portion 210 is disposed between the one end 221 and the other end 222 of the second coil portion 220, and the one end 221 of the second coil portion 220 may be disposed between the one end 211 and the other end 212 of the first coil portion 210.
In this embodiment, the first and second coil portions 210 and 220 may be wound in the same direction or may be wound in different directions. In these cases, when the number of windings of the first and second coil portions 210 and 220 wound on the third core portion 130 is increased, the mutual inductance between the first and second coil portions 210 and 220 increases and the coupling coefficient may increase.
On the other hand, when the number of windings of the first and second coil portions 210 and 220 wound on the third core portion 130 is reduced, the mutual inductance between the first and second coil portions 210 and 220 decreases, resulting in a reduction in coupling coefficient. For example, by increasing or decreasing the number of windings of the first and second coil portions 210 and 220 wound on the third core portion 130, the coupling coefficient of the coil component may be easily adjusted.
In some embodiments, for example, referring to
In the case of related art coupled inductor, a coupling coefficient is adjusted using a thickness between upper and lower coil portions, but there is a problem of limitations in reducing the thickness of the coil portion, and a problem in that the size of the component increases when a distance between the coil portions is increased. In the case of this embodiment of the present disclosure, by forming a region in which respective coil portions overlap in a single coil portion, the coupling coefficient may be adjusted without increasing the size of the component on the X-Y plane having a relatively spatial margin.
The insulating layer (not illustrated) may be disposed along the surfaces of the coil portions 210 and 220. The insulating layer (not illustrated) is to protect and insulate the turns of the first and second coil portions 210 and 220, and may include a known insulating material such as parylene. Any insulating material included in the insulating layer (not illustrated) may be used, and there is no particular limitation. The insulating layer (not illustrated) may be formed by a method such as vapor deposition, but is not limited thereto.
A coil component according to a second embodiment is different from the coil component according to the first embodiment in that a coil portion 200 is formed by plating. Therefore, in describing the present embodiment, only the coil portion 200, different from the first embodiment, will be described. For the rest of the configuration of the present embodiment, the description in the first embodiment may be applied as it is.
First and second coil portions 210 and 220 may be formed of a seed layer and at least one plating layer formed on the seed layer.
For example, when the first and second coil portions 210 and 220 are formed by plating on one surface of the core portion 100, the first and second coil portions 210 and 220 may include a seed layer such as an electroless plating layer or the like, and an electroplating layer. In this case, the electroplating layer may have a single-layer structure or a multilayer structure. The electroplating layer of a multilayer structure may be formed to have a conformal film structure in which one electroplating layer is covered by another electroplating layer, or may be formed to have a shape in which another electroplating layer is stacked on only one surface of one electroplating layer. The first and second coil portions 210 and 220 may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), and titanium (Ti) or alloys thereof, but the material thereof is not limited thereto.
As set forth above, according to an exemplary embodiment, by winding in a bifilar shape such that a plurality of adjacent conductors overlap each other, the coupling coefficient may be adjusted to a required value without increasing the thickness of a component.
While this disclosure includes specific examples, it will be apparent to one of ordinary skill in the art that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed to have a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.
Number | Date | Country | Kind |
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10-2020-0085404 | Jul 2020 | KR | national |
Number | Name | Date | Kind |
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3238484 | Dacey | Mar 1966 | A |
3944937 | Fujisawa | Mar 1976 | A |
20110279214 | Lee | Nov 2011 | A1 |
Number | Date | Country |
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4350268 | Oct 2009 | JP |
2011-199098 | Oct 2011 | JP |
Entry |
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Jong-Pil Lee et al., “Analysis and Design of Coupled Inductors for Two-Phase Interleaved DC-DC Converters”, Journal of Power Electronics, vol. 13, No. 3, pp. 339-348, May 2013. |
ELEC 24409: Circuit Theory 2, Dr. Kalyana Veluvolu. |
Number | Date | Country | |
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20220013270 A1 | Jan 2022 | US |